SUBSTRATE CARRIER WITH INTEGRATED ELECTROSTATIC CHUCK

• US 20160211162A1
• Filed: 09/18/2014
• Published: 07/21/2016
• Est. Priority Date: 09/20/2013
• Status: Active Grant

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: WHITE, John M., WANG, Zuoqian
• Granted Patent: US 10,304,713 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: C23C 14/042 using masks
• CPC Class Codes: C23C 14/12 Organic material
• CPC Class Codes: C23C 14/24 Vacuum evaporation
• CPC Class Codes: C23C 14/50 Substrate holders
• CPC Class Codes: C23C 14/541 Heating or cooling of the substrates
• CPC Class Codes: C23C 14/562 for coating elongated substrates
• CPC Class Codes: C23C 16/042 using masks
• CPC Class Codes: C23C 16/345 Silicon nitride
• CPC Class Codes: C23C 16/401 containing silicon
• CPC Class Codes: C23C 16/45578 Elongated nozzles, tubes with holes
• CPC Class Codes: C23C 16/4587 the substrate being supported substantially vertically
• CPC Class Codes: C23C 16/463 Cooling of the substrate
• CPC Class Codes: C23C 16/545 for coating elongated substrates
• CPC Class Codes: F26B 3/00 Drying solid materials or objects by processes involving the application of heat in specific machines or apparatus F26B9/00 - F26B19/00
• CPC Class Codes: F27B 1/08 heated otherwise than by solid fuel mixed with charge
• CPC Class Codes: H01L 21/67109 mainly by convection
• CPC Class Codes: H01L 21/6732 Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
• CPC Class Codes: H01L 21/67706 Mechanical details, e.g. roller, belt H01L21/67709 takes precedence
• CPC Class Codes: H01L 21/67712 the substrate being handled substantially vertically
• CPC Class Codes: H01L 21/67718 Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
• CPC Class Codes: H01L 21/67742 : Mechanical parts of transfer devices robots in general in B25J
• CPC Class Codes: H01L 21/6833 : Details of electrostatic chucks
• CPC Class Codes: H05B 3/03 : Electrodes

Abstract

A substrate carrier adapted to use in a processing system includes an electrode assembly and a support base. The electrode assembly is configured to generate an electrostatic chucking force for securing a substrate to the substrate carrier. The support base has a heating/cooling reservoir formed therein. The electrode assembly and the support base form an unitary body configured for transport within a processing system. A quick disconnect is coupled to the body and configured to trap a heat regulating medium in the reservoir heating/cooling reservoir when the body is decoupled from a source of heat regulating medium.

Claims

1. A substrate carrier adapted to use in a processing system, the substrate carrier comprising:

a support base;

an electrode assembly having interleaved electrode fingers formed therein disposed on the support base; and

a connector coupled to the support base configured to electrically disconnect a power source to the electrode assembly, the support base and the electrode assembly comprising a unitary body adapted to be transported within a processing system.

2. The substrate carrier of claim 1, wherein the connector comprises:

at least one of a contact pad, a plug and socket connector, a banana connector, a spade connector and a screw terminal.

3. The substrate carrier of claim 1, further comprising:

an energy storage device on-board the substrate carrier and coupled to the electrode assembly.

4. The substrate carrier of claim 3, wherein the energy storage device is electrically coupled to the electrode assembly and the connector.

5. The substrate carrier of claim 1 further comprising:

a rail extending from a side of the support base.

6. The substrate carrier of claim 5, wherein the rail is configured to interface with a drive system adapted to transport the body through the system.

7. The substrate carrier of claim 1, wherein the electrode assembly comprises:

an array of independently controllable electrode assemblies.

8. The substrate carrier of claim 1, wherein the electrode assembly comprises:

a plurality of distributed electrodes.

9. The substrate carrier of claim 8, wherein the distributed electrodes further comprises:

at least a first electrode interleaving with a second electrode.

10. The substrate carrier of claim 7, further comprising:

a controller on-board the substrate carrier, the controller adapted to control a state of each electrode assembly.

11. The substrate carrier of claim 8, wherein the energy storage device comprises:

at least one of a battery, capacitor, supercapacitor and ultrabattery.

12. The substrate carrier of claim 1 further comprising:

a reservoir disposed in the support base.

13. The substrate carrier of claim 12, wherein the reservoir is coupled to a connector having a check or isolation valve.

14. The substrate carrier of claim 1 further comprising:

A connector for providing gas to a surface of the substrate carrier.

15. A processing system, comprising:

(a) a substrate carrier comprising;

a support base;

a plurality of electrode assemblies disposed on the support base; and

a connector coupled to the support base configured to electrically disconnect a power source to the electrode assembly, the support base and the electrode assembly comprising a unitary body adapted to be transported within a processing system.

(b) a processing chamber adapted to receive the substrate carrier having a substrate electrostatically coupled thereto; and

(c) a mating connector operable to automatically couple to the connector.

16. The processing system of claim 15, wherein the mating connector is located in at least one of a loading system, a load lock chamber and a processing chamber.

17. The processing system of claim 15, wherein the substrate carrier further comprises:

a controller on-board the substrate carrier, the controller adapted to control a state of each electrode assembly.

18. The processing system of claim 15, further comprising:

an energy storage device on-board the substrate carrier and coupled to the electrode assembly.

19. A method for transporting a substrate in a processing system, the method comprising:

transferring a substrate onto a substrate carrier;

electrostatically chucking the substrate to the substrate carrier by powering an electrode assembly electrically coupled to a power source;

electrically disconnecting the power source from the substrate carrier when the substrate is chucked on the substrate carrier; and

transferring the substrate while electrostatically chucked to the substrate carrier in a substantially vertical orientation.

20. The method of claim 20, wherein electrically disconnecting the power source further comprises:

automatically disconnecting the power source from the substrate carrier in a processing chamber or in a substrate loading station.