CAMERA FOR VEHICLE VISION SYSTEM

• US 20160212847A1
• Filed: 03/29/2016
• Published: 07/21/2016
• Est. Priority Date: 11/19/2012
• Status: Active Grant

• Current Assignee: Magna Electronics Incorporated (Magna International Incorporated)
• Original Assignee: Magna Electronics Incorporated (Magna International Incorporated)
• Inventors: Sigle, Marc
• Granted Patent: US 9,693,454 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: B60R 2300/8066 for monitoring rearward traffic
• CPC Class Codes: G06V 20/58 Recognition of moving objects or obstacles, e.g. vehicles or pedestrians; Recognition of traffic objects, e.g. traffic signs, traffic lights or roads
• CPC Class Codes: H04N 7/183 for receiving images from a single remote source
• CPC Class Codes: H05K 1/111 Pads for surface mounting, e.g. lay-out
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/09381 Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component notches in edge pads H05K2201/09181
• CPC Class Codes: H05K 2201/09418 Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

A vehicle vision system includes at least one camera operable to capture image data, and an image processor chip operable to process image data captured by the at least one camera for detecting at least one of a vehicle and a pedestrian present in the field of view of the at least one camera. The image processor chip is surface mounted at a mounting location of a circuit board that has a plurality of solder pads established thereat that correspond to a plurality of respective solder points of the image processor chip. The plurality of solder pads include elongated solder pads having respective longitudinal axes. The mounting location includes first, second, third and fourth quadrants. The longitudinal axes of elongated solder pads disposed at the first quadrant are aligned different from the longitudinal axes of elongated solder pads disposed at the second quadrant.

Claims

1. A vehicle vision system, said vehicle vision system comprising:

at least one camera disposed at a vehicle equipped with said vision system;

said at least one camera operable to capture image data and having a field of view exterior of the equipped vehicle;

an image processor chip operable to process image data captured by said at least one camera for detecting at least one of a vehicle and a pedestrian present in the field of view of said at least one camera;

said image processor chip surface mounted at a mounting location of a circuit board;

said mounting location having a plurality of solder pads established thereat;

said plurality of solder pads corresponding to a plurality of respective solder points of said image processor chip;

wherein said plurality of solder pads comprises elongated solder pads and wherein each elongated solder pad has a longitudinal axis;

wherein said mounting location comprises a first quadrant, a second quadrant, a third quadrant and a fourth quadrant;

wherein said first and fourth quadrants diagonally oppose one another

wherein said second and third quadrants diagonally oppose one another;

wherein said first quadrant is laterally adjacent said second quadrant;

wherein said third quadrant is laterally adjacent said fourth quadrant;

wherein said third quadrant is below said first quadrant;

wherein said fourth quadrant is below said second quadrant; and

wherein the longitudinal axes of elongated solder pads disposed at said first quadrant are aligned different from the longitudinal axes of elongated solder pads disposed at said second quadrant.

2. The vehicle vision system of claim 1, wherein the longitudinal axes of elongated solder pads disposed at said first quadrant are aligned different from the longitudinal axes of elongated solder pads disposed at said third quadrant.

3. The vehicle vision system of claim 2, wherein the longitudinal axes of elongated solder pads disposed at said first quadrant are aligned similar to the longitudinal axes of elongated solder pads disposed at said fourth quadrant.

4. The vehicle vision system of claim 3, wherein said elongated solder pads are generally tear-drop shaped and have a wide portion and a narrower portion, and wherein said tear-drop shaped solder pads are arranged with their wider portion pointing generally towards a center area of said mounting location of said circuit board or generally away from the center area of said mounting location of said circuit board.

5. The vehicle vision system of claim 1, wherein said elongated solder pads each comprise a narrower end and a wider end, and wherein said elongated solder pads are arranged so as to point generally towards or generally away from a center area of said mounting location at said circuit board.

6. The vehicle vision system of claim 1, wherein said elongated solder pads are disposed as rows and columns of solder pads at each of the respective quadrants.

7. The vehicle vision system of claim 1, wherein elongated solder pads of said first quadrant of said mounting location are generally orthogonal to elongated solder pads of said second quadrant of said mounting location, and wherein elongated solder pads of said first quadrant are generally parallel to elongated solder pads of said fourth quadrant of said mounting location, and wherein elongated solder pads of said second quadrant are generally parallel to elongated solder pads of said third quadrant of said mounting location, and wherein said first and fourth quadrants are at opposite corner regions of said mounting location and wherein said second and third quadrants are at opposite corner regions of said mounting location.

8. The vehicle vision system of claim 1, wherein responsive at least in part to processing by said image processor chip of image data captured by said at least one camera, a vehicle present in the field of view of said at least one camera is detected.

9. The vehicle vision system of claim 8, wherein an alert is generated in order to enhance awareness by a driver of the equipped vehicle to the presence of the detected vehicle in the field of view of said at least one camera.

10. The vehicle vision system of claim 1, wherein, responsive at least in part to processing by said image processor chip of image data captured by said at least one camera, a pedestrian present in the field of view of said at least one camera is detected.

11. The vehicle vision system of claim 10, wherein an image displayed on a display device of the equipped vehicle is enhanced to enhance awareness by a driver of the equipped vehicle to the presence of the detected pedestrian in the field of view of said at least one camera.

12. A vehicle vision system, said vehicle vision system comprising:

at least one camera disposed at a vehicle equipped with said vision system;

said at least one camera operable to capture image data and having a field of view exterior of the equipped vehicle;

said at least one camera comprising a lens and an imaging array, wherein said imaging array comprises a plurality of photosensor elements arranged in at least 640 columns and 480 rows;

an image processor chip operable to process image data captured by said at least one camera for detecting at least one of a vehicle and a pedestrian present in the field of view of said at least one camera;

said image processor chip surface mounted at a mounting location of a circuit board;

said mounting location having a plurality of solder pads established thereat;

said plurality of solder pads corresponding to a plurality of respective solder points of said image processor chip;

wherein said plurality of solder pads comprises elongated solder pads and wherein each elongated solder pad has a longitudinal axis;

wherein said mounting location comprises a first quadrant, a second quadrant, a third quadrant and a fourth quadrant;

wherein said first and fourth quadrants diagonally oppose one another;

wherein said second and third quadrants diagonally oppose one another;

wherein said first quadrant is laterally adjacent said second quadrant;

wherein said third quadrant is laterally adjacent said fourth quadrant;

wherein said third quadrant is below said first quadrant;

wherein said fourth quadrant is below said second quadrant;

wherein the longitudinal axes of elongated solder pads disposed at said first quadrant are aligned different from the longitudinal axes of elongated solder pads disposed at said second quadrant; and

wherein, responsive at least in part to processing by said image processor chip of image data captured by said at least one camera, a vehicle present in the field of view of said at least one camera is detected.

13. The vehicle vision system of claim 12, wherein an alert is generated in order to enhance awareness by a driver of the equipped vehicle to the presence of the detected vehicle in the field of view of said at least one camera.

14. The vehicle vision system of claim 13, wherein the longitudinal axes of elongated solder pads disposed at said first quadrant are aligned different from the longitudinal axes of elongated solder pads disposed at said third quadrant, and wherein the longitudinal axes of elongated solder pads disposed at said first quadrant are aligned similar to the longitudinal axes of elongated solder pads disposed at said fourth quadrant.

15. The vehicle vision system of claim 14, wherein said imaging array comprises a megapixel imaging array.

16. A vehicle vision system, said vehicle vision system comprising:

at least one camera disposed at a vehicle equipped with said vision system;

said at least one camera operable to capture image data and having a field of view exterior of the equipped vehicle;

said at least one camera comprising a lens and an imaging array, wherein said imaging array comprises a plurality of photosensor elements arranged in at least 640 columns and 480 rows;

an image processor chip operable to process image data captured by said at least one camera for detecting at least one of a vehicle and a pedestrian present in the field of view of said at least one camera;

said image processor chip surface mounted at a mounting location of a circuit board;

said mounting location having a plurality of solder pads established thereat;

said plurality of solder pads corresponding to a plurality of respective solder points of said image processor chip;

wherein said plurality of solder pads comprises elongated solder pads and wherein each elongated solder pad has a longitudinal axis;

wherein said mounting location comprises a first quadrant, a second quadrant, a third quadrant and a fourth quadrant;

wherein said first and fourth quadrants diagonally oppose one another;

wherein said second and third quadrants diagonally oppose one another;

wherein said first quadrant is laterally adjacent said second quadrant;

wherein said third quadrant is laterally adjacent said fourth quadrant;

wherein said third quadrant is below said first quadrant;

wherein said fourth quadrant is below said second quadrant;

wherein the longitudinal axes of elongated solder pads disposed at said first quadrant are aligned different from the longitudinal axes of elongated solder pads disposed at said second quadrant; and

wherein, responsive at least in part to processing by said image processor chip of image data captured by said at least one camera, a pedestrian present in the field of view of said at least one camera is detected.

17. The vehicle vision system of claim 16, wherein an image displayed on a display device of the equipped vehicle is enhanced to enhance awareness by a driver of the equipped vehicle to the presence of the detected pedestrian in the field of view of said at least one camera.

18. The vehicle vision system of claim 16, wherein said imaging array comprises a megapixel imaging array.

19. The vehicle vision system of claim 18, wherein the longitudinal axes of elongated solder pads disposed at said first quadrant are aligned different from the longitudinal axes of elongated solder pads disposed at said third quadrant, and wherein the longitudinal axes of elongated solder pads disposed at said first quadrant are aligned similar to the longitudinal axes of elongated solder pads disposed at said fourth quadrant.

20. The vehicle vision system of claim 16, wherein said elongated solder pads are disposed as rows and columns of solder pads at each of the respective quadrants.