ADHESIVE AGENT COMPOSITION FOR MULTILAYER SEMICONDUCTOR

• US 20160215183A1
• Filed: 09/25/2014
• Published: 07/28/2016
• Est. Priority Date: 09/27/2013
• Status: Active Grant

• Current Assignee: Daicel Corporation
• Original Assignee: Daicel Corporation
• Inventors: TANAKA, Hiroki, TSUTSUMI, Kiyoharu, ITO, Yousuke, TSUJI, Naoko, NAKAGUCHI, Katsuhiro
• Granted Patent: US 10,047,257 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: C08G 59/68 characterised by the catalysts used
• CPC Class Codes: C09J 163/00 Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
• CPC Class Codes: C09J 2203/326 for bonding electronic components such as wafers, chips or semiconductors
• CPC Class Codes: C09J 2463/00 Presence of epoxy resin
• CPC Class Codes: C09J 7/35 Heat-activated
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/83 using a layer connector
• CPC Class Codes: H01L 2224/83005 being a temporary or sacrificial substrate
• CPC Class Codes: H01L 2224/83091 Under pressure
• CPC Class Codes: H01L 2224/83092 Atmospheric pressure
• CPC Class Codes: H01L 2224/83097 Heating
• CPC Class Codes: H01L 2224/83191 wherein the layer connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/83203 Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
• CPC Class Codes: H01L 2224/83855 Hardening the adhesive by curing, i.e. thermosetting
• CPC Class Codes: H01L 2224/9202 Forming additional connectors after the connecting process
• CPC Class Codes: H01L 2224/94 at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
• CPC Class Codes: H01L 23/293 Organic, e.g. plastic
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 25/065 : the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 25/0657 : Stacked arrangements of devices
• CPC Class Codes: H01L 25/07 : the devices being of a type provided for in group H01L29/00
• CPC Class Codes: H01L 25/18 : the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 25/50 : Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 : Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

Provided is an adhesive composition for multilayer semiconductors. The adhesive composition gives, when applied and dried by heating, an adhesive layer that has approximately no adhesiveness at a temperature lower than 50° C., but, when heated at such a temperature as to less cause damage to semiconductor chips, offers adhesiveness and is rapidly cured thereafter. This adhesive composition for multilayer semiconductors includes a polymerizable compound (A), at least one of a cationic-polymerization initiator (B1) and an anionic-polymerization initiator (B2), and a solvent (C). The polymerizable compound (A) contains 80% by weight or more of an epoxide having a softening point or melting point of 50° C. or higher. The cationic-polymerization initiator (B1) gives a composition having a thermal curing time of 3.5 minutes or longer at 130° C., where the composition contains 1 part by weight of the cationic-polymerization initiator (B1) and 100 parts by weight of 3,4-epoxycyclohexylmethyl (3,4-epoxy)cyclohexanecarboxylate. The anionic-polymerization initiator (B2) gives a composition having a thermal curing time of 3.5 minutes or longer at 130° C., where the composition contains 1 part by weight of the anionic-polymerization initiator (B2) and 100 parts by weight of bisphenol-A diglycidyl ether.

Claims

1. An adhesive composition for multilayer semiconductors, the adhesive composition comprising:

a polymerizable compound (A);

a polymerization initiator (B) comprising at least one polymerization initiator selected from a cationic-polymerization initiator (B1) and an anionic-polymerization initiator (B2); and

a solvent (C),

the polymerizable compound (A) comprising an epoxide having a softening point or melting point (in conformity with JIS K 0064;

1992) of 50°

C. or higher in an amount of 80% by weight or more of a total amount of the polymerizable compound,

the cationic-polymerization initiator (B1) giving a composition having a thermal curing time (in conformity with JIS K 5909;

1994) of 3.5 minutes or longer at 130°

C., the composition containing 1 part by weight of the cationic-polymerization initiator (B1) and 100 parts by weight of 3,4-epoxycyclohexylmethyl (3,4-epoxy)cyclohexanecarboxylate,

the anionic-polymerization initiator (B2) giving a composition having a thermal curing time (in conformity with JIS K 5909;

1994) of 3.5 minutes or longer at 130°

C., the composition containing 1 part by weight of the anionic-polymerization initiator (B2) and 100 parts by weight of bisphenol-A diglycidyl ether.

2. The adhesive composition according to claim 1 for multilayer semiconductors,

wherein the polymerizable compound (A) comprises a compound represented by Formula (1-1):

3. The adhesive composition according to claim 2 for multilayer semiconductors,

wherein the polymerizable compound (A) further comprises a compound represented by Formula (7-1):

4. The adhesive composition according to claim 3 for multilayer semiconductors,

wherein the organic group containing an oxirane ring structure is a glycidyl group.

5. The adhesive composition according to claim 3 for multilayer semiconductors,

wherein the compound represented by Formula (7-1) is triglycidyl isocyanurate.

6. The adhesive composition according to claim 1 for multilayer semiconductors,

wherein the adhesive composition comprises the cationic-polymerization initiator (B1) as the polymerization initiator (B), and

wherein the adhesive composition further comprises

a cationic-polymerization stabilizer (D) in an amount of 0.1% by weight or more relative to the cationic-polymerization initiator (B1).

7. The adhesive composition according to claim 1 for multilayer semiconductors, the adhesive composition further comprising

a silane coupling agent (E).

8. An adhesive sheet for multilayer semiconductors, the adhesive sheet prepared by applying and drying the adhesive composition according to claim 1 for multilayer semiconductors.

9. A semiconductor wafer with adhesive layer, structurally comprising:

a semiconductor wafer; and

an adhesive layer disposed on or over the semiconductor wafer, the adhesive layer derived from the adhesive composition according to claim 1 for multilayer semiconductors.

10. A semiconductor chip with adhesive layer, structurally comprising:

a semiconductor chip; and

an adhesive layer disposed on or over the semiconductor chip, the adhesive layer derived from the adhesive composition according to claim 1 for multilayer semiconductors.

11. A method for producing a three-dimensional multilayer semiconductor, the method comprising

stacking semiconductors using the adhesive composition according to claim 1 for multilayer semiconductors.

12. The adhesive composition according to claim 2 for multilayer semiconductors,

wherein the adhesive composition comprises the cationic-polymerization initiator (B1) as the polymerization initiator (B), and

wherein the adhesive composition further comprises

a cationic-polymerization stabilizer (D) in an amount of 0.1% by weight or more relative to the cationic-polymerization initiator (B1).

13. The adhesive composition according to claim 3 for multilayer semiconductors,

wherein the adhesive composition comprises the cationic-polymerization initiator (B1) as the polymerization initiator (B), and

wherein the adhesive composition further comprises

a cationic-polymerization stabilizer (D) in an amount of 0.1% by weight or more relative to the cationic-polymerization initiator (B1).

14. The adhesive composition according to claim 4 for multilayer semiconductors,

wherein the adhesive composition comprises the cationic-polymerization initiator (B1) as the polymerization initiator (B), and

wherein the adhesive composition further comprises

a cationic-polymerization stabilizer (D) in an amount of 0.1% by weight or more relative to the cationic-polymerization initiator (B1).

15. The adhesive composition according to claim 5 for multilayer semiconductors,

wherein the adhesive composition comprises the cationic-polymerization initiator (B1) as the polymerization initiator (B), and

wherein the adhesive composition further comprises

a cationic-polymerization stabilizer (D) in an amount of 0.1% by weight or more relative to the cationic-polymerization initiator (B1).

16. The adhesive composition according to claim 2 for multilayer semiconductors, the adhesive composition further comprising

a silane coupling agent (E).

17. The adhesive composition according to claim 3 for multilayer semiconductors, the adhesive composition further comprising

a silane coupling agent (E).

18. The adhesive composition according to claim 4 for multilayer semiconductors, the adhesive composition further comprising

a silane coupling agent (E).

19. The adhesive composition according to claim 5 for multilayer semiconductors, the adhesive composition further comprising

a silane coupling agent (E).

20. The adhesive composition according to claim 6 for multilayer semiconductors, the adhesive composition further comprising

a silane coupling agent (E).