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PACKAGED OPTO-ELECTRONIC MODULE

  • US 20160216445A1
  • Filed: 01/26/2015
  • Published: 07/28/2016
  • Est. Priority Date: 01/26/2015
  • Status: Active Grant
First Claim
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1. A chip package, comprising:

  • an integrated circuit having a front surface with first integrated-circuit connector pads and second integrated-circuit connector pads, wherein the integrated circuit is configured to;

    modulate data, communicate data, and serialize/deserialize data;

    first integrated-circuit electrical connectors electrically coupled to the first integrated-circuit connector pads;

    an interposer having a bottom surface and a top surface, facing the front surface of the integrated circuit, with first interposer connector pads electrically coupled to the first integrated-circuit electrical connectors;

    second integrated-circuit electrical connectors electrically coupled to the second integrated-circuit connector pads;

    an optical integrated circuit having a bottom surface, facing the top surface of the interposer, and a top surface, facing the front surface of the integrated circuit, with first optical-integrated-circuit connector pads electrically coupled to the second integrated-circuit electrical connectors, wherein the optical integrated circuit is configured to communicate optical signals;

    an optical-fiber receptacle having a first surface and a second surface, wherein the first surface is mechanically and optically coupled to the top surface of the optical integrated circuit; and

    an optical-fiber connector mechanically and optically coupled to the second surface of the optical-fiber receptacle.

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