PACKAGED OPTO-ELECTRONIC MODULE
First Claim
1. A chip package, comprising:
- an integrated circuit having a front surface with first integrated-circuit connector pads and second integrated-circuit connector pads, wherein the integrated circuit is configured to;
modulate data, communicate data, and serialize/deserialize data;
first integrated-circuit electrical connectors electrically coupled to the first integrated-circuit connector pads;
an interposer having a bottom surface and a top surface, facing the front surface of the integrated circuit, with first interposer connector pads electrically coupled to the first integrated-circuit electrical connectors;
second integrated-circuit electrical connectors electrically coupled to the second integrated-circuit connector pads;
an optical integrated circuit having a bottom surface, facing the top surface of the interposer, and a top surface, facing the front surface of the integrated circuit, with first optical-integrated-circuit connector pads electrically coupled to the second integrated-circuit electrical connectors, wherein the optical integrated circuit is configured to communicate optical signals;
an optical-fiber receptacle having a first surface and a second surface, wherein the first surface is mechanically and optically coupled to the top surface of the optical integrated circuit; and
an optical-fiber connector mechanically and optically coupled to the second surface of the optical-fiber receptacle.
1 Assignment
0 Petitions
Accused Products
Abstract
A chip package includes an optical integrated circuit (such as a hybrid integrated circuit) and an integrated circuit that are proximate to each other in the chip package. The integrated circuit includes electrical circuits that modulate data, communicate data, and serialize/deserialize data, and the optical integrated circuit communicates optical signals with very high bandwidth. Moreover, a front surface of the integrated circuit is electrically coupled to a top surface of an interposer, and a top surface of the integrated circuit is electrically coupled to a front surface of the optical integrated circuit. Furthermore, a bottom surface of the optical integrated circuit faces the top surface of the interposer, and the front surface of the optical integrated circuit is optically coupled to an optical-fiber receptacle, which in turn is optically coupled to an optical-fiber connector.
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Citations
20 Claims
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1. A chip package, comprising:
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an integrated circuit having a front surface with first integrated-circuit connector pads and second integrated-circuit connector pads, wherein the integrated circuit is configured to;
modulate data, communicate data, and serialize/deserialize data;first integrated-circuit electrical connectors electrically coupled to the first integrated-circuit connector pads; an interposer having a bottom surface and a top surface, facing the front surface of the integrated circuit, with first interposer connector pads electrically coupled to the first integrated-circuit electrical connectors; second integrated-circuit electrical connectors electrically coupled to the second integrated-circuit connector pads; an optical integrated circuit having a bottom surface, facing the top surface of the interposer, and a top surface, facing the front surface of the integrated circuit, with first optical-integrated-circuit connector pads electrically coupled to the second integrated-circuit electrical connectors, wherein the optical integrated circuit is configured to communicate optical signals; an optical-fiber receptacle having a first surface and a second surface, wherein the first surface is mechanically and optically coupled to the top surface of the optical integrated circuit; and an optical-fiber connector mechanically and optically coupled to the second surface of the optical-fiber receptacle. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A system, comprising:
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a processor; a memory coupled to the processor; and a chip package, wherein the chip package includes; an integrated circuit having a front surface with first integrated-circuit connector pads and second integrated-circuit connector pads, wherein the integrated circuit is configured to;
modulate data, communicate data, and serialize/deserialize data;first integrated-circuit electrical connectors electrically coupled to the first integrated-circuit connector pads; an interposer having a bottom surface and a top surface, facing the front surface of the integrated circuit, with first interposer connector pads electrically coupled to the first integrated-circuit electrical connectors; second integrated-circuit electrical connectors electrically coupled to the second integrated-circuit connector pads; an optical integrated circuit having a bottom surface, facing the top surface of the interposer, and a top surface, facing the front surface of the integrated circuit, with first optical-integrated-circuit connector pads electrically coupled to the second integrated-circuit electrical connectors, wherein the optical integrated circuit is configured to communicate optical signals; an optical-fiber receptacle having a first surface and a second surface, wherein the first surface is mechanically and optically coupled to the top surface of the optical integrated circuit; and an optical-fiber connector mechanically and optically coupled to the second surface of the optical-fiber receptacle; - View Dependent Claims (16, 17, 18, 19)
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20. A method for communicating data between an integrated circuit and an optical integrated circuit, wherein the method comprises:
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coupling digital electrical signals from interposer connection pads on a top surface of an interposer to first integrated-circuit connector pads on a front surface of the integrated circuit; converting the digital electrical signals to analog electrical signals; coupling the analog electrical signals from second integrated-circuit connector pads on the front surface of the integrated circuit to optical-integrated-circuit connector pads on a top surface of the optical integrated circuit; generating optical signals based on the analog electrical signals; and communicating the optical signals to an optical fiber via an optical-fiber receptacle and an optical-fiber connector.
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Specification