SMART CARD AND METHOD OF MANUFACTURING SMART CARD
First Claim
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1. A smart card comprising:
- a substrate comprising a front side and a back side and having a first height between the front side and the back side;
a circuit layer disposed on the front side of the substrate and including an analog block that includes a plurality of analog circuits and a digital block that includes a plurality of digital circuits; and
at least one trench capacitor disposed in the substrate and having a second height extending from the front side of the substrate, wherein the second height is smaller than the first height and may be modified due to a back side attack on the substrate before other circuitry on the smart card is affected by the back side attack.
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Abstract
An integrated circuit includes a detector circuit including a sensor configured to sense an alteration to a physical characteristic of a substrate and to generate an alarm signal indicating such alteration and a circuit configured to respond to the generation of the alarm signal by implementing countermeasures. A smart card may include such a circuit to counteract a back side attack.
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Citations
21 Claims
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1. A smart card comprising:
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a substrate comprising a front side and a back side and having a first height between the front side and the back side; a circuit layer disposed on the front side of the substrate and including an analog block that includes a plurality of analog circuits and a digital block that includes a plurality of digital circuits; and at least one trench capacitor disposed in the substrate and having a second height extending from the front side of the substrate, wherein the second height is smaller than the first height and may be modified due to a back side attack on the substrate before other circuitry on the smart card is affected by the back side attack. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A smart card comprising:
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a substrate; and at least one sensor including at least one trench capacitor that detects a back side attack on the substrate, wherein the at least one trench capacitor has a height that changes due to back side polishing that is performed during the back side attack. - View Dependent Claims (17, 18, 19, 20)
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21-36. -36. (canceled)
Specification