COATINGS TO ENHANCE WETTING, ADHESION AND STRENGTH

• US 20160221097A1
• Filed: 10/26/2015
• Published: 08/04/2016
• Est. Priority Date: 01/29/2015
• Status: Abandoned Application

• Current Assignee: Sandia Corporation (Martin Marietta Corporation)
• Original Assignee: Sandia Corporation (Martin Marietta Corporation)
• Inventors: Kammler, Daniel, Adams, David P.
• Application Number:
  US14/923,031
• Publication Number:
  US 20160221097A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: B23K 1/0006 Exothermic brazing
• CPC Class Codes: B23K 1/0008 specially adapted for particular articles or work
• CPC Class Codes: B23K 1/19 taking account of the properties of the materials to be soldered
• CPC Class Codes: B23K 1/20 Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating preparation of surfaces in particular ways, see the relevant classes for the treatments or the materials treated, e.g. C04B, C23C
• CPC Class Codes: B23K 1/206 Cleaning
• CPC Class Codes: B23K 2103/00 Materials to be soldered, welded or cut
• CPC Class Codes: B23K 2103/18 Dissimilar materials
• CPC Class Codes: B23K 2103/52 Ceramics
• CPC Class Codes: B23K 35/3006 Ag as the principal constituent
• CPC Class Codes: C04B 2237/125 based on noble metals, e.g. silver
• CPC Class Codes: C04B 2237/127 The active component for bonding being a refractory metal
• CPC Class Codes: C04B 2237/343 Alumina or aluminates
• CPC Class Codes: C04B 2237/405 Iron metal group, e.g. Co or Ni
• CPC Class Codes: C04B 2237/406 Iron, e.g. steel
• CPC Class Codes: C04B 2237/52 Pre-treatment of the joining surfaces, e.g. cleaning, machining
• CPC Class Codes: C04B 2237/55 Pre-treatments of a coated or not coated substrate other than oxidation treatment in order to form an active joining layer
• CPC Class Codes: C04B 37/006 consisting of metals or metal salts
• CPC Class Codes: C04B 37/026 consisting of metals or metal salts
• CPC Class Codes: C23C 14/10 Glass or silica

Abstract

Technologies for enhancing the wetting and adhesion of materials to a ceramic surface are described herein. In a general embodiment, a silicon dioxide film is applied to a ceramic surface that is then joined to another surface by brazing with an active braze filler metal. In another example, the silicon dioxide film is applied to a ceramic surface of a device that is then potted in an epoxy potting material.

Claims

1. A method for improving wetting and adhesion of an epoxy potting material to a ceramic surface of a device, the method comprising:

applying a silicon dioxide coating to the ceramic surface of the device; and

potting the device in an epoxy.

2. The method according to claim 1, wherein the ceramic surface comprises a debased alumina.

3. The method according to claim 2, wherein the debased alumina comprises 94% alumina.

4. The method according to claim 3, wherein the debased alumina is diamonite.

5. The method according to claim 1, wherein the epoxy comprises:

bisphenol A diglycidyl ether; and

a diethanolamine curative.

6. The method according to claim 1, wherein applying the silicon dioxide coating to the ceramic surface of the device comprises depositing a silicon dioxide film to the ceramic surface by RF sputter deposition.

7. The method according to claim 1, wherein the silicon dioxide coating is applied to a thickness of between 2000 and 3000 Angstroms.

8. A method for improving wetting of an active braze filler metal, the method comprising:

applying a silicon dioxide film to a ceramic brazing surface of a device, the ceramic brazing surface comprising alumina; and

actively brazing the device to a second device, wherein actively brazing the device to the second device comprises;

placing a filler metal adjacent to the silicon dioxide film; and

brazing the device to the second device at about a liquidus temperature of the filler metal.

9. The method of claim 8, wherein the alumina is a debased alumina.

10. The method of claim 9, wherein the second device has a brazing surface, the brazing surface of the second device comprises a nickel-cobalt ferrous alloy.

11. The method of claim 10, wherein the nickel-cobalt ferrous alloy is diamonite.

12. The method of claim 8, wherein the ceramic brazing surface comprises 94% alumina.

13. The method of claim 12, wherein the ceramic brazing surface is diamonite.

14. The method of claim 8, wherein the filler metal comprises zirconium.

15. The method of claim 8, wherein the filler metal is an alloy comprising:

97% silver;

2% zirconium; and

1% copper.

16. The method of claim 8, wherein applying the silicon dioxide film to the ceramic brazing surface of the first device comprises applying the silicon dioxide film to have a thickness between about 2,000 angstroms and about 3,000 angstroms.

17. The method of claim 8, wherein applying the silicon dioxide film to the ceramic brazing surface comprises depositing the silicon dioxide film using RF sputter deposition in an argon ambient atmosphere.

18. A method of active brazing, the method comprising:

applying a silicon dioxide film to a first debased alumina braze surface; and

joining a second braze surface to the first debased alumina braze surface with an active filler metal by brazing.

19. The method of claim 18, wherein the silicon dioxide film is applied by sputter deposition.

20. The method of claim 18, wherein the silicon dioxide film is applied by dip coating.