BONDING METHOD AND DEVICE

• US 20160221253A1
• Filed: 04/11/2016
• Published: 08/04/2016
• Est. Priority Date: 10/22/2013
• Status: Active Grant

• Current Assignee: Fujifilm Corporation (Fujifilm Holdings Corporation)
• Original Assignee: Fujifilm Corporation (Fujifilm Holdings Corporation)
• Inventors: SAKAZAKI, Yoshiki
• Granted Patent: US 10,434,720 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: A61J 1/10 Bag-type containers
• CPC Class Codes: B29C 65/18 using heated tools
• CPC Class Codes: B29C 65/48 using adhesives , i.e. using supplementary joining material; solvent bonding
• CPC Class Codes: B29C 65/4815 Hot melt adhesives, e.g. thermoplastic adhesives
• CPC Class Codes: B29C 65/4835 Heat curing adhesives
• CPC Class Codes: B29C 65/5057 positioned between the surfaces to be joined B29C65/5035 takes precedence
• CPC Class Codes: B29C 66/006 Preventing damaging, e.g. of the parts to be joined B29C66/003, B29C66/004, B29C66/348 take precedence
• CPC Class Codes: B29C 66/1122 Single lap to lap joints, i.e. overlap joints B29C66/45, B29C66/472, B29C66/52272 take precedence
• CPC Class Codes: B29C 66/24244 forming a rectangle
• CPC Class Codes: B29C 66/43 Joining a relatively small portion of the surface of said articles B29C66/45 takes precedence
• CPC Class Codes: B29C 66/5326 said single elements being substantially flat
• CPC Class Codes: B29C 66/723 being multi-layered B29C66/7292, B29C66/72941 take precedence
• CPC Class Codes: B29C 66/8322 Joining or pressing tools reciprocating along one axis
• CPC Class Codes: B29L 2031/7148 Blood bags, medical bags
• CPC Class Codes: B32B 2307/558 Impact strength, toughness
• CPC Class Codes: B32B 2307/7242 Non-permeable
• CPC Class Codes: B32B 2439/70 Food packaging

Abstract

A bonding target object and a film including a layer having lower toughness than the bonding target object are disposed between a set of pressurization molds, which have pressurization surfaces disposed so as to face each other and in which opening holes are formed in the pressurization surfaces. A first edge on the opening hole side of the pressurization surface of a first pressurization mold, out of the set of pressurization molds, which faces the film is positioned further inside the opening hole than a second edge on the opening hole side of the pressurization surface of a second pressurization mold which faces the bonding target object. The pressing target portion of the film which is pressed by the set of pressurization molds is bonded to the bonding target object by sandwiching the bonding target object and the film with the set of pressurization molds to be pressed.

Claims

1. A bonding method for bonding a pressing target portion of a film which is pressed by a set of pressurization molds to a bonding target object by disposing the bonding target object and the film including a layer having lower toughness than the bonding target object between the set of pressurization molds, which have pressurization surfaces disposed so as to face each other and in which opening holes are formed in the pressurization surfaces, and by sandwiching the bonding target object and the film with the set of pressurization molds to be pressed, the method comprising:

bonding the pressing target portion to the bonding target object using the set of pressurization molds having a configuration in which a first edge on the opening hole side of the pressurization surface of a first pressurization mold, out of the set of pressurization molds, which faces the film is positioned further inside the opening hole than a second edge on the opening hole side of the pressurization surface of a second pressurization mold which faces the bonding target object.

2. The bonding method according to claim 1,

wherein the pressing of the film is performed using the first pressurization mold in which the first edge is chamfered.

3. The bonding method according to claim 1,

wherein an adhesive layer is formed on a surface side of the pressing target portion facing the bonding target object, and

wherein the set of pressurization molds bonds the pressing target portion to the bonding target object through the adhesive layer.

4. The bonding method according to claim 1,

wherein the set of pressurization molds bonds the pressing target portion to the bonding target object through welding.

5. The bonding method according to claim 1, further comprising:

bonding the pressing target portion of the film to one surface side of the bonding target object, and then, bonding a pressing target portion of a bending resistant function film, which is positioned on the other surface side of the bonding target object and has higher bending resistance than the film, to the bonding target object by disposing the bonding target object and the bending resistant function film between the set of pressurization molds, and sandwiching the bonding target object and the bending resistant function film with the set of pressurization molds to press the function film on the one surface side of the bonding target object using the first pressurization mold and to press the bending resistant function film using the second pressurization mold.

6. The bonding method according to claim 1, further comprising:

bonding the pressing target portion of the film to one surface side of the bonding target object using the set of pressurization molds in a state in which the film is suppressed not to swell more than a bending resistant function film having higher bending resistance than the film, after bonding the bending resistant function film to the other surface side of the bonding target object.

7. The bonding method according to claim 1,

wherein at least one of the first pressurization mold and the second pressurization mold is formed of any of metal, a rubber material, a resin material, a ceramic material, and wood.

8. The bonding method according to claim 1,

wherein at least the first pressurization mold out of the first pressurization mold and the second pressurization mold performs pressing of the film using the pressurization surface having releasability with respect to the film.

9. The bonding method according to claim 1,

wherein the pressurization surface of at least the first pressurization mold out of the first pressurization mold and the second pressurization mold presses the film through tape which is stuck to the pressurization surface or a sheet provided between the pressurization surface and the film.

10. The bonding method according to claim 1,

wherein an edge line of the first edge which forms a contour of the opening hole of the first pressurization mold is formed to have a smoothly connected shape and an edge line of the second edge which forms a contour of the opening hole of the second pressurization mold is formed to have a smoothly connected shape.

11. The bonding method according to claim 1,

wherein the bonding target object and the film are sandwiched with the set of pressurization molds, which have the pressurization surfaces formed in a frame shape and the opening holes which are surrounded by the pressurization surfaces, to be pressed.

12. A bonding device which bonds a pressing target portion of a film which is pressed by a set of pressurization molds to a bonding target object by disposing the bonding target object and the film including a layer having lower toughness than the bonding target object between the set of pressurization molds, which have pressurization surfaces disposed so as to face each other and in which opening holes are formed in the pressurization surfaces, and by sandwiching the bonding target object and the film with the set of pressurization molds to be pressed,

wherein a first edge on the opening hole side of the pressurization surface of a first pressurization mold, out of the set of pressurization molds, which faces the film is positioned further inside the opening hole than a second edge on the opening hole side of the pressurization surface of a second pressurization mold which faces the bonding target object.