ELECTRONIC COMPONENT, AND METHOD OF MANUFACTURING THEREOF

• US 20160225517A1
• Filed: 01/29/2016
• Published: 08/04/2016
• Est. Priority Date: 01/30/2015
• Status: Active Grant

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: CHOI, Min Sung
• Granted Patent: US 11,562,851 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 17/04 with magnetic core
• CPC Class Codes: H01F 2017/048 with encapsulating core, e.g. made of resin and magnetic powder
• CPC Class Codes: H01F 27/292 Surface mounted devices
• CPC Class Codes: H01F 41/046 structurally combined with ferromagnetic material
• CPC Class Codes: H01F 41/10 Connecting leads to windings making electric connections in general H01R43/00

Abstract

An electronic component includes a magnetic body containing magnetic metal powder; and external electrodes disposed on an outer portion of the magnetic body. The external electrodes include first plating layers in direct contact with the magnetic body.

Claims

1. An electronic component comprising:

a magnetic body containing magnetic metal powder; and

external electrodes disposed on an outer portion of the magnetic body,

wherein the external electrodes include first plating layers in direct contact with the magnetic body.

2. The electronic component of claim 1, wherein the external electrodes further include second plating layers formed on the first plating layers and third plating layers formed on the second plating layers.

3. The electronic component of claim 1, wherein the first plating layers are Cu plating layers.

4. The electronic component of claim 2, wherein the second plating layers are Ni plating layers.

5. The electronic component of claim 4, wherein the third plating layers are Sn plating layers.

6. The electronic component of claim 1, further comprising an insulating layer formed on a region of a surface of the magnetic body, wherein the external electrodes are not formed on the regions of the surface of the magnetic body where the insulating layer is formed.

7. The electronic component of claim 1, wherein the external electrodes are formed on first and second end surfaces of the magnetic body in a length direction, respectively, and extended to first and second side surfaces of the magnetic body in a width direction and first and second main surfaces of the magnetic body in a thickness direction.

8. The electronic component of claim 1, further comprising surface electrode layers formed on the first and second main surfaces of the magnetic body in a thickness direction.

9. The electronic component of claim 1, wherein the magnetic body includes an internal coil part formed therein by connection of coil conductors disposed on first and second surfaces of an insulating substrate.

10. The electronic component of claim 9, wherein the coil conductors are plated coil conductors.

11. The electronic component of claim 1, wherein the magnetic metal powder is dispersed in a thermosetting resin.

12. The electronic component of claim 1, wherein the external electrodes do not include glass or resin.

13. A method of manufacturing an electronic component, the method comprising steps of:

forming an internal coil part;

stacking magnetic sheets containing magnetic metal powder on and below the internal coil part to form a magnetic body; and

forming external electrodes on an outer portion of the magnetic body,

wherein the step of forming the external electrodes includes forming first plating layers on at least one surface of the magnetic body by direct plating.

14. The method of claim 13, wherein the step of forming the external electrodes further includes forming second plating layers on the first plating layers and forming third plating layers on the second plating layers.

15. The method of claim 13, wherein the first plating layers are Cu plating layers.

16. The method of claim 14, wherein the second plating layers are Ni plating layers.

17. The method of claim 16, wherein the third plating layers are Sn plating layers.

18. The method of claim 13, further comprising, before the step of forming the external electrodes on the outer portion of the magnetic body, forming an insulating layer on a region of a surface of the magnetic body.

19. The method of claim 18, wherein the step of forming the external electrodes on the outer portion of the magnetic body does not form the external electrodes on the regions of the surface of the magnetic body where the insulating layer is formed.

20. The method of claim 13, further comprising, before the step of forming the external electrodes on the outer portion of the magnetic body, forming surface electrode layers on first and second main surfaces of the magnetic body in a thickness direction.