HOUSING, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC DEVICE INCLUDING THE SAME

• US 20160227655A1
• Filed: 02/01/2016
• Published: 08/04/2016
• Est. Priority Date: 01/30/2015
• Status: Abandoned Application

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: HAN, Seung-Soo, LEE, Byoung-Soo, JI, Young-Bae
• Application Number:
  US15/012,139
• Publication Number:
  US 20160227655A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: C23C 14/024 Deposition of sublayers, e.g. to promote adhesion of the coating C23C14/027 takes precedence
• CPC Class Codes: C23C 14/06 characterised by the coating material C23C14/0021 , C23C14/04 take precedence
• CPC Class Codes: C23C 16/0272 Deposition of sub-layers, e.g. to promote the adhesion of the main coating
• CPC Class Codes: C23C 16/30 Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
• CPC Class Codes: G06F 1/1626 with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
• CPC Class Codes: H05K 5/0086 portable, e.g. battery operated apparatus casings for switching devices H01H9/02

Abstract

The present disclosure provides a housing of an electronic device and a method of manufacturing the housing. The method includes forming a basic material of the housing by coupling members of the housing composed of dissimilar materials, platinizing a coupling surface of the basic material of the housing, forming at least one deposition film on the platinized surface, and forming a painting film on the at least one deposition film.

Claims

1. A method of manufacturing a housing of an electronic device, the method comprising:

forming a basic material of the housing by coupling members of the housing composed of dissimilar materials;

planarizing a coupling surface of the basic material of the housing;

forming at least one deposition film on the planarized surface; and

forming a painting film on the at least one deposition film.

2. The method of claim 1, wherein the basic material of the housing is formed by coupling a metal member and a non-metal member through at least one of dual injection-molding, insert injection-molding, and structural coupling.

3. The method of claim 1, wherein the coupling surface is planarized through buffing.

4. The method of claim 1, further comprising:

laminating a primer layer on the planarized surface of the basic material of the housing before forming the at least one deposition film.

5. The method of claim 4, wherein the primer layer is formed of at least one of olefin-based, acryl-based, and urethane-based materials.

6. The method of claim 4, wherein a thickness of the primer layer has a range of 30 μ

m to 40 μ

m.

7. The method of claim 1, wherein the at least one deposition film is formed of at least one of Ti-based, Sn-based, and Cr-based materials.

8. The method of claim 1, wherein the at least one deposition film comprises two or more deposition films, and the two or more deposition films are formed of materials having different refractivities.

9. The method of claim 1, wherein a thickness of the at least one deposition film has a range of 100 Å

to 700 Å

.

10. The method of claim 1, wherein at least one area of the at least one deposition film has a periodic non-deposition pattern so that a radiation signal of a communication radiation body is transmitted.

11. The method of claim 1, wherein the housing is applied as an external housing of the electronic device.

12. The method of claim 11, wherein the housing comprises a battery cover of the electronic device.

13. A housing of an electronic device, the housing comprising:

a basic material formed by coupling members of the housing composed of dissimilar materials, wherein a coupling surface of the basic material of the housing is platinized;

at least one deposition film formed on the platinized surface; and

a painting film on the at least one deposition film.

14. An electronic device comprising:

a housing forming at least a portion of an external surface of the electronic device, wherein

the housing comprises;

a first member;

a second member coupled to the first member to form a basic material of the housing;

a primer layer laminated on the basic material of the housing;

at least one deposition film laminated on the primer layer; and

a painting film laminated on the at least one deposition film.

15. The electronic device of claim 14, wherein the first member is a metal member and the second member is a non-metal member.

16. The electronic device of claim 15, wherein the basic material of the housing is formed by coupling the first member and the second member through at least one of dual injection-molding, insert injection-molding, and structural coupling.

17. The electronic device of claim 14, wherein the at least one deposition film is formed of at least one of Ti-based, Sn-based, and Cr-based materials.

18. The electronic device of claim 14, wherein the at least one deposition film comprises two or more deposition films, and the two or more deposition films are formed of materials having different refractivities.

19. The electronic device of claim 14, wherein a thickness of the deposition film has a range of 100 Å

to 700 Å

.

20. The electronic device of claim 14, wherein at least one area of the at least one deposition film has a periodic non-deposition pattern so that a radiation signal of a communication radiation body provided in the electronic device is transmitted.