MEMS DEVICE INCLUDING SUPPORT STRUCTURE AND METHOD OF MANUFACTURING

• US 20160229684A1
• Filed: 09/23/2014
• Published: 08/11/2016
• Est. Priority Date: 09/24/2013
• Status: Abandoned Application

• Current Assignee: Motion Engine inc
• Original Assignee: Motion Engine inc
• Inventors: Boysel, Robert Mark
• Application Number:
  US15/024,704
• Publication Number:
  US 20160229684A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: B81B 2201/0235 Accelerometers
• CPC Class Codes: B81B 2201/0242 Gyroscopes
• CPC Class Codes: B81B 2203/0163 Spring holders
• CPC Class Codes: B81B 2207/092 Buried interconnects in the substrate or in the lid
• CPC Class Codes: B81B 3/0078 Constitution or structural means for improving mechanical properties not provided for in B81B3/007 - B81B3/0075
• CPC Class Codes: B81B 7/0058 for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
• CPC Class Codes: B81C 1/00269 Bonding of solid lids or wafers to the substrate
• CPC Class Codes: B81C 2201/013 Etching
• CPC Class Codes: G01C 19/5783 Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 15/125 by capacitive pick-up

Abstract

A micro-electro-mechanical system (MEMS) device and a manufacturing method are provided. The device includes top and bottom cap wafers and a MEMS wafer disposed between the top cap wafer and the bottom cap wafer. The top, bottom and MEMS wafers define sidewalls of a cavity. A MEMS structure is housed within the cavity and is movable relative to the top and bottom caps. At least one electrode is provided in one of the wafers, the electrode being operatively coupled to the MEMS structure to detect or induce a movement thereof. A support structure extends through the cavity from the top cap wafer to the bottom cap wafer to prevent bowing in the top cap and bottom cap wafers.

Claims

1. A micro-electro-mechanical system (MEMS) device comprising:

a top cap wafer and a bottom cap wafer;

a MEMS wafer disposed between the top cap wafer and the bottom cap wafer, the top cap wafer, the bottom cap wafer and the MEMS wafer defining sidewalls of a cavity;

a MEMS structure housed within the cavity and movable relative to the top and bottom caps;

at least one electrode provided in one of the top cap wafer, the MEMS wafer and the bottom cap wafer, said at least one electrode being operatively coupled to the MEMS structure to detect or induce a movement thereof; and

a support structure extending through the cavity from the top cap wafer to the bottom cap wafer to prevent bowing in the top cap wafer and bottom cap wafer.

2. The MEMS device according to claim 1, wherein the support structure comprises a cap portion formed within the top cap wafer, a core portion formed within the MEMS wafer and a base portion formed within the bottom cap wafer.

3. The MEMS device according to claim 1, wherein the top cap wafer, the bottom cap wafer and the MEMS wafer comprises an electrically-conductive material.

4. The MEMS device according to claim 1, wherein the top cap wafer, the bottom cap wafer and the MEMS wafer comprises a silicon material.

5. The MEMS device according to claim 1, wherein the support structure is electrically conductive.

6. The MEMS device according to claims 1, wherein the top cap wafer has an inner side and an outer side, the MEMS wafer has a first side and a second sides and the bottom cap wafer has an inner side and an outer sides, the inner sides of the top cap wafer and bottom cap wafers being electrically bonded to the first side and the second side of the MEMS wafer, respectively.

7. The MEMS device according to any claim 1, wherein the MEMS wafer is a silicon-on-insulator (SOI) wafer comprising a device layer, an insulating layer and a handle layer.

8. The MEMS device according to claim 7, wherein the support structure comprises a conducting shunt extending from the device layer to the handle layer, through the insulating layer.

9. The MEMS device according to claim 1, wherein the support structure passes through the MEMS structure without interfering with movement of the MEMS structure.

10. The MEMS device according to claim 1, wherein the MEMS structure is a suspended proof mass.

11. The MEMS device according to claim 2, wherein at least one of the cap portion and the base portion is delimited by insulated closed-loop channels etched through the top cap wafer or the bottom cap wafer.

12. The MEMS device according to claim 2, wherein the core portion is spaced away from the MEMS structure and surrounded by a clearance gap etched through the MEMS wafer.

13. The MEMS device according to claim 1, wherein the top cap wafer and the bottom cap wafer further comprise electrical contacts electrically connected to the support structure for transmitting electrical signals between the electrical contacts of the bottom cap and the top cap wafers through the support structure.

14. The MEMS device according to claim 1, comprising at least one additional support structure extending through the cavity from the top cap wafer to the bottom cap wafer.

15. A method for manufacturing a MEMS device, the method comprising the steps of:

bonding a MEMS wafer to one of a top cap wafer and a bottom cap wafer, the top cap wafer having an inner side and an outer sides, patterning in the top cap wafer and bottom cap wafers, a cap portion and a base portion of a support structure to be formed and a top sidewall and a bottom sidewall of a cavity to be formed, and at least one electrode in one of the top cap wafer and bottom cap wafer;

the MEMS wafer having a first side and a second side and patterning on one of the first side and the second sides at least a part of a MEMS structure and a part of a core portion of the support structure;

bonding the patterned side of the MEMS wafer to the inner side of one of the top cap wafer and the bottom cap wafer by aligning the corresponding cap portion or base portion to the part of the core portion of the MEMS wafer;

patterning on the second side of the MEMS wafer a further part of the MEMS structure, a further part of the core portion, and lateral sidewalls of the cavity; and

bonding the second side of the MEMS wafer to the inner side of a further one of the top cap wafer and the bottom cap wafer by aligning the top sidewall, bottom sidewall and lateral sidewall to form the cavity housing the MEMS structure, the at least one electrode being operatively coupled to the MEMS structure, and by aligning a cap portion or base portion of said further cap wafer with a further part of the core portion, the support structure extending through the cavity from the bottom cap wafer to the top cap wafer to prevent bowing in the top cap wafer and bottom cap wafer.

16. The method for manufacturing a MEMS device according to claim 15, wherein the top, bottom and MEMS wafer are electrically conductive, and wherein the bonding steps are made with a conductive bond.

17. The method for manufacturing a MEMS device according to claim 15, wherein the cap portion and base portion are formed by etching trenches in the respective inner sides and at least partially through the top cap wafer and bottom cap wafer, and by filling the trenches with an insulating material or an insulating lining followed by a conductive fill.

18. The method for manufacturing a MEMS device according to claim 15, comprising a step of removing a portion of the outer sides of the top cap wafer and bottom cap wafer to isolate the at least one electrode and the cap portion and base portion.

19. The method for manufacturing a MEMS device according to claim 15, comprising a step of forming a first electrical contact and second electrical contacts on the outer sides of the top cap wafer and bottom cap wafer, respectively, the first electrical contact being electrically connected to the cap portion and the second electrical contact being electrically connected to the bottom cap portion.

20. The method for manufacturing a MEMS device according to claim 15, wherein the bonding steps comprise patterning a clearance gap within one or more parts of the MEMS structure to form the support structure, and wherein after the step of bonding the second side, the support structure passes through the MEMS structure.

21. The method for manufacturing a MEMS device according to claim 15, wherein the MEMS wafer is an SOI wafer with an insulating layer separating a device layer from a handle layer, the method further comprising a step of forming a conducting shunt between the device layer and the handle layer in said part of the core portion.