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SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURING METHOD

  • US 20160233135A1
  • Filed: 07/07/2015
  • Published: 08/11/2016
  • Est. Priority Date: 02/06/2015
  • Status: Active Grant
First Claim
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1. A semiconductor manufacturing apparatus comprising:

  • an extraction module configured to extract, in cycle etching that repeats first processes of etching a workpiece layer and second processes of performing different processing from the first processes for plural cycles, light emission intensities in the first processes for individual cycles; and

    a detection module configured to detect an etching end point of the workpiece layer in the cycle etching, based on the light emission intensities of the plural cycles.

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