DEVICE FOR RADIOFREQUENCY (RF) TRANSMISSION WITH AN INTEGRATED ELECTROMAGNETIC WAVE REFLECTOR

• US 20160233178A1
• Filed: 02/10/2016
• Published: 08/11/2016
• Est. Priority Date: 02/11/2015
• Status: Active Grant

• Current Assignee: Commissariat a L'Energie Atomique (French Alternative Energies and Atomic Energy Commission)
• Original Assignee: Commissariat a L'Energie Atomique (French Alternative Energies and Atomic Energy Commission)
• Inventors: DUSSOPT, Laurent, MOKNACHE, Amazir, LAMY, Yann, EL BOUAYADI, Ossama
• Granted Patent: US 9,536,845 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 21/4846 Leads on or in insulating or insulated substrates, e.g. metallisation H01L21/4821 takes precedence; metallisation of ceramics in general C04B41/51; printed circuits H05K3/00
• CPC Class Codes: H01L 2223/6616 Vertical connections, e.g. vias
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/73267 Layer and HDI connectors
• CPC Class Codes: H01L 23/367 Cooling facilitated by shape of device H01L23/38, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence
• CPC Class Codes: H01L 23/3677 Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 23/498 Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers shape of the substrate H01L23/13
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/49833 the chip support structure consisting of a plurality of insulating substrates
• CPC Class Codes: H01L 23/5389 the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/19 Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/15313 being a land array, e.g. LGA
• CPC Class Codes: H01P 1/20 Frequency-selective devices, e.g. filters
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 15/008 : said selective devices having Sievenpipers' mushroom elements
• CPC Class Codes: H01Q 21/28 : Combinations of substantially independent non-interacting antenna units or systems multiple beam H01Q25/00

Abstract

RF transmission device including at least:

• • a substrate comprising first and second faces opposite to each other;
  • a first RF transmission electronic circuit arranged on and/or in the substrate;
  • a first antenna arranged on the side of the first face of the substrate, spaced apart from the first face of the substrate and electrically connected to the first RF transmission electronic circuit;
  • a first electromagnetic wave reflector coupled to the first antenna and including:
    • a first high impedance surface comprising at least several first electrically conducting elements forming a first periodic structure and arranged on the first face of the substrate opposite the first antenna;
    • a first electrically conducting ground plane arranged at least partially opposite the first antenna.

Claims

1. RF transmission device including at least:

a substrate comprising first and second faces opposite to each other;

a first RF transmission electronic circuit arranged on and/or in the substrate;

a first antenna arranged on the side of the first face of the substrate, spaced apart from the first face of the substrate and electrically connected to the first RF transmission electronic circuit;

a first electromagnetic wave reflector coupled to the first antenna and including at least;

a first high impedance surface comprising at least several first electrically conducting elements forming a first periodic structure and arranged on the first face of the substrate opposite the first antenna;

a first electrically conducting ground plane arranged at least partially opposite the first antenna.

2. Device according to claim 1, in which the first RF transmission electronic circuit is arranged at the first face of the substrate.

3. Device according to claim 1, in which the first electrically conducting ground plane is arranged on the second face of the substrate.

4. Device according to claim 1, further comprising a first dielectric layer arranged on the first face of the substrate, surrounding the first RF transmission electronic circuit and on which the first antenna is arranged.

5. Device according to claim 1, further comprising a cavity delimited by the first high impedance surface and by a suspended membrane on which at least the first antenna is arranged.

6. Device according to claim 1, in which a distance between the first antenna and the first electrically conducting ground plane is less than or equal to around a tenth of a central wavelength of first RF signals intended to be transmitted and/or received by the first antenna.

7. Device according to claim 1, in which each first electrically conducting element of the first high impedance surface comprises one or more flat conducting portions arranged beside each other and/or in different planes superimposed on each other, the first high impedance surface further comprising a second dielectric layer in which are arranged the first electrically conducting elements.

8. Device according to claim 7, in which each first electrically conducting element of the first high impedance surface further comprises at least one vertical conducting portion connected to the or at least to one of the flat conducting portions of said first electrically conducting element.

9. Device according to claim 1, further comprising:

several first electrically conducting vias crossing through at least the substrate and electrically connected to the first RF transmission electronic circuit, and/or

several second electrically conducting vias crossing through at least the substrate and arranged around the first antenna while forming a guard ring around the first antenna, and/or

several third heat conducting vias crossing through at least the substrate and arranged under the first RF transmission circuit.

10. Device according to claim 9, in which the third heat conducting vias are electrically conducting.

11. Device according to claim 1, further comprising at least:

a second antenna arranged on the side of the first face of the substrate, spaced apart from the first face of the substrate and electrically connected to the first RF transmission electronic circuit;

a second electromagnetic wave reflector coupled to the second antenna and including at least;

a second high impedance surface comprising at least several second electrically conducting elements forming a second periodic structure and arranged on the first face of the substrate opposite the second antenna;

a second electrically conducting ground plane arranged at least partially opposite the second antenna.

12. Device according to claim 1, further comprising at least:

a second RF transmission electronic circuit arranged on and/or in the substrate;

a second antenna arranged on the side of the first face of the substrate, spaced apart from the first face of the substrate and electrically connected to the second RF transmission electronic circuit;

a second electromagnetic wave reflector coupled to the second antenna and including at least;

a second high impedance surface comprising at least several second electrically conducting elements forming a second periodic structure and arranged on the first face of the substrate opposite the second antenna;

a second electrically conducting ground plane arranged at least partially opposite the second antenna.

13. Device according to claim 11, in which the second electrically conducting ground plane is arranged on the second face of the substrate.

14. Device according to claim 12, in which the second electrically conducting ground plane is arranged on the second face of the substrate.

15. Device according to claim 11, in which the first and second electrically conducting elements of the first and second high impedance surfaces are arranged in a same second dielectric layer on which is arranged at least the first RF transmission electronic circuit.

16. Device according to claim 12, in which the first and second electrically conducting elements of the first and second high impedance surfaces are arranged in a same second dielectric layer on which is arranged at least the first RF transmission electronic circuit.

17. Device according to claim 1, further comprising a printed circuit to which the substrate is joined and to which at least the first RF transmission electronic circuit is electrically connected.

18. Device according to claim 17, in which the substrate is connected mechanically and electrically to the printed circuit through the intermediary of a plurality of conducting beads regularly spread out on the second face of the substrate.

19. Method for producing a RF transmission device, including at least the steps of:

forming, on a first face of a substrate, a first high impedance surface comprising at least several first electrically conducting elements forming a first periodic structure;

transferring a first RF transmission electronic circuit onto and/or into the substrate;

forming a first antenna arranged on the side of the first face of the substrate and opposite the first electrically conducting elements, spaced apart from the first face of the substrate and electrically connected to the first RF transmission electronic circuit;

forming a first electrically conducting ground plane at least partially opposite the first antenna;

and in which the first high impedance surface and the first electrically conducting ground plane together form a first electromagnetic wave reflector coupled to the first antenna.

20. Method according to claim 19, further comprising the steps of:

forming at least one second antenna arranged on the side of the first face of the substrate, spaced apart from the first face of the substrate and electrically connected to the first RF transmission electronic circuit or to a second RF transmission electronic circuit transferred onto and/or into the substrate;

forming at least one second electromagnetic wave reflector coupled to the second antenna and including at least;

a second high impedance surface comprising at least several second electrically conducting elements forming a second periodic structure and arranged on the first face of the substrate opposite the second antenna;

a second electrically conducting ground plane arranged at least partially opposite the second antenna.