TUNGSTEN FOR WORDLINE APPLICATIONS
First Claim
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1. A method of depositing tungsten on a substrate, the method comprising:
- pulsing a reducing agent, wherein the reducing agent is boron (B)-containing, silicon (Si)-containing or germanium (Ge)-containing; and
pulsing a tungsten chloride precursor,wherein the tungsten chloride precursor is reduced by the reducing agent or a product thereof to form a multi-component tungsten-containing film containing one or more of B, Si, and Ge on the substrate.
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Abstract
Disclosed herein are methods and related apparatus for formation of tungsten wordlines in memory devices. Also disclosed herein are methods and related apparatus for deposition of fluorine-free tungsten (FFW). According to various embodiments, the methods involve deposition of multi-component tungsten films using tungsten chloride (WClx) precursors and boron (B)-containing, silicon (Si)-containing or germanium (Ge)-containing reducing agents.
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19 Claims
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1. A method of depositing tungsten on a substrate, the method comprising:
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pulsing a reducing agent, wherein the reducing agent is boron (B)-containing, silicon (Si)-containing or germanium (Ge)-containing; and pulsing a tungsten chloride precursor, wherein the tungsten chloride precursor is reduced by the reducing agent or a product thereof to form a multi-component tungsten-containing film containing one or more of B, Si, and Ge on the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A memory structure comprising:
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a liner layer of a multi-component tungsten-containing film containing one or more of B, Si, and Ge; and a tungsten wordline.
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19. A memory structure comprising:
a work function layer of a multi-component tungsten-containing film containing one or more of B, Si, and Ge; and a metal gate.
Specification