POWER MOSFET SEMICONDUCTOR
First Claim
1. A method for forming a semiconductor device, comprising:
- providing a semiconductor body of a first conductivity type;
forming a first field-effect structure including a source region of the first conductivity type, a body region of a second conductivity type which is adjacent to the source region, a first gate electrode, and a first insulating region which is arranged at least between the first gate electrode and the body region such that the first gate electrode, the first insulating region and the body region form a first capacitor, the first capacitor having a first capacitance per unit area;
forming a second field-effect structure including a source region of the first conductivity type, a body region of a second conductivity type which is adjacent to the source region, a second gate electrode and a second insulating region which is arranged at least between the second gate electrode and the body region such that the second gate electrode, the second insulating region and the body region form a second capacitor, the second capacitor having a second capacitance per unit area; and
forming a source metallization at least in electrical contact to the source regions of the first and second field-effect structures and the second gate electrode;
the first field-effect structure and the second field-effect structure being formed such that the second capacitance per unit area is higher than the first capacitance per unit area.
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Accused Products
Abstract
A semiconductor device includes a source metallization, a source region of a first conductivity type in contact with the source metallization, a body region of a second conductivity type which is adjacent to the source region. The semiconductor device further includes a first field-effect structure including a first insulated gate electrode and a second field-effect structure including a second insulated gate electrode which is electrically connected to the source metallization. The capacitance per unit area between the second insulated gate electrode and the body region is larger than the capacitance per unit area between the first insulated gate electrode and the body region.
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Citations
19 Claims
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1. A method for forming a semiconductor device, comprising:
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providing a semiconductor body of a first conductivity type; forming a first field-effect structure including a source region of the first conductivity type, a body region of a second conductivity type which is adjacent to the source region, a first gate electrode, and a first insulating region which is arranged at least between the first gate electrode and the body region such that the first gate electrode, the first insulating region and the body region form a first capacitor, the first capacitor having a first capacitance per unit area; forming a second field-effect structure including a source region of the first conductivity type, a body region of a second conductivity type which is adjacent to the source region, a second gate electrode and a second insulating region which is arranged at least between the second gate electrode and the body region such that the second gate electrode, the second insulating region and the body region form a second capacitor, the second capacitor having a second capacitance per unit area; and forming a source metallization at least in electrical contact to the source regions of the first and second field-effect structures and the second gate electrode; the first field-effect structure and the second field-effect structure being formed such that the second capacitance per unit area is higher than the first capacitance per unit area. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method for forming a semiconductor device, comprising:
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providing a semiconductor substrate of a first conductivity type; forming a first trench and a second trench in the semiconductor substrate; forming a first oxide layer covering at least a lower portion of the walls of the first trench and a lower portion of the walls of the second trench; forming a conductive region at least in the lower portion of the first trench and at least in the lower portion of the second trench, comprising depositing a conductive material and back-etching the conductive material so that a larger portion of the deposited conductive material is removed during back-etching in the first trench compared to the second trench; performing a first thermal oxidation process to form a first insulating region on the side walls in an upper portion of the first trench; performing a second thermal oxidation process to form a second insulating region on the side walls in an upper portion of the second trench; forming a first gate electrode in the upper portion of the first trench and a second gate electrode in the upper portion of the second trench; forming source regions of the first conductivity type and a body region of a second conductivity type adjacent to the source regions; and forming a source metallization in electrical contact to the source regions and the second gate electrode. - View Dependent Claims (8, 9, 10, 11, 12, 13)
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14. A method for forming a semiconductor device, comprising:
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providing a semiconductor body; forming a first field-effect structure including a source region, a body region adjacent to the source region, a first gate electrode, and a first insulating region which is arranged at least between the first gate electrode and the body region such that the first gate electrode, the first insulating region and the body region form a first capacitor, the first capacitor having a first capacitance per unit area; forming a second field-effect structure including a source region, a body region adjacent to the source region, a second gate electrode and a second insulating region arranged at least between the second gate electrode and the body region such that the second gate electrode, the second insulating region and the body region form a second capacitor, the second capacitor having a second capacitance per unit area higher than the first capacitance per unit area; and forming a source metallization at least in electrical contact to the source regions of the first and second field-effect structures and the second gate electrode. - View Dependent Claims (15, 16, 17, 18, 19)
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Specification