ANTENNA ON CERAMICS FOR A PACKAGED DIE

• US 20160240492A1
• Filed: 12/09/2013
• Published: 08/18/2016
• Est. Priority Date: 12/09/2013
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Thorsten, Meyer, Wolter, Andreas, Maruthamuthu, Saravana, Knudsen, Mikael, Seidemann, Georg, Herrero, Pablo, Jaervinen, Pauli
• Granted Patent: US 10,319,688 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 21/4846 Leads on or in insulating or insulated substrates, e.g. metallisation H01L21/4821 takes precedence; metallisation of ceramics in general C04B41/51; printed circuits H05K3/00
• CPC Class Codes: H01L 2223/6616 Vertical connections, e.g. vias
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/12105 Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/16235 the bump connector connecting to a via metallisation of the item
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 2224/73267 Layer and HDI connectors
• CPC Class Codes: H01L 2225/06517 Bump or bump-like direct electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06548 Conductive via connections through the substrate, container, or encapsulation
• CPC Class Codes: H01L 2225/1035 the device being entirely enclosed by the support, e.g. high-density interconnect [HDI]
• CPC Class Codes: H01L 2225/1041 Special adaptations for top connections of the lowermost container, e.g. redistribution layer, integral interposer
• CPC Class Codes: H01L 2225/1058 Bump or bump-like electrical connections, e.g. balls, pillars, posts
• CPC Class Codes: H01L 23/295 containing a filler H01L23/296 takes precedence
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/481 Internal lead connections, e.g. via connections, feedthrough structures
• CPC Class Codes: H01L 23/49833 the chip support structure consisting of a plurality of insulating substrates
• CPC Class Codes: H01L 23/49838 : Geometry or layout
• CPC Class Codes: H01L 23/552 : Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/66 : High-frequency adaptations
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/17 : of a plurality of bump connectors
• CPC Class Codes: H01L 24/19 : Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 24/20 : Structure, shape, material or disposition of high density interconnect preforms
• CPC Class Codes: H01L 24/29 : of an individual layer connector
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 25/0657 : Stacked arrangements of devices
• CPC Class Codes: H01L 25/105 : the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/1421 : RF devices
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01Q 1/2283 : mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 1/38 : formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 1/50 : Structural association of antennas with earthing switches, lead-in devices or lightning protectors
• CPC Class Codes: H01Q 1/526 : Electromagnetic shields

Abstract

An antenna is described on ceramics that may be used for a packaged die. In one example, a package has a die, a ceramic substrate over the die, an antenna attached to the ceramic substrate, and conductive leads electrically connecting the antenna to the die.

Claims

1-21. -21. (canceled)

22. A package comprising:

a die;

a ceramic substrate over the die;

an antenna attached to the ceramic substrate; and

conductive leads electrically connecting the antenna to the die.

23. The package of claim 22, wherein the antenna is formed on a surface of the ceramic substrate.

24. The package of claim 23, wherein the ceramic substrate has a first face facing the die and a second face opposite the die and wherein the antenna is formed on the second face.

25. The package of claim 22, wherein the antenna is formed within the ceramic substrate.

26. The package of claim 22, further comprising a mold compound over the die and wherein the conductive leads comprise through-mold vias from the antenna to the die.

27. The package of claim 26, wherein the mold compound is over the ceramic substrate.

28. The package of claim 22, further comprising a conductive shield between the die and the antenna.

29. The package of claim 28, wherein the shield is between the die and the ceramic substrate.

30. The package of claim 29, wherein the shield is attached to the ceramic substrate.

31. The package of claim 29, wherein the shield is grounded through a via to an external connection.

32. The package of claim 22, further comprising a package substrate wherein at least a portion of the conductive leads are coupled to the package substrate.

33. The package of claim 32, wherein the conductive leads include routing paths in the package substrate.

34. The package of claim 32, further comprising a mold compound over the ceramic substrate and the die and wherein the package substrate comprises a redistribution layer formed on a front side of the die and on the mold compound.

35. The package of claim 22, wherein the ceramic substrate has a first face facing the die and a second face opposite the die and wherein the antenna is formed on the second face, a shield is formed on the first face to isolate the antenna from the die, and a conductive trace is formed on a third face between the first face and the second face to electrically connect the antenna to a conductive lead proximate the first face.

36. The package of claim 22, further comprising a package cover over the die between the die and the ceramic substrate, wherein the ceramic substrate has conductive pads coupled to the antenna, wherein the ceramic substrate is attached to the package cover using solder balls on the pads, and wherein the conductive leads comprise the pads and the solder balls.

37. The package of claim 36, wherein the package cover comprises a redistribution layer having connections to a second die.

38. The package of claim 36, wherein the conductive leads comprise solder-filled vias.

39. A computing system comprising:

a processor;

a user interface; and

a communications chip in a package, the package having a die, a ceramic substrate over the die, an antenna attached to the ceramic substrate, a mold compound over the ceramic substrate and the die, a redistribution layer formed on a front side of the die and on the mold compound and conductive leads electrically connecting the antenna to the redistribution layer.

40. The computing system of claim 39, further comprising conductive paths on the ceramic substrate to connect the antenna on one side of the substrate to a via connected to an opposite side of the substrate.

41. A method comprising:

attaching an antenna to a ceramic substrate;

attaching the ceramic substrate to a die;

forming a cover over the die;

forming a redistribution layer over the cover and the die; and

electrically connecting the antenna to the die through the redistribution layer.