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SEMICONDUCTOR LIGHT-EMITTING DEVICE

  • US 20160240746A1
  • Filed: 12/31/2015
  • Published: 08/18/2016
  • Est. Priority Date: 02/13/2015
  • Status: Active Grant
First Claim
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1. A semiconductor light-emitting device comprising:

  • a package substrate having a mounting surface on which a first circuit pattern and a second circuit pattern are disposed;

    a semiconductor light-emitting diode (LED) chip mounted on the mounting surface of the package substrate, having a first surface which faces the mounting surface and on which a first electrode and a second electrode are disposed, a second surface opposing the first surface, and side surfaces located between the first surface and the second surface, the first electrode and the second electrode being connected to the first circuit pattern and the second circuit pattern, respectively;

    a wavelength conversion film disposed on the second surface of the semiconductor LED chip; and

    a side surface inclined portion disposed on the side surfaces of the semiconductor LED chip, providing surfaces inclined inwardly toward the mounting surface of the package substrate, and comprising a light-transmitting resin containing a wavelength conversion material.

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