SEMICONDUCTOR LIGHT-EMITTING DEVICE
First Claim
1. A semiconductor light-emitting device comprising:
- a package substrate having a mounting surface on which a first circuit pattern and a second circuit pattern are disposed;
a semiconductor light-emitting diode (LED) chip mounted on the mounting surface of the package substrate, having a first surface which faces the mounting surface and on which a first electrode and a second electrode are disposed, a second surface opposing the first surface, and side surfaces located between the first surface and the second surface, the first electrode and the second electrode being connected to the first circuit pattern and the second circuit pattern, respectively;
a wavelength conversion film disposed on the second surface of the semiconductor LED chip; and
a side surface inclined portion disposed on the side surfaces of the semiconductor LED chip, providing surfaces inclined inwardly toward the mounting surface of the package substrate, and comprising a light-transmitting resin containing a wavelength conversion material.
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Accused Products
Abstract
A semiconductor light-emitting device includes: a package substrate having a mounting surface on which a first circuit pattern and a second circuit pattern are disposed; a semiconductor LED chip mounted on the mounting surface, having a first surface which faces the mounting surface and on which a first electrode and a second electrode are disposed, a second surface opposing the first surface, and side surfaces located between the first surface and the second surface, the first electrode and the second electrode being connected to the first circuit pattern and the second circuit pattern, respectively; a wavelength conversion film disposed on the second surface; and a side surface inclined portion disposed on the side surfaces of the semiconductor LED chip, providing inclined surfaces, and including a light-transmitting resin containing a wavelength conversion material.
56 Citations
20 Claims
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1. A semiconductor light-emitting device comprising:
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a package substrate having a mounting surface on which a first circuit pattern and a second circuit pattern are disposed; a semiconductor light-emitting diode (LED) chip mounted on the mounting surface of the package substrate, having a first surface which faces the mounting surface and on which a first electrode and a second electrode are disposed, a second surface opposing the first surface, and side surfaces located between the first surface and the second surface, the first electrode and the second electrode being connected to the first circuit pattern and the second circuit pattern, respectively; a wavelength conversion film disposed on the second surface of the semiconductor LED chip; and a side surface inclined portion disposed on the side surfaces of the semiconductor LED chip, providing surfaces inclined inwardly toward the mounting surface of the package substrate, and comprising a light-transmitting resin containing a wavelength conversion material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 17, 18, 19, 20)
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11. A semiconductor light-emitting device comprising:
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a package substrate having a mounting surface on which a first circuit pattern and a second circuit pattern are disposed; a semiconductor light-emitting diode (LED) chip mounted on the mounting surface of the package substrate, having a first surface which faces the mounting surface and on which a first electrode and a second electrode are disposed, a second surface opposing the first surface, and side surfaces located between the first surface and the second surface, the first electrode and the second electrode being connected to the first circuit pattern and the second circuit pattern, respectively; a wavelength conversion film disposed on the second surface of the semiconductor LED chip; a side surface inclined portion disposed on the side surfaces of the semiconductor LED chip, providing surfaces inclined inwardly toward the mounting surface of the package substrate, and comprising a light-transmitting resin containing a light dispersing material; and a side surface reflection portion disposed on the mounting surface of the package substrate to surround the side surface inclined portion. - View Dependent Claims (12, 13, 14, 15)
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16. A semiconductor light-emitting device comprising:
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a substrate; a semiconductor light-emitting diode (LED) chip mounted on the substrate, having a first surface which faces the substrate, a second surface opposing the first surface, and side surfaces connecting the first surface and the second surface; a wavelength conversion film disposed on the second surface of the semiconductor LED chip; and a side surface structure disposed on the side surfaces of the semiconductor LED chip configured to reflect light emitted from the semiconductor LED chip toward the wavelength conversion film, and comprising a light-transmitting resin containing a wavelength conversion material or a light dispersing material which is different from the wavelength conversion material.
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Specification