MULTI-SENSOR ASSEMBLY

• US 20160245706A1
• Filed: 02/24/2015
• Published: 08/25/2016
• Est. Priority Date: 02/24/2015
• Status: Active Grant

• Current Assignee: NXP B.V. (NXP Semiconductors NV)
• Original Assignee: NXP B.V. (NXP Semiconductors NV)
• Inventors: Zivkovic, Zoran, Phan Le, Kim, Suy, Hilco
• Granted Patent: US 9,909,930 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G01K 3/08 giving differences of values using thermoelectric elements G01K7/02; giving differentiated values
• CPC Class Codes: G01K 7/16 using resistive elements resistive elements per se H01C, H01L
• CPC Class Codes: G01K 7/427 Temperature calculation based on spatial modeling, e.g. spatial inter- or extrapolation
• CPC Class Codes: H04M 17/026 Constructional features
• CPC Class Codes: H04M 2250/12 including a sensor for measuring a physical value, e.g. temperature or motion telephones including GPS signal receivers H04M2250/10
• CPC Class Codes: H05K 1/0201 Thermal arrangements, e.g. for cooling, heating or preventing overheating
• CPC Class Codes: H05K 2201/10151 Sensor

Abstract

One example discloses a multi-sensor assembly, comprising: a first temperature sensor, having a first thermal profile; a second temperature sensor, having a second thermal profile different from the first thermal profile; wherein the first and second temperature sensors are mounted on a set of lead-frames; wherein the first and second temperature sensors include a first heat path input coupled to an ambient environment, and a second heat path input coupled to at least one of the lead-frames; and wherein the first and second sensors and set of lead-frames are included in a single multi-sensor assembly. Another example discloses a method of manufacture for the multi-sensor assembly.

Claims

1. A multi-sensor assembly, comprising:

a first temperature sensor, having a first thermal profile;

a second temperature sensor, having a second thermal profile different from the first thermal profile;

wherein the first and second temperature sensors are mounted on a set of lead-frames;

wherein the first and second temperature sensors include a first heat path input coupled to an ambient environment, and a second heat path input coupled to at least one of the lead-frames; and

wherein the first and second sensors and set of lead-frames are included in a single multi-sensor assembly.

2. The assembly of claim 1:

wherein the first thermal profile includes a first thermal resistance;

wherein the second thermal profile includes a second thermal resistance; and

wherein the first thermal resistance is different from the second thermal resistance.

3. The assembly of claim 1:

wherein the first thermal profile includes a first heat capacity;

wherein the second thermal profile includes a second heat capacity; and

wherein the first heat capacity is different from the second heat capacity.

4. The assembly of claim 1:

further comprising, an isolation layer, having a thermal resistance;

wherein the second temperature sensor is coupled to the second heat path input through the isolation layer;

wherein the first temperature sensor is not coupled to the second heat path input through the isolation layer; and

wherein the first and second temperature sensors are not coupled to the first heat path input through the isolation layer.

5. The assembly of claim 4:

wherein a first side of the isolation layer is coupled to a top of the first temperature sensor and the second temperature sensor is coupled to a second side of the isolation layer, thereby forming a stacked first and second temperature sensor configuration.

6. The assembly of claim 4:

wherein one side of the isolation layer is coupled to a second lead-frame and the second temperature sensor is coupled to another side of the isolation layer; and

wherein one side of an adhesive layer is coupled to a first lead-frame and the first temperature sensor is coupled to another side of the adhesive layer, thereby forming a side-by-side first and second temperature sensor configuration.

7. The assembly of claim 6:

wherein a thickness of the isolation layer is greater than that of a thickness of the adhesive layer.

8. The assembly of claim 1:

wherein a thickness of the isolation layer is at least 50 μ

m.

9. The assembly of claim 6:

wherein a thermal resistance of the isolation layer is greater than that of a thermal resistance of the adhesive layer.

10. The assembly of claim 1:

wherein the first temperature sensor includes a band-gap temperature sensor and the second temperature sensor includes a resistive-wire temperature sensor.

11. The assembly of claim 1:

wherein the multi-sensor assembly is substantially surrounded by an encapsulant.

12. The assembly of claim 11:

wherein the encapsulant includes an opening exposing the second temperature sensor.

13. The assembly of claim 1:

further comprising a processor coupled to the first and second temperature sensors and configured to filter the second heat path input from the first heat path input.

14. The assembly of claim 1:

further comprising a second isolation layer and a third temperature sensor; and

wherein a first side of the second isolation layer is coupled to a top of the second temperature sensor and the third temperature sensor is coupled to a second side of the second isolation layer, thereby forming a triple-stacked first, second and third temperature sensor configuration.

15. A method of manufacture, for a multi-sensor assembly, comprising:

fabricating a first temperature sensor, having a first thermal profile;

fabricating a second temperature sensor, having a second thermal profile different from the first thermal profile;

forming a first heat path between an ambient environment and the first and second temperature sensors;

forming a second heat path between a set of lead-frames and the first and second temperature sensors; and

including the first and second sensors and set of lead-frames in a single multi-sensor assembly.

17. The method of claim 19, further comprising:

coupling a first side of the isolation layer to a top of the first temperature sensor; and

coupling the second temperature sensor to a second side of the isolation layer, thereby forming a stacked first and second temperature sensor configuration.

16. The method of claim 17, further comprising:

adding an isolation layer in the second heat path between at least one of the lead-frames and the second temperature sensor.

18. The method of claim 17, further comprising:

coupling one side of the isolation layer to a second lead-frame;

coupling the second temperature sensor to another side of the isolation layer;

coupling one side of an adhesive layer to a first lead-frame; and

coupling the first temperature sensor to another side of the adhesive layer, thereby forming a side-by-side first and second temperature sensor configuration.