OPTICAL COUPLING DEVICE, MANUFACTURING METHOD THEREOF, AND POWER CONVERSION SYSTEM

• US 20160245996A1
• Filed: 11/16/2015
• Published: 08/25/2016
• Est. Priority Date: 02/25/2015
• Status: Active Grant

• Current Assignee: Renesas Electronics Corporation
• Original Assignee: Renesas Electronics Corporation
• Inventors: NOMURA, Yukio
• Granted Patent: US 9,831,226 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 31/167 the light sources and the devices sensitive to radiation all being semiconductor devices characterised by potential barriers
• CPC Class Codes: H01L 33/54 having a particular shape

Abstract

In order to improve properties, an optical coupling device has a potting resin and an internal mold resin between a light emitting element and a light receiving element. The internal mold resin is a cured product of a composition having an epoxy resin and a curing agent, and is a resin having a light transmission property. Additionally, the internal mold resin MRI contains an aromatic ring and an alicyclic compound. By thus lowering the ratio of an aromatic ring in the epoxy resin, deterioration of the resin can be suppressed. Thereby, a decrease in the light transmission property of the epoxy resin cured product can be suppressed, and degradation of the transmission performance for an optical signal can be reduced.

Claims

1. An optical coupling device comprising:

a first element mounted over a first mounting part;

a first lead electrically coupled to the first element;

a first resin covering the first element;

a second element mounted over a second mounting part;

a second lead electrically coupled to the second element; and

a second resin arranged between the second element and the first resin,

wherein the second resin is a cured product of a composition having an epoxy resin and a curing agent, and has a light transmission property, and

wherein the second resin contains an aromatic ring and an alicyclic compound.

2. The optical coupling device according to claim 1,

wherein the second resin excludes an aromatic ring.

3. The optical coupling device according to claim 1,

wherein the epoxy resin is an epoxy resin represented by the formula (1):

4. The optical coupling device according to claim 3,

wherein the curing agent excludes an aromatic ring.

5. The optical coupling device according to claim 1,

wherein the first resin is a silicone resin cured product.

6. The optical coupling device according to claim 1,

wherein a transmittance per mm of a thickness of the second resin is 10% or more for light having a wavelength within a range of 700 nm to 1000 nm.

7. The optical coupling device according to claim 1,

wherein a reflectance per mm of the thickness of the second resin is 90% or less for light having a wavelength within a range of 700 nm to 1000 nm.

8. A manufacturing method of an optical coupling device, comprising the steps of:

(a) providing both a first lead frame having a first mounting part and a first lead and a second lead frame having a second mounting part and a second lead;

(b) mounting a first element over the first mounting part;

(c) forming a first resin over the first element;

(d) mounting a second element over the second mounting part; and

(e) facing the first resin over the first element and the second element with each other so as to form a second resin between the second element and the first resin,

wherein the second resin is a cured product of a composition having an epoxy resin and a curing agent, and has a light transmission property, and

wherein the epoxy resin contains an aromatic ring and an alicyclic compound.

9. The manufacturing method of an optical coupling device according to claim 8,

wherein the (e) step is a step of forming the second resin by thermally curing the epoxy resin with the curing agent.

10. The manufacturing method of an optical coupling device according to claim 8,

wherein the epoxy resin excludes an aromatic ring.

11. The manufacturing method of an optical coupling device according to claim 8,

wherein the epoxy resin is an epoxy resin represented by the formula (1):

12. The manufacturing method of an optical coupling device according to claim 11,

wherein the curing agent excludes an aromatic ring.

13. The manufacturing method of an optical coupling device according to claim 8,

wherein the first resin is a silicone resin cured product.

14. The manufacturing method of an optical coupling device according to claim 8,

wherein a transmittance per mm of a thickness of the second resin is 10% or more for light having a wavelength within a range of 700 nm to 1000 nm.

15. The manufacturing method of an optical coupling device according to claim 8,

wherein a reflectance per mm of the thickness of the second resin is 90% or less for light having a wavelength within a range of 700 nm to 1000 nm.

16. A power conversion system comprising an amplifier circuit part and an optical coupling part to be coupled to the amplifier circuit part,

wherein the optical coupling part has:

a first element mounted over a first mounting part;

a first lead electrically coupled to the first element;

a first resin covering the first element;

a second element mounted over a second mounting part;

a second lead electrically coupled to the second element; and

a second resin arranged between the second element and the first resin, and

wherein the second resin is a cured product of a composition having an epoxy resin and a curing agent, and has a light transmission property, and

wherein the second resin contains an aromatic ring and an alicyclic compound.