Compensation Of Bondwires In The Microwave Regime

• US 20160247752A1
• Filed: 02/25/2015
• Published: 08/25/2016
• Est. Priority Date: 02/25/2015
• Status: Active Grant

• Current Assignee: the united states of america as represented by the secretary of the navy
• Original Assignee: the united states of america as represented by the secretary of the navy
• Inventors: Chieh, Jia-Chi Samuel
• Granted Patent: US 10,014,276 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 2223/6611 Wire connections
• CPC Class Codes: H01L 2224/45014 Ribbon connectors, e.g. rectangular cross-section
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48105 Connecting bonding areas at different heights
• CPC Class Codes: H01L 2224/48135 Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 23/49838 Geometry or layout
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 24/85 using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/00015 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art
• CPC Class Codes: H01L 2924/206 Length ranges
• CPC Class Codes: H01L 2924/207 Diameter ranges
• CPC Class Codes: H01L 2924/30107 Inductance

Abstract

A method for connecting an integrated circuit (IC) to a printed circuit board (PCB) can include the steps of fixing the IC and the PCB to a dielectric substrate. A single wire bond can be used to bond the IC to the PCB, and a ground plane can be established for the PCB. To minimize inductance losses at high frequency operation, a ground plane defect can be intentionally established by forming at least one opening in the ground plane. The opening can be rectangular when viewed in top plan, although the number of openings formed and opening geometry can be chosen according to the desired operating frequency of the device. The defect can allow for single wire bonding of the IC to the PCB in a manner which allows for high frequency operation without requiring the integration of additional matching network components on the IC and PCB.

Claims

1. A method for interfacing an IC to a PCB for a device, comprising the steps of:

A) fixing said IC to a dielectric substrate;

B) fastening said PCB to said substrate;

C) bonding said IC to said PCB with a wire bond;

D) establishing a ground plane for said PCB; and

,

E) defecting said ground plane.

2. The method of claim 1, wherein said step E) is accomplished by forming at least one opening in said ground plane.

3. The method of claim 2, wherein said opening from said step E) has a geometry when viewed in top plan, and said geometry is selected according to a desired operating frequency for said device.

4. The method of claim 2, wherein said substrate from said step B) has a thickness and said opening from said step E) has a geometry, and said geometry is selected according to the thickness of said substrate.

5. The method of claim 3 wherein said opening geometry is selected from the group consisting of crescents, rectangles, ovals and triangles.

6. The method of claim 5 wherein said operating frequency is in the microwave frequency and said opening is said rectangular geometry.

7. A method for extending the operating frequency range of device, said device having an IC and a PCB interconnected with a groundwire, and said PCB further having a ground plane, said method comprising the step of establishing a defect in said ground plane.

8. The method of claim 7, wherein said IC has an IC network inductance and said PCB has a PCB network inductance, and said method is accomplished without matching said IC network and PCB network inductances.

9. The method of claim 8, wherein said operating device in in the microwave region and said geometry is a rectangle.

10. The method of claim 9 wherein said opening has a geometry when viewed in top plan, and further wherein said geometry is selected from the group consisting of ovals, crescents, triangles and rectangles.

15. The device of claim 10 wherein said operating frequency is in the microwave frequency and said opening is a rectangle.

11. A device, comprising:

a dielectric substrate;

an IC fixed to said substrate;

a PCB fixed to said substrate;

a bondwire connected to said IC and to said PCB;

a ground plane electrically connected to said PCB; and

,

said ground plane formed with a defect.

12. The device of claim 11, wherein said defect has a geometry when viewed in top plan, and further wherein said geometry of said opening is selected according to the desired operating frequency for said device.

13. The device of claim 12, wherein said geometry of said opening is selected according to the thickness of said substrate.

14. The device of claim 12 wherein said opening geometry is selected from the group consisting crescents, rectangles, ovals and triangles.