LIGHT EMITTING DEVICE AND THE MANUFACTURING METHOD THEREOF
First Claim
1. A light emitting device, comprising:
- a semiconductor light emitting unit; and
a light-transmitting substrate, comprising;
an upper surface having two long sides and two short sides, the semiconductor light emitting unit is disposed on the upper surface; and
a side surface comprising two first surfaces, two second surfaces, and rough micro-structures, each of the first surfaces is connected to one of the two long sides, each of the second surfaces is connected to one of the two short sides, the rough micro-structures are formed on the two first surfaces and the two second surfaces, wherein a covering rate of the rough micro-structures on each of the first surfaces is greater than or equal to a covering rate of the rough micro-structures on each of the second surfaces.
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Accused Products
Abstract
A light emitting device includes a semiconductor light emitting unit and a light-transmitting substrate. The light-transmitting substrate includes an upper surface having two long sides and two short sides and a side surface, and the semiconductor light emitting unit is disposed on the upper surface. The side surface includes two first surfaces, two second surfaces, and rough micro-structures. Each of the first surfaces is connected to one of the long sides of the upper surface, and each of the second surfaces is connected to one of the short sides of the upper surface. The rough micro-structures are formed on the first surfaces and the second surfaces, a covering rate of the rough micro-structures on each of the first surfaces is greater than or equal to a covering rate of the rough micro-structures on each of the second surfaces. A manufacturing method of the light emitting device is also provided.
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Citations
26 Claims
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1. A light emitting device, comprising:
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a semiconductor light emitting unit; and a light-transmitting substrate, comprising; an upper surface having two long sides and two short sides, the semiconductor light emitting unit is disposed on the upper surface; and a side surface comprising two first surfaces, two second surfaces, and rough micro-structures, each of the first surfaces is connected to one of the two long sides, each of the second surfaces is connected to one of the two short sides, the rough micro-structures are formed on the two first surfaces and the two second surfaces, wherein a covering rate of the rough micro-structures on each of the first surfaces is greater than or equal to a covering rate of the rough micro-structures on each of the second surfaces. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A method for manufacturing a light emitting device, comprising:
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providing a wafer, the wafer comprises a flat edge; cutting the wafer along a first direction by a cutting light beam, the first direction is substantially perpendicular or nearly perpendicular to the flat edge; and cutting the wafer along a second direction by the cutting light beam, so as to form a plurality of light emitting devices, the second direction is substantially parallel or nearly parallel to the flat edge, wherein each of the light emitting devices comprises; a semiconductor light emitting unit; and a light-transmitting substrate, comprising; an upper surface having two long sides and two short sides, the two long sides are parallel to the first direction, the two short sides are parallel to the second direction, the semiconductor light emitting unit is disposed on the upper surface; and a side surface comprising two first surfaces, two second surfaces, and rough micro-structures, each of the first surfaces is connected to one of the two long sides, each of the second surfaces is connected to one of the two short sides, the rough micro-structures are formed on the two first surfaces and the two second surfaces through the cutting light beam, wherein a covering rate of the rough micro-structures on each of the first surfaces is greater than or equal to a covering rate of the rough micro-structures on each of the second surfaces. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
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Specification