SEMICONDUCTOR COMPONENT AND METHOD OF PRODUCING A SEMICONDUCTOR COMPONENT
First Claim
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1. A method of producing a semiconductor component comprising:
- a) providing an optoelectronic semiconductor chip;
b) applying a molding compound for an optical element, wherein the molding compound is based on a highly refractive polymer material;
c) precuring the molding compound at a temperature of at most 50°
C.; and
d) curing the molding compound.
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Abstract
A method of producing a semiconductor component includes providing an optoelectronic semiconductor chip; applying a molding compound for an optical element, wherein the molding compound is based on a highly refractive polymer material; precuring the molding compound at a temperature of at most 50° C.; and curing the molding compound.
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Citations
6 Claims
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1. A method of producing a semiconductor component comprising:
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a) providing an optoelectronic semiconductor chip; b) applying a molding compound for an optical element, wherein the molding compound is based on a highly refractive polymer material; c) precuring the molding compound at a temperature of at most 50°
C.; andd) curing the molding compound. - View Dependent Claims (2, 3, 4, 5, 6)
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Specification