THREE DIMENSIONAL (3D) ANTENNA STRUCTURE

• US 20160248149A1
• Filed: 02/20/2015
• Published: 08/25/2016
• Est. Priority Date: 02/20/2015
• Status: Abandoned Application

• Current Assignee: Qualcomm, Inc.
• Original Assignee: Qualcomm, Inc.
• Inventors: Kim, Daeik Daniel, Berdy, David Francis, Velez, Mario Francisco, Zuo, Chengjie, Yun, Changhan Hobie, Kim, Jonghae
• Application Number:
  US14/627,863
• Publication Number:
  US 20160248149A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 1/36 Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewithH01Q1/08, H01Q1/14 take precedence
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• CPC Class Codes: H05K 1/115 Via connections; Lands around holes or via connections H05K1/112 takes precedence
• CPC Class Codes: H05K 1/119 Details of rigid insulating substrates therefor, e.g. three-dimensional details H05K1/117 takes precedence
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 2201/0979 Redundant conductors or connections, i.e. more than one current path between two points
• CPC Class Codes: H05K 2201/09845 Stepped hole, via, edge, bump or conductor
• CPC Class Codes: H05K 2201/10098 Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas

Abstract

An apparatus includes a substrate package and a three dimensional (3D) antenna structure formed in the substrate package. The 3D antenna structure includes multiple substructures to enable the 3D antenna structure to operate as a beam-forming antenna. Each of the multiple substructures has a slanted-plate configuration or a slanted-loop configuration.

Claims

1. An apparatus comprising:

a substrate package; and

a three dimensional (3D) antenna structure formed in the substrate package, the 3D antenna structure including multiple substructures, wherein at least one of the multiple substructures has a slanted-plate configuration or a slanted-loop configuration.

2. The apparatus of claim 1, wherein the substrate package is a multi-layered substrate package.

3. The apparatus of claim 1, wherein, for each of the multiple substructures having the slanted-plate configuration, each of the multiple substructures having the slanted-plate configuration comprises:

a first metal layer formed on a first layer of the substrate package;

a second metal layer formed on a second layer of the substrate package, wherein the second metal layer is offset relative to the first metal layer; and

a via structure that couples the first metal layer to the second metal layer.

4. The apparatus of claim 1, wherein, for each of the multiple substructures having the slanted-loop configuration, each of the multiple substructures having the slanted-loop configuration comprises:

a first metal layer formed on a first layer of the substrate package;

a second metal layer formed on a second layer of the substrate package;

a first via structure that couples the first metal layer to the second metal layer;

a third metal layer formed on the second layer of the substrate package;

a second via structure that couples the first metal layer to the third metal layer; and

a fourth metal layer formed on a third layer of the substrate package, wherein the first metal layer is coupled to the fourth metal layer via a first path that includes the second metal layer and the first via structure, and wherein the first metal layer is coupled to the fourth metal layer via a second path that includes the third metal layer and the second via structure.

5. The apparatus of claim 1, wherein the multiple substructures include two or more distinct substructures.

6. The apparatus of claim 1, wherein the 3D antenna structure is configured to transmit a millimeter (mm) wave signal.

7. The apparatus of claim 1, wherein the 3D antenna structure is configured to operate within a range of 40 gigahertz (GHz) to 100 GHz.

8. The apparatus of claim 1, wherein the 3D antenna structure has a directionality range of greater than 30 degrees.

9. The apparatus of claim 1, further comprising an antenna array formed in the substrate package, wherein the antenna array includes the 3D antenna structure.

10. The apparatus of claim 1, further comprising wireless interface circuitry coupled to the 3D antenna structure, wherein the wireless interface circuitry is configured to independently control signals provided to each of the multiple substructures.

11. A method of forming an antenna, the method comprising:

forming a first substructure of a three dimensional (3D) antenna structure in a substrate package, wherein the first substructure has a configuration of a slanted-plate configuration or a slanted-loop configuration; and

forming a second substructure of the 3D antenna structure in the substrate package, wherein the second substructure has the same configuration as the first substructure, and wherein the first substructure and the second substructure enable the 3D antenna structure to operate as a beam-forming antenna.

12. The method of claim 11, further comprising forming a third substructure of the 3D antenna structure in the substrate package, wherein the third substructure has the same configuration as the first substructure.

13. The method of claim 12, further comprising forming a fourth substructure of the 3D antenna structure in the substrate package, wherein the fourth substructure has the same configuration as the first substructure.

14. The method of claim 11, wherein, when the configuration is the slanted-loop configuration, forming the first substructure comprises:

forming a first metal layer on a first layer of the substrate package;

forming a first via structure and a second via structure coupled to the first metal layer;

forming a second metal layer and a third metal layer on a second layer of the substrate package, where the second metal layer is coupled to the first via structure, and wherein the third metal layer is coupled to the second via structure; and

forming a fourth metal layer on a third layer of the substrate package, wherein the first metal layer is coupled to the fourth metal layer via a first path that includes the second metal layer and the first via structure, and wherein the first metal layer is coupled to the fourth metal layer via a second path that includes the third metal layer and the second via structure.

15. The method of claim 11, wherein, when the configuration is the slanted-plate configuration, forming the first substructure comprises:

forming a first metal layer formed on a first layer of the substrate package;

forming a second metal layer formed on a second layer of the substrate package, wherein the second metal layer is offset relative to the first metal layer; and

forming a via structure that couples the first metal layer to the second metal layer.

16. An apparatus comprising:

a substrate package; and

a three dimensional (3D) antenna structure formed in the substrate package, the 3D antenna structure including a substructure, the substructure comprising;

a first metal layer formed on a first layer of the substrate package;

a second metal layer formed on a second layer of the substrate package;

a first via structure that couples the first metal layer to the second metal layer;

a third metal layer formed on the second layer of the substrate package;

a second via structure that couples the first metal layer to the third metal layer; and

a fourth metal layer formed on a third layer of the substrate package, wherein the first metal layer is coupled to the fourth metal layer via a first path that includes the second metal layer and the first via structure, and wherein the first metal layer is coupled to the fourth metal layer via a second path that includes the third metal layer and the second via structure.

17. The apparatus of claim 16, wherein the substrate package is a multi-layered substrate package.

18. The apparatus of claim 16, wherein the substructure has a slanted-loop configuration.

19. The apparatus of claim 16, wherein the 3D antenna structure includes multiple substructures, and wherein each substructure of the multiple substructures has a slanted-loop configuration.

20. The apparatus of claim 16, wherein the substructure is configured to enable the 3D antenna structure to operate as a beam-forming antenna.

21. The apparatus of claim 16, wherein the first metal layer is coupled to a first contact, and wherein the fourth metal layer is coupled to a second contact.

22. The apparatus of claim 16, wherein the substructure further comprises:

a fifth metal layer formed on a fourth layer of the substrate package;

a sixth metal layer formed on the fourth layer of the substrate package;

a third via structure that couples the fourth metal layer to the fifth metal layer; and

a fourth via structure that couples the fourth metal layer to the fifth metal layer.

23. The apparatus of claim 22, wherein the fourth layer of the substrate is positioned between the second layer and the third layer, and wherein the substructure further comprises:

a fifth via structure that couples the second metal layer to the fifth metal layer; and

a sixth via structure that couples the third metal layer to the sixth metal layer.

24. The apparatus of claim 22, wherein the fifth metal layer is L-shaped, and wherein the sixth metal layer is L-shaped.

25. The apparatus of claim 16, further comprising an antenna array, wherein the antenna array includes the 3D antenna structure.

26. A method of forming a three dimensional (3D) antenna structure, the method comprising:

forming a first metal layer on a first layer of a substrate package;

forming a first via structure and a second via structure coupled to the first metal layer;

forming a second metal layer and a third metal layer on a second layer of the substrate package, where the second metal layer is coupled to the first via structure, and wherein the third metal layer is coupled to the second via structure; and

forming a fourth metal layer on a third layer of the substrate package, wherein the first metal layer is coupled to the fourth metal layer via a first path that includes the second metal layer and the first via structure, and wherein the first metal layer is coupled to the fourth metal layer via a second path that includes the third metal layer and the second via structure.

27. The method of claim 26, wherein the first path is distinct from the second path.

28. The method of claim 26, wherein the second layer of the substrate is positioned between the first layer and the third layer.

29. The method of claim 26, wherein the first metal layer is U-shaped, and wherein the fourth metal layer is U-shaped.

30. The method of claim 26, wherein the second metal layer is L-shaped, and wherein the third metal layer is L-shaped.