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STACK PACKAGE AND SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE INCLUDING A VARIABLE VOLTAGE

  • US 20160254213A1
  • Filed: 06/05/2015
  • Published: 09/01/2016
  • Est. Priority Date: 02/27/2015
  • Status: Active Grant
First Claim
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1. A stack package comprising:

  • a first chip including a first internal circuit unit driven by an internal voltage;

    a second chip including a second internal circuit unit driven by the internal voltage, the second chip stacked over the first chip;

    an interconnecting unit electrically coupled between the first chip and the second chip; and

    an interface circuit unit arranged in the first chip and the second chip, the interface circuit unit coupled to the interconnecting unit,wherein a portion of the interface circuit unit is configured to receive a variable voltage different from the internal voltage as a driving voltage.

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