LIGHT EMITTING DEVICE AND FABRICATING METHOD THEREOF

• US 20160254428A1
• Filed: 02/17/2016
• Published: 09/01/2016
• Est. Priority Date: 05/07/2014
• Status: Abandoned Application

• Current Assignee: Genesis Photonics Inc.
• Original Assignee: Genesis Photonics Inc.
• Inventors: Ting, Shao-Ying, Huang, Jing-En, Huang, Yi-Ru, Huang, Kuan-Chieh
• Application Number:
  US15/046,407
• Publication Number:
  US 20160254428A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/20 Structure, shape, material or disposition of high density interconnect preforms
• CPC Class Codes: H01L 2933/005 relating to encapsulations
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/0093 Wafer bonding; Removal of the growth substrate
• CPC Class Codes: H01L 33/38 with a particular shape
• CPC Class Codes: H01L 33/387 with a plurality of electrode regions in direct contact with the semiconductor body and being electrically interconnected by another electrode layer
• CPC Class Codes: H01L 33/46 Reflective coating, e.g. dielectric Bragg reflector
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light emitting device including a circuit board, a light emitting unit, and an anisotropic conductive layer is provided. The circuit board includes a plurality of electrode pads. The light emitting unit includes a semiconductor epitaxial structure layer, a first electrode, and a second electrode. The first electrode and the second electrode are respectively disposed on the same side of the semiconductor epitaxial structure layer. The first electrode and the second electrode are electrically connected to the electrode pads through the anisotropic conductive layer. A fabricating method of a light emitting device is also provided.

Claims

1. A light emitting device, comprising:

a circuit board, comprising a plurality of electrode pads;

a light emitting unit, comprising a semiconductor epitaxial structure layer, a first electrode, and a second electrode, wherein the first electrode and the second electrode are respectively disposed on the same side of the semiconductor epitaxial structure layer; and

an anisotropic conductive layer, wherein the first electrode and the second electrode are electrically connected with the electrode pads through the anisotropic conductive layer.

2. The light emitting device as claimed in claim 1, wherein the light emitting unit further comprises a substrate, the semiconductor epitaxial structure layer is disposed on the substrate, and the first electrode and the second electrode are disposed on a side of the semiconductor epitaxial structure layer away from the substrate.

3. The light emitting device as claimed in claim 1, further comprising a light transmissive layer, wherein the light emitting unit is disposed on the light transmissive layer, the light emitting unit is disposed between the light transmissive layer and the first electrode and between the light transmissive layer and the second electrode.

4. The light emitting device as claimed in claim 1, further comprising an encapsulant, encapsulating the light emitting unit and at least exposing a part of the first electrode and a part of the second electrode.

5. The light emitting device as claimed in claim 1, wherein the anisotropic conductive layer comprises an insulating paste and a plurality of conductors distributed in the insulating paste.

6. A fabricating method of a light emitting device, comprising:

providing a circuit board comprising a plurality of electrode pads;

providing a light emitting unit, wherein the light emitting unit comprises a semiconductor epitaxial structure layer and a first electrode and a second electrode disposed on the semiconductor epitaxial structure layer;

attaching an anisotropic conductive layer to the circuit board or the light emitting unit;

aligning the first electrode and the second electrode to the electrode pads; and

performing a process on the anisotropic conductive layer, such that the first electrode and the second electrode are electrically connected with the electrode pads.

7. The fabricating method of the light emitting device as claimed in claim 6, wherein the process comprises pressing parts of the anisotropic conductive layer corresponding to the first electrode and the second electrode, such that the parts of the anisotropic conductive layer corresponding to the first electrode and the second electrode are respectively electrically connected with the first electrode and the second electrode.

8. The fabricating method of the light emitting device as claimed in claim 6, wherein the process comprises heating parts of the anisotropic conductive layer corresponding to the first electrode and the second electrode, such that the parts of the anisotropic conductive layer corresponding to the first electrode and the second electrode are respectively electrically connected with the first electrode and the second electrode.

9. The fabricating method of the light emitting device as claimed in claim 6, wherein the light emitting unit further comprises a substrate, the semiconductor epitaxial structure layer is disposed on the substrate, and the fabricating method of the light emitting device further comprises removing the substrate after electrically connecting the first electrode and the second electrode with the electrode pads.

10. The fabricating method of the light emitting device as claimed in claim 9, wherein a process of removing the substrate comprises removing the substrate by performing a laser lift-off process.

11. The fabricating method of the light emitting device as claimed in claim 6, wherein the anisotropic conductive layer comprises an insulating paste and a plurality of conductors distributed in the insulating paste.

12. A light emitting device, comprising:

a circuit board;

a light emitting unit, comprising;

a substrate;

a semiconductor epitaxial structure layer, disposed on the substrate; and

a first electrode and a second electrode, respectively disposed on the same side of the semiconductor epitaxial structure layer;

a light transmissive layer, wherein the light emitting unit is disposed on the light transmissive layer;

an encapsulant, located between the light transmissive layer and the light emitting unit, encapsulating the light emitting unit, and exposing at least a part of the first electrode and a part of the second electrode, wherein the first electrode and the second electrode respectively extend outward from the semiconductor epitaxial structure layer and respectively cover a part of an upper surface of the encapsulant; and

an anisotropic conductive layer, wherein the first electrode and the second electrode are electrically connected with the circuit board through the anisotropic conductive layer.

13. The light emitting device as claimed in claim 12, wherein the anisotropic conductive layer comprises an insulating paste and a plurality of conductors distributed in the insulating paste.

14. The light emitting device as claimed in claim 12, wherein the first electrode comprises a first electrode portion connected to the semiconductor epitaxial structure layer and a first electrode extending portion connected to the first electrode portion, and the second electrode comprises a second electrode portion connected to the semiconductor epitaxial structure layer and a second electrode extending portion connected to the second electrode portion, and the first electrode extending portion and the second electrode extending portion respectively extend outward to at least a part of the upper surface of the encapsulant.

15. The light emitting device as claimed in claim 14, wherein the first electrode extending portion and the second electrode extending portion are aligned with or retracted from an edge of the upper surface of the encapsulant.

16. The light emitting device as claimed in claim 14, wherein the first electrode extending portion comprises a plurality of first grating type electrodes, and the second electrode extending portion comprises a plurality of second grating type electrodes, the first grating type electrodes are distributed on the first electrode portion and a part of the upper surface of the encapsulant, and the second grating type electrodes are distributed on the second electrode portion and a part of the upper surface of the encapsulant.

17. The light emitting device as claimed in claim 14, wherein the first electrode extending portion comprises a plurality of first grating type electrodes, and the second electrode extending portion comprises a plurality of second grating type electrodes, the first grating type electrodes are distributed on the first electrode portion and a part of the upper surface of the encapsulant, and the second grating type electrodes are distributed on the second electrode portion and a part of the upper surface of the encapsulant.