An encapsulation method of OLED and a structure of OLED

• US 20160254481A1
• Filed: 09/22/2014
• Published: 09/01/2016
• Est. Priority Date: 09/16/2014
• Status: Active Grant

• Current Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd. (TCL Technology Group Corp.)
• Original Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd. (TCL Technology Group Corp.)
• Inventors: ZENG, Weijing, LIU, Yawei
• Granted Patent: US 9,614,176 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H10K 2102/00 Constructional details relating to the organic devices covered by this subclass
• CPC Class Codes: H10K 50/80 Constructional details
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 50/846 comprising getter material or desiccants
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass
• CPC Class Codes: H10K 85/10 Organic polymers or oligomers
• CPC Class Codes: H10K 85/324 comprising aluminium, e.g. Alq3
• CPC Class Codes: H10K 85/40 Organosilicon compounds, e.g. TIPS pentacene

Abstract

The invention provides an encapsulation method of OLED and a structure of OLED, and the method comprises: step 1: providing a glass cover and an encapsulating substrate, and the glass cover comprising a display area and an edge area surrounding the display area; step 2: forming a layer of SiN_x on the edge area of the glass cover; step 3: self-arranging a layer of hydrophobic monomer on the display area surface of the glass cover; step 4: coating a circle of glue frame around the display area on the glass cover; step 5: coating desiccant on the layer of hydrophobic monomer on the display area of the glass cover; step 6: attaching the glass cover correspondingly to the substrate in vacuum environment; step 7: illuminating by UV light to cure the glue frame to achieve the glass cover encapsulating the substrate.

Claims

1. An encapsulation method for OLED, comprising following steps:

step 1;

providing a glass cover and an encapsulating substrate, and the glass cover comprising a display area and an edge area surrounding the display area;

step 2;

forming a layer of SiN_x on the edge area of the glass cover;

step 3;

self-arranging a layer of hydrophobic monomer on the display area surface of the glass cover;

step 4;

coating a circle of glue frame around the display area on the glass cover;

step 5;

coating desiccant on the layer of hydrophobic monomer on the display area of the glass cover;

step 6;

attaching the glass cover correspondingly to the substrate;

step 7;

illuminating by UV light to cure the glue frame to achieve the glass cover encapsulating the substrate.

2. The encapsulation method for OLED according to claim 1, wherein, the substrate can be an OLED substrate;

a method of self-arranging the layer of hydrophobic monomer in the step 3 is solution immersion method or evaporation.

3. The encapsulation method for OLED according to claim 1, wherein, the layer of hydrophobic monomer in step 3 is silane-system molecular, which is n-propyltrichlorosilane, Trichlorooctadecylsilane, Trichlorodecylsilane, n-Decyltrimethoxysilane, n-Decyltriethoxysilane, or n-Decyltri(methoxyethoxy)silane.

4. The encapsulation method for OLED according to claim 1, wherein, the glue frame is coated at the edge of the glass cover in the step 4, and a space is kept from the display area;

the glue frame is UV glue.

5. The encapsulation method for OLED according to claim 1, wherein, screen printing is applied in coating desiccant in the step 5;

the step 6 is processing in vacuum environment.

6. The encapsulation method for OLED according to claim 1, wherein, the desiccant is curable desiccant or non-curable desiccant.

7. The encapsulation method for OLED according to claim 6, wherein, the non-curable desiccant is aluminum polymer, which is [R—

O—

Al═

O]_n (n≧

1);

the curable desiccant is thermo setting liquid desiccant or UV curing liquid desiccant.

8. The encapsulation method for OLED according to claim 6, wherein, when the desiccant is curable desiccant in step 5, heating or UV light illuminating for curing is processing after coating.

9. An OLED structure, comprising a substrate, a glass cover tightly attached to the substrate, and a glue frame positioned between the substrate and the glass cover, which includes a display area and an edge area surrounding the display area, and further includes a layer of SiN_x positioned on the edge area of the glass cover, a layer of hydrophobic monomer self-arranging on the display area surface of the glass cover, and desiccant coated on the layer of hydrophobic monomer on the display area of the glass cover.

10. The encapsulation method for OLED according to claim 9, wherein, the substrate is OLED substrate;

the layer of hydrophobic monomer is silane-system molecular;

the glue frame, which is UV glue, is coated at the edge of the glass cover, and a space is kept from the display area;

the desiccant is curable desiccant or non-curable desiccant.

11. An OLED structure, comprising a substrate, a glass cover tightly attached to the substrate, and a glue frame positioned between the substrate and the glass cover, which includes a display area and an edge area surrounding the display area, and further includes a layer of SiN_x positioned on the edge area of the glass cover, a layer of hydrophobic monomer self-arranging on the display area surface of the glass cover, and desiccant coated on the layer of hydrophobic monomer on the display area of the glass cover;

wherein, the substrate is OLED substrate;

the layer of hydrophobic monomer is silane-system molecular;

the glue frame, which is UV glue, is coated at the edge of the glass cover, and a space is kept from the display area;

the desiccant is curable desiccant or non-curable desiccant.