ANTENNA SYSTEMS AND DEVICES AND METHODS OF MANUFACTURE THEREOF

• US 20160254597A1
• Filed: 10/29/2014
• Published: 09/01/2016
• Est. Priority Date: 10/29/2013
• Status: Active Grant

• Current Assignee: ZOLL Medical Israel Limited (Asahi Kasei Corporation)
• Original Assignee: Kyma Medical Technologies Ltd. (Asahi Kasei Corporation)
• Inventors: WEINSTEIN, Uriel, BERNSTEIN, Assaf
• Granted Patent: US 10,680,324 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 1/40 Radiating elements coated with or embedded in protective material
• CPC Class Codes: H01Q 1/528 reducing the re-radiation of a support structure in a parabolic reflector antenna H01Q19/023
• CPC Class Codes: H01Q 17/001 for modifying the directional characteristic of an aerial
• CPC Class Codes: H01Q 19/104 using a substantially flat reflector for deflecting the radiated beam, e.g. periscopic antennas periscopic fed Cassegrain antennas H01Q19/191; passive relays H04B7/145
• CPC Class Codes: H01Q 19/108 Combination of a dipole with a plane reflecting surface H01Q19/106 takes precedence; strip line H01Q9/065
• CPC Class Codes: H01Q 9/065 Microstrip dipole antennas patch antenna H01Q9/0407

Abstract

Embodiments of the present disclosure provide methods, apparatuses, devices and systems related to the implementation of a multi-layer printed circuit board (PCB) radio-frequency antenna featuring, a printed radiating element coupled to an absorbing element embedded in the PCB. The embedded element is configured within the PCB layers to prevent out-of-phase reflections to the bore-sight direction.

Claims

1-19. -19. (canceled)

20. A printed circuit board (PCB), the PCB comprising:

a PCB structure comprising a plurality of layers, wherein at least one layer is arranged within the PCB structure and comprises one or more radio-frequency (RF) components; and

an absorbing material embedded within the PCB structure and configured to absorb radiation of the one or more RF components.

21. The PCB of claim 20, wherein the one or more RF components comprise an antenna.

22. The PCB of claim 21, wherein the antenna includes a wideband directional antenna.

23. The PCB of claim 22, wherein the wideband directional antenna includes a radiating element backed by a metallic reflector.

24. The PCB of claim 23, wherein a separation distance between the radiating element and the metallic reflector is less than a quarter of the wavelength of the radiation of the one or more RF components.

25. The PCB of claim 20, wherein the one or more RF components comprise a transmitting antenna and a receiving antenna.

26. The PCB of claim 20, wherein the absorbing material is configured to eliminate non-in phase reflection radiation.

27. The PCB of claim 20, wherein the absorbing material is configured to absorb back-lobe radiation from the at least one of the one or more RF components.

28. The PCB of claim 20, wherein the absorbing material is temperature resistant.

29. The PCB of claim 20, wherein the absorbing material comprises at least one of a ferrite material, a magnetic material, a magnetically loaded non-conductive material and a dissipative electrodeposited thin film for planar resistive materials.

30. The PCB of claim 20, wherein the absorbing material comprises a magnetically loaded silicon rubber material.

31. The PCB of claim 20, wherein the plurality of layers include a ceramic, ferrite and/or a polymer.

32. The PCB of claim 20, further comprising a conductive structure configured to at least substantially surround the absorbing material.

33. The PCB of claim 32, wherein the conductive structure includes one or more vias.

34. The PCB of claim 33, wherein the one or more vias are arranged in at least one row.

35. The PCB of claim 33, wherein the one or more vias comprise at least one of through-hole vias, buried vias and blind vias.

36. The PCB of claim 20, further comprising a cavity, a radiating element and one or more vias, the cavity arranged behind the radiating element being enclosed within a structure constructed of at least one of the one or more vias.

37. The PCB of claim 20, further comprising an electrical component including an impedance matching circuitry, an RF front-end circuitry and/or an RF transceiver.

38. The PCB of claim 20, wherein the PCB structure comprises a conductive cover placed over the absorbing material, the conductive cover including at least one of a copper layer and one or more vias.

39. The PCB of claim 20, wherein the absorbing material comprises a first absorbing material arranged over the transmitting antenna and a second absorbing material arranged over the receiving antenna.

40. The PCB of claim 20, wherein the PCB structure comprises an embedded dielectric material.

41. The PCB of claim 20, further comprising one or more RF transmission lines.

42. The PCB of claim 41, further comprising a delay line configured to produce a specific desired delay in transmission of a signal between two of the one or more RF transmission lines.

43. The PCB of claim 20, further comprising at least one of:

one or more circulators and one or more filters.

44. The PCB of claim 20, further comprising a termination material.

45. The PCB of claim 20, wherein a thickness of the absorbing material is less than about a quarter of a wavelength of the radiation.

46. The PCB of claim 20, wherein a thickness of one or more RF components is less than about a quarter of a wavelength of the radiation.

47. A medical device comprising:

a printed circuit board (PCB) structure, the PCB structure including;

a plurality of PCB layers, wherein at least one layer is arranged within the PCB structure and comprises one or more radio-frequency (RF) components; and

an absorbing material embedded within the PCB structure and configured to absorb radiation of the one or more RF components.

48. A medical device comprising:

a printed circuit board (PCB) structure, the PCB structure including;

a plurality of PCB layers, wherein at least one layer is arranged within the PCB structure and comprises one or more radio-frequency (RF) components, the one or more radio-frequency (RF) components comprising at least a transmitting antenna and a receiving antenna;

one or more absorbing materials embedded within the PCB structure and arranged over the one or more RF components to absorb radiation of the one or more RF components.

49. The PCB of claim 48, wherein the absorbing material comprises a first absorbing material arranged over the transmitting antenna and a second absorbing material arranged over the receiving antenna.

50. The PCB of claim 49, wherein the PCB structure comprises a conductive cover placed over the absorbing material, the conductive cover including at least one of a copper layer and one or more vias.