SIGNAL STABILIZATION IN A DIELECTRIC SENSOR ASSEMBLY

• US 20160256113A1
• Filed: 04/04/2016
• Published: 09/08/2016
• Est. Priority Date: 02/01/2013
• Status: Abandoned Application

• Current Assignee: Rescon Ltd.
• Original Assignee: Rescon Ltd.
• Inventors: DAWSON, Thomas Andrew, BASIL, Robert
• Application Number:
  US15/089,611
• Publication Number:
  US 20160256113A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: A61B 2562/0214 Capacitive electrodes
• CPC Class Codes: A61B 5/25 Bioelectric electrodes therefor
• CPC Class Codes: A61B 5/277 Capacitive electrodes
• CPC Class Codes: A61B 5/291 for electroencephalography [EEG]
• CPC Class Codes: A61B 5/296 for electromyography [EMG]
• CPC Class Codes: A61B 5/7225 Details of analog processing, e.g. isolation amplifier, gain or sensitivity adjustment, filtering, baseline or drift compensation A61B5/30, A61B5/316 take precedence; transformers for specific applications H01F38/00; amplifiers H03F
• CPC Class Codes: G01R 29/0814 Field measurements related to measuring influence on or from apparatus, components or humans EMC, EMI and similar testing in general G01R31/001, e.g. in ESD, EMI, EMC, EMP testing, measuring radiation leakage; detecting presence of micro- or radiowave emitters; dosimetry; testing shielding; measurements related to lightning

Abstract

A non-resistive contact sensor assembly includes an electric field sensor device, including a dielectric component for receiving an electrical signal from an object of interest and a signal processing component for processing the electrical signal, a voltage regulator for controlling voltage to the dielectric component and the signal processing component, and a common ground reference for the dielectric component and the signal processing component.

Claims

1. A non-resistive contact sensor assembly, comprising:

an electric field sensor device, including a dielectric component for receiving an electrical signal from an object of interest and an A/D converter for converting the electrical signal received from the object of interest to a digitized signal; and

circuitry interconnecting the dielectric component and the A/D converter and including a layer, directly below the dielectric component, that is substantially entirely ground fill.

2. The non-resistive contact sensor assembly of claim 1, wherein the dielectric component includes an active component and a neutral component.

3. The non-resistive contact sensor assembly of claim 2, further comprising an analog filter for tuning the electrical signal received from the object of interest prior to the conversion of the electrical signal to a digitized signal by the A/D converter.

4. The non-resistive contact sensor assembly of claim 3, wherein the dielectric component, analog filter and A/D converter share a common ground reference.

5. The non-resistive contact sensor assembly of claim 3, wherein the analog filter and the A/D converter share a common voltage reference.

6. The non-resistive contact sensor assembly of claim 3, wherein the signal processing component includes a level shift buffer between the analog filter and the A/D converter.

7. The non-resistive contact sensor assembly of claim 6, wherein the analog filter, the level shift buffer, and the A/D converter share a common voltage reference.

8. The non-resistive contact sensor assembly of claim 2, wherein the A/D converter is less than 50 mm away from the dielectric component.

9. The non-resistive contact sensor assembly of claim 8, wherein the A/D converter is less than 20 mm away from the dielectric component.

10. The non-resistive contact sensor assembly of claim 9, wherein the A/D converter is less than 10 mm away from the dielectric component.

11. The non-resistive contact sensor assembly of claim 10, wherein the A/D converter is electrically connected to a dielectric component signal output by a signal connection that is less than 10 mm in length.

12. The non-resistive contact sensor assembly of claim 2, wherein the A/D converter oversamples the electrical signal at a rate of at least 16 times per sample to enhance signal clarity.

13. The non-resistive contact sensor assembly of claim 12, wherein the A/D converter oversamples the electrical signal at rate of at least 128 times per sample.

14. The non-resistive contact sensor assembly of claim 2, wherein the circuitry has a ground plane top layer, a ground plane bottom layer, and at least a partial ground plane in all layers directly below the dielectric component.

15. The non-resistive contact sensor assembly of claim 2, further comprising a casing in which the signal processing component is surrounded or embedded and wherein a common ground reference is connected to the casing and to the dielectric component.

16. The non-resistive contact sensor assembly of claim 2, wherein circuitry providing voltage and ground reference for the components is implemented in a circuit board.

17. The non-resistive contact sensor assembly of claim 2, wherein circuitry providing voltage and ground reference for the components is implemented in an Application-Specific Integrated Circuit (ASIC).

18. The non-resistive contact sensor assembly of claim 2, wherein circuitry providing voltage and ground reference for the components is implemented in a combination of a circuit board with ASIC components.