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Acoustic Emission Monitoring and Endpoint for Chemical Mechanical Polishing

  • US 20160256978A1
  • Filed: 03/05/2015
  • Published: 09/08/2016
  • Est. Priority Date: 03/05/2015
  • Status: Active Grant
First Claim
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1. A chemical mechanical polishing apparatus, comprising:

  • a platen to support a polishing pad; and

    an in-situ acoustic monitoring system to generate a signal, the in-situ acoustic monitoring system including an acoustic emission sensor supported by the platen and a waveguide positioned to couple the acoustic emission sensor to slurry in a groove in the polishing pad.

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