METHOD OF MEASURING AN ADHESIVE FORCE OF INTERLAYER ADHESIVE LAYER IN TENSILE MODE FOR STACKED SEMICONDUCTOR DEVICE AND APPARATUS FOR MEASURING THE SAME
First Claim
1. A method of measuring an adhesive force of an interlayer adhesive layer for a stacked semiconductor device, the method comprising:
- providing a device under test, the device under test comprising;
a lower test layer;
an upper test layer stacked on the lower test layer and including an overhang that protrudes past an edge of the lower test layer by a predetermined length; and
the interlayer adhesive layer disposed between the lower test layer and the upper test layer and bonded to the lower test layer and the upper test layer;
fixing the lower test layer onto a mounting stage; and
measuring the adhesive force of the interlayer adhesive layer in tensile mode by applying a load to a bottom surface of the overhang of the upper test layer in a first direction.
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Accused Products
Abstract
A method includes providing a device under test, which includes a lower test layer and an upper test layer that is stacked on the lower test layer and includes an overhang protruding past an edge of the lower test layer by a predetermined length, fixing the lower test layer onto a mounting stage, and measuring adhesive force of an interlayer adhesive layer in a tensile mode by applying a load to a bottom surface of the overhang of the upper test layer in a first direction. An apparatus includes a mounting stage fixing the device under test, a load applying tip applying the load to the bottom surface of the overhang, a location adjuster adjusting a distance between the device under test and the load carrying tip, a load cell detecting a magnitude of the applied load, and a controller controlling the location adjuster and the load cell.
9 Citations
27 Claims
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1. A method of measuring an adhesive force of an interlayer adhesive layer for a stacked semiconductor device, the method comprising:
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providing a device under test, the device under test comprising; a lower test layer; an upper test layer stacked on the lower test layer and including an overhang that protrudes past an edge of the lower test layer by a predetermined length; and the interlayer adhesive layer disposed between the lower test layer and the upper test layer and bonded to the lower test layer and the upper test layer; fixing the lower test layer onto a mounting stage; and measuring the adhesive force of the interlayer adhesive layer in tensile mode by applying a load to a bottom surface of the overhang of the upper test layer in a first direction. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. An apparatus for measuring an adhesive force of an interlayer adhesive layer for a stacked semiconductor device, wherein the stacked semiconductor device is a device under test comprising a lower test layer and an upper test layer stacked on the lower test layer, the upper test layer comprising an overhang that protrudes past an edge of the lower test layer by a predetermined length, the lower test layer and the upper test layer being bonded together by the interlayer adhesive layer, the apparatus comprising:
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a mounting stage fixing the device under test; a load applying tip applying a load to a bottom surface of the overhang in a first direction; a location adjuster adjusting a distance between the device under test and the load applying tip to apply the load to the bottom surface of the overhang; a load cell detecting a magnitude of the applied load; and a controller controlling the location adjuster and the load cell. - View Dependent Claims (20, 21, 22, 23, 24, 25, 26, 27)
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Specification