Capacitive Sensors for Electronic Devices and Methods of Forming the Same

• US 20160258981A1
• Filed: 03/06/2015
• Published: 09/08/2016
• Est. Priority Date: 03/06/2015
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Bushnell, Tyler S., Garg, Vikram
• Granted Patent: US 10,006,937 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G01R 1/04 Housings; Supporting members; Arrangements of terminals
• CPC Class Codes: G06F 2203/04102 Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
• CPC Class Codes: G06F 2203/04103 Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
• CPC Class Codes: G06F 3/0443 using a single layer of sensing electrodes
• CPC Class Codes: G06F 3/0445 using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
• CPC Class Codes: G06F 3/0446 using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
• CPC Class Codes: G06F 3/0447 Position sensing using the local deformation of sensor cells
• CPC Class Codes: H05K 2201/0133 Elastomeric or compliant polymer elastomeric conductor H05K2201/0314
• CPC Class Codes: H05K 2201/0162 Silicon containing polymer, e.g. silicone
• CPC Class Codes: H05K 2201/10151 Sensor
• CPC Class Codes: H05K 3/0014 Shaping of the substrate, e.g. by moulding
• CPC Class Codes: H05K 3/103 by bonding or embedding conductive wires or strips
• CPC Class Codes: H05K 3/105 by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam

Abstract

Capacitive sensor assemblies for electronic devices, and methods of forming capacitive sensor assemblies. The capacitive sensor assembly may include a top component having an intermediate layer formed on the top component, a bottom component positioned opposite the top component, a silicone layer positioned between the top component and the bottom component, and a first electrical trace positioned adjacent the silicone layer.

Claims

1. A method of manufacturing a capacitive sensory assembly in an electronic device, the method comprising:

coupling a silicone layer to a bottom portion of a housing of the electronic device;

positioning a first electrical trace within a flex layer, the flex layer positioned on the silicone layer, opposite the bottom portion of the housing;

curing the silicone layer to the flex layer including the first electrical trace;

applying an adhesive to the flex layer including the first electrical trace, opposite the silicone layer; and

coupling a cover of the electronic device to the flex layer using the applied adhesive.

2. The method of claim 1 further comprising coupling an intermediate layer on a at least a portion of an inner surface of the cover of the electronic device.

3. The method of claim 2, wherein the coupling of the cover to the flex layer further comprises adhering the intermediate layer directly to the flex layer using the applied adhesive.

4. The method of claim 1, wherein the coupling of the silicone layer to the bottom portion of the housing further comprises curing the silicone layer to the housing.

5. The method of claim 1 further comprising forming the bottom portion of the housing of the electronic device from an electrically conductive material.

6. A method of manufacturing a capacitive sensory assembly in an electronic device, the method comprising:

coupling an intermediate layer on a at least a portion of an inner surface of a cover of the electronic device;

etching a portion of the intermediate layer to form a first electrical trace in the etched portion;

positioning a silicone layer between the intermediate layer and a bottom portion of a housing of the electronic device; and

curing the silicone layer to the intermediate layer including the first electrical trace.

7. The method of claim 6 further comprising:

bonding a flex layer to the silicone layer, opposite the intermediate layer; and

positioning a second electrical trace within the flex layer.

8. The method of claim 7 further comprising:

applying an adhesive to the flex layer including the second electrical trace, opposite the silicone layer; and

adhering the bottom portion of the housing of the electronic device to the flex layer using the applied adhesive.

9. The method of claim 6 further comprising curing the silicone layer to the bottom portion of the housing of the electronic device.

10. The method of claim 9 further comprising forming the bottom portion of the housing of the electronic device from an electrically conductive material.

11. An electronic device comprising:

a housing comprising;

a top portion; and

a bottom portion coupled to the top portion; and

a capacitive sensor assembly positioned within the housing, the capacitive sensor comprising;

a silicone layer positioned between the top portion and the bottom portion of the housing;

a flex layer coupled to the silicone layer; and

a first electrical trace positioned within the flex layer.

12. The electronic device of claim 11, wherein the flex layer and the first electrical trace of the capacitive sensor assembly are positioned between the top portion of the housing and the silicone layer.

13. The electronic device of claim 12, wherein the capacitive sensor assembly further comprises an adhesive positioned between the flex layer and top portion of the housing, the adhesive bonding the flex layer to top portion of the housing.

14. The electronic device of claim 12, wherein the bottom portion of the housing is formed from an electrically conductive material.

15. The electronic device of claim 12, wherein the silicone layer of the capacitive sensor assembly is coupled directly to the bottom portion of the housing.

16. The electronic device of claim 11, wherein the flex layer and the first electrical trace of the capacitive sensor assembly are positioned between the bottom portion of the housing and the silicone layer.

17. The electronic device of claim 16, wherein the capacitive sensor assembly further comprises a second electrical trace positioned within an intermediate layer formed between the top portion of the housing and the silicone layer.

18. The electronic device of claim 17, wherein the silicone layer of the capacitive sensor assembly is coupled directly to the intermediate layer.

19. An electronic device comprising:

a housing;

a cover glass coupled to the housing;

an intermediate layer formed on an inner surface of the cover glass; and

a capacitive sensor assembly positioned between the housing and the cover glass, the capacitive sensor comprising;

a silicone layer coupled to the intermediate layer formed on the inner surface of the cover glass; and

a first electrical trace positioned within the intermediate layer, adjacent the silicone layer.

20. The electronic device of claim 19, wherein the housing is formed from an electrically conductive material.

21. The electronic device of claim 20, wherein the silicone layer of the capacitive sensor is coupled to the housing.

22. The electronic device of claim 19, wherein the capacitive sensor assembly further comprises:

a flex layer positioned between the silicone layer and the housing;

a second electrical trace positioned within the flex layer.

23. The electronic device of claim 22, wherein the capacitive sensor assembly further comprises an adhesive positioned between the flex layer and the housing, the adhesive bonding the flex layer to the housing.