PLASTIC COOLER FOR SEMICONDUCTOR MODULES

• US 20160260654A1
• Filed: 03/03/2015
• Published: 09/08/2016
• Est. Priority Date: 03/03/2015
• Status: Active Grant

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Yoo, Inpil, Grassmann, Andreas
• Granted Patent: US 9,613,885 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 21/4817 for containers, e.g. caps H01L21/4871 takes precedence
• CPC Class Codes: H01L 21/4875 Connection or disconnection of other leads to or from bases or plates
• CPC Class Codes: H01L 21/4882 Assembly of heatsink parts
• CPC Class Codes: H01L 21/54 Providing fillings in containers, e.g. gas fillings
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 23/08 the material being an electrical insulator, e.g. glass
• CPC Class Codes: H01L 23/18 Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/3142 Sealing arrangements between parts, e.g. adhesion promotors
• CPC Class Codes: H01L 23/3672 Foil-like cooling fins or heat sinks being part of lead-frames H01L23/49568
• CPC Class Codes: H01L 23/3737 Organic materials with or without a thermoconductive filler
• CPC Class Codes: H01L 23/44 the complete device being wholly immersed in a fluid other than air H01L23/427 takes precedence
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 23/49811 Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence

Abstract

A cooling apparatus includes a plurality of discrete modules and a plastic housing. Each module includes a semiconductor die encapsulated by a mold compound, a plurality of leads electrically connected to the semiconductor die and protruding out of the mold compound and a first cooling plate at least partly uncovered by the mold compound. The plastic housing surrounds the periphery of each module to form a multi-die module. The plastic housing includes a first singular plastic part which receives the modules and a second singular plastic part attached to a periphery of the first plastic part. The second plastic part has cutouts which expose the first cooling plates and a sealing structure containing a sealing material which forms a water-tight seal around the periphery of each module at a side of the modules with the first cooling plates.

Claims

1. A cooling apparatus, comprising:

a plurality of discrete modules each of which comprises;

a semiconductor die encapsulated by a mold compound;

a plurality of leads electrically connected to the semiconductor die and protruding out of the mold compound; and

a first cooling plate at least partly uncovered by the mold compound; and

a plastic housing surrounding a periphery of each module to form a multi-die module, the plastic housing comprising;

a first singular plastic part which receives the modules; and

a second singular plastic part attached to a periphery of the first plastic part, the second plastic part having cutouts which expose the first cooling plates and a sealing structure containing a sealing material which forms a water-tight seal around the periphery of each module at a side of the modules with the first cooling plates.

2. The cooling apparatus of claim 1, wherein the sealing structure of the second plastic part comprises a groove formed in the second plastic part which surrounds the periphery of each module at the side of the modules with the first cooling plates, and wherein the sealing material fills the grooves.

3. The cooling apparatus of claim 2, wherein a part of the second plastic part disposed interiorly from the grooves contacts the side of the modules with the first cooling plates to prevent the sealing material from leaking onto the first cooling plates.

4. The cooling apparatus of claim 1, further comprising:

a first cover attached to a periphery of the second plastic part and forming a water-tight seal with the second plastic part; and

an enclosed cavity between the first cover and the second plastic part configured to permit fluid flow over the first cooling plates of each discrete module.

5. The cooling apparatus of claim 1, wherein each discrete module has a second cooling plate at a side opposite the first cooling plate, and wherein the first plastic part has cutouts which expose the second cooling plates and a sealing structure containing additional sealing material which forms a water-tight seal around the periphery of each module at the side of the modules with the second cooling plates.

6. The cooling apparatus of claim 5, wherein the sealing structure of the first plastic part comprises a groove formed in the first plastic part which surrounds the periphery of each module at the side of the modules with the second cooling plates, and wherein the additional sealing material fills the grooves in the first plastic part.

7. The cooling apparatus of claim 6, wherein a part of the first plastic part disposed interiorly from the grooves contacts the side of the modules with the second cooling plates to prevent the additional sealing material from leaking onto the second cooling plates.

8. The cooling apparatus of claim 5, further comprising:

a second cover attached to a periphery of the first plastic part and forming a water-tight seal with the first plastic part; and

an enclosed cavity between the second cover and the first plastic part configured to permit fluid flow over the second cooling plates of each discrete module.

9. A method of manufacturing a cooling apparatus, the method comprising:

receiving a plurality of modules by a first singular plastic part, each of the modules comprising a semiconductor die encapsulated by a mold compound, a plurality of leads electrically connected to the semiconductor die and protruding out of the mold compound, and a first cooling plate at least partly uncovered by the mold compound;

attaching a second singular plastic part to a periphery of the first plastic part to form a plastic housing, the plastic housing surrounding a periphery of each module to form a multi-die module, the second plastic part having cutouts which expose the first cooling plates and a sealing structure facing a side of the modules with the first cooling plates; and

filling the sealing structure with a sealing material which forms a water-tight seal around the periphery of each module at the side of the modules with the first cooling plates.

10. The method of claim 9, wherein the sealing structure of the second plastic part comprises a groove formed in the second plastic part which surrounds the periphery of each module at the side of the modules with the first cooling plates, and wherein the sealing material is injected into the grooves through an opening in the second plastic part.

11. The method of claim 10, wherein a part of the second plastic part disposed interiorly from the grooves contacts the side of the modules with the first cooling plates to prevent the sealing material from leaking onto the first cooling plates when injected into the grooves through the opening in the second plastic part.

12. The method of claim 9, further comprising:

attaching a first cover to a periphery of the second plastic part so as to form a water-tight seal with the second plastic part and an enclosed cavity between the first cover and the second plastic part, the enclosed cavity configured to permit fluid flow over the first cooling plates of each discrete module.

13. The method of claim 9, wherein each discrete module has a second cooling plate at a side opposite the first cooling plate, and wherein the first plastic part has cutouts which expose the second cooling plates and a sealing structure, the method further comprising:

filling the sealing structure of the first plastic part with additional sealing material which forms a water-tight seal around the periphery of each module at the side of the modules with the second cooling plates.

14. The method of claim 13, wherein the sealing structure of the first plastic part comprises a groove formed in the first plastic part which surrounds the periphery of each module at the side of the modules with the second cooling plates, and wherein the additional sealing material is injected into the grooves through an opening in the first plastic part.

15. The method of claim 14, wherein a part of the first plastic part disposed interiorly from the grooves contacts the side of the modules with the second cooling plates to prevent the additional sealing material from leaking onto the second cooling plates when injected into the grooves through the opening in the first plastic part.

16. The method of claim 13, further comprising:

attaching a second cover to a periphery of the first plastic part so as to form a water-tight seal with the first plastic part and an enclosed cavity between the second cover and the first plastic part, the enclosed cavity configured to permit fluid flow over the second cooling plates of each discrete module.

17. A cooling apparatus, comprising:

a plurality of discrete modules each of which comprises a semiconductor die encapsulated by a mold compound, a plurality of leads electrically connected to the semiconductor die and protruding out of the mold compound, and a first cooling plate at least partly uncovered by the mold compound;

a first and second plastic housing each of which surrounds a periphery of a different subset of the modules to form separate multi-die modules, each of the plastic housings comprising a first singular plastic part which receives the corresponding subset of modules and a second singular plastic part attached to a periphery of the first plastic part, the second plastic part having cutouts which expose the first cooling plates and a sealing structure containing a sealing material which forms a water-tight seal around the periphery of each module at a side of the modules with the first cooling plates;

a first cover attached to a periphery of the second plastic part of the first plastic housing so as to form a water-tight seal with the second plastic part of the first plastic housing and an enclosed cavity between the first cover and the second plastic part, the enclosed cavity configured to permit fluid flow over the first cooling plates of each discrete module included in the first plastic housing;

a second cover interposed between and attached to the first and the second plastic housings, the second cover attached to a periphery of the second plastic part of the second plastic housing so as to form a water-tight seal with the second plastic part of the second plastic housing and an enclosed cavity between the second cover and the second plastic part, the enclosed cavity configured to permit fluid flow over the first cooling plates of each discrete module included in the second plastic housing; and

a third cover attached to a side of the second plastic housing opposite the second cover.

18. The cooling apparatus of claim 17, wherein the second cover has one or more openings configured to permit fluid flow between the first and the second plastic housings.

19. The cooling apparatus of claim 17, wherein the second cover is attached to a periphery of the first plastic part of the first plastic housing at a side of the first plastic housing facing away from the first cover so as to form a water-tight seal with the first plastic part of the first plastic housing and an enclosed cavity between the second cover and the first plastic part, the enclosed cavity configured to permit fluid flow over second cooling plates of each discrete module included in the first plastic housing which are disposed at a side of the modules opposite the first cooling plates.

20. The cooling apparatus of claim 17, wherein the third cover is attached to a periphery of the first plastic part of the second plastic housing at a side of the second plastic housing facing away from the second cover so as to form a water-tight seal with the first plastic part of the second plastic housing and an enclosed cavity between the third cover and the first plastic part, the enclosed cavity configured to permit fluid flow over second cooling plates of each discrete module included in the second plastic housing which are disposed at a side of the modules opposite the first cooling plates.

21. The cooling apparatus of claim 17, further comprising:

a third plastic housing which surrounds a periphery of a different subset of the modules than the first and the second plastic housings to form an additional multi-die module, the third plastic housing comprising a first singular plastic part which receives the corresponding subset of modules and a second singular plastic part attached to a periphery of the first plastic part, the second plastic part having cutouts which expose the first cooling plates and a sealing structure containing a sealing material which forms a water-tight seal around the periphery of each module at a side of the modules with the first cooling plates; and

a fourth cover attached to a side of the third plastic housing opposite the third cover,

wherein the third cover is attached to a periphery of the first plastic part of the second plastic housing at a side of the second plastic housing facing away from the second cover so as to form a water-tight seal with the first plastic part of the second plastic housing and an enclosed cavity between the third cover and the first plastic part, the enclosed cavity configured to permit fluid flow over second cooling plates of each discrete module included in the second plastic housing which are disposed at a side of the modules opposite the first cooling plates.

22. The cooling apparatus of claim 21, wherein the fourth cover is attached to a periphery of the first plastic part of the third plastic housing at a side of the third plastic housing facing away from the third cover so as to form a water-tight seal with the first plastic part of the third plastic housing and an enclosed cavity between the fourth cover and the first plastic part, the enclosed cavity configured to permit fluid flow over second cooling plates of each discrete module included in the third plastic housing which are disposed at a side of the modules opposite the first cooling plates.

23. The cooling apparatus of claim 22, wherein the third cover has one or more openings configured to permit fluid flow between the second and the third plastic housings.