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PLASTIC COOLER FOR SEMICONDUCTOR MODULES

  • US 20160260654A1
  • Filed: 03/03/2015
  • Published: 09/08/2016
  • Est. Priority Date: 03/03/2015
  • Status: Active Grant
First Claim
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1. A cooling apparatus, comprising:

  • a plurality of discrete modules each of which comprises;

    a semiconductor die encapsulated by a mold compound;

    a plurality of leads electrically connected to the semiconductor die and protruding out of the mold compound; and

    a first cooling plate at least partly uncovered by the mold compound; and

    a plastic housing surrounding a periphery of each module to form a multi-die module, the plastic housing comprising;

    a first singular plastic part which receives the modules; and

    a second singular plastic part attached to a periphery of the first plastic part, the second plastic part having cutouts which expose the first cooling plates and a sealing structure containing a sealing material which forms a water-tight seal around the periphery of each module at a side of the modules with the first cooling plates.

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