MEMS DEVICE, LIQUID EJECTING HEAD, AND LIQUID EJECTING APPARATUS

• US 20160263886A1
• Filed: 02/22/2016
• Published: 09/15/2016
• Est. Priority Date: 03/13/2015
• Status: Active Grant

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: ARUGA, Koji, MIKOSHIBA, Masanori, YASOSHIMA, Takeshi, KAMIJO, Takahiro
• Granted Patent: US 9,724,917 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: B41J 2/14 Structure thereof only for on-demand ink jet heads
• CPC Class Codes: B41J 2/14233 of film type, deformed by bending and disposed on a diaphragm
• CPC Class Codes: B41J 2002/14362 Assembling elements of heads
• CPC Class Codes: B41J 2002/14491 Electrical connection

Abstract

A MEMS device includes a protective substrate on which is mounted a driving circuit that drives a piezoelectric actuator and on which is formed an interconnect pattern electrically connected to the driving circuit, and a sealing substrate that includes a first opening and that is bonded to the protective substrate using an adhesive so that part of the interconnect pattern is located between the protective substrate and the sealing substrate. The interconnect pattern includes a connection portion that extends from a bonding region where the protective substrate and the sealing substrate are bonded by the adhesive to the first opening, and that has a connection region electrically connected to the driving circuit. A groove is formed in the connection portion between the connection region and a border between the bonding region and the connection portion.

Claims

1. A MEMS device comprising:

a protective substrate on which is mounted a driving circuit that drives a pressure generating unit and on which is formed an interconnect pattern electrically connected to the driving circuit; and

a sealing substrate that includes an opening and that is bonded to the protective substrate using an adhesive so that part of the interconnect pattern is located between the protective substrate and the sealing substrate,

wherein the interconnect pattern includes a connection portion that extends from a region where the protective substrate and the sealing substrate are bonded by the adhesive to the opening, and that has a connection region electrically connected to the driving circuit; and

a groove is formed in the connection portion between the connection region and a border between the region and the connection portion.

2. The MEMS device according to claim 1,

wherein the groove is formed so as to partially surround the connection region and be conductive with the connection portion on the side of the connection region opposite from the border.

3. The MEMS device according to claim 1,

wherein the connection portion has a linear portion provided between the border and the connection region, and a branching portion that branches from the linear portion.

4. The MEMS device according to claim 3,

wherein in the adjacent connection portions, the branching portion of one of the connection portions and the branching portion of another of the connection portions overlap in a direction progressing from the border toward the connection region.

6. A liquid ejecting head comprising:

the MEMS device according to claim 1; and

a flow channel formation substrate in which a pressure generation chamber that communicates with a nozzle opening that ejects a liquid is provided,

wherein the pressure generating unit is provided on one surface of the flow channel formation substrate and generates a change in pressure in the liquid in the pressure generation chamber.

7. A liquid ejecting head comprising:

the MEMS device according to claim 2; and

a flow channel formation substrate in which a pressure generation chamber that communicates with a nozzle opening that ejects a liquid is provided,

wherein the pressure generating unit is provided on one surface of the flow channel formation substrate and generates a change in pressure in the liquid in the pressure generation chamber.

8. A liquid ejecting head comprising:

the MEMS device according to claim 3; and

a flow channel formation substrate in which a pressure generation chamber that communicates with a nozzle opening that ejects a liquid is provided,

wherein the pressure generating unit is provided on one surface of the flow channel formation substrate and generates a change in pressure in the liquid in the pressure generation chamber.

9. A liquid ejecting head comprising:

the MEMS device according to claim 4; and

a flow channel formation substrate in which a pressure generation chamber that communicates with a nozzle opening that ejects a liquid is provided,

wherein the pressure generating unit is provided on one surface of the flow channel formation substrate and generates a change in pressure in the liquid in the pressure generation chamber.

11. The liquid ejecting head according to claim 6,

wherein the protective substrate is provided on the one surface of the flow channel formation substrate, and a space that allows the pressure generating unit to bend is formed in the protective substrate.

12. The liquid ejecting head according to claim 7,

wherein the protective substrate is provided on the one surface of the flow channel formation substrate, and a space that allows the pressure generating unit to bend is formed in the protective substrate.

13. The liquid ejecting head according to claim 8,

wherein the protective substrate is provided on the one surface of the flow channel formation substrate, and a space that allows the pressure generating unit to bend is formed in the protective substrate.

14. The liquid ejecting head according to claim 9,

wherein the protective substrate is provided on the one surface of the flow channel formation substrate, and a space that allows the pressure generating unit to bend is formed in the protective substrate.

16. A liquid ejecting apparatus comprising the liquid ejecting head according to claim 6.

17. A liquid ejecting apparatus comprising the liquid ejecting head according to claim 7.

18. A liquid ejecting apparatus comprising the liquid ejecting head according to claim 8.

19. A liquid ejecting apparatus comprising the liquid ejecting head according to claim 9.

5. A MEMS device comprising:

a protective substrate on which is mounted a driving circuit that drives a pressure generating unit and on which is formed an interconnect pattern electrically connected to the driving circuit; and

a sealing substrate that includes an opening and that is bonded to the protective substrate using an adhesive so that part of the interconnect pattern is located between the protective substrate and the sealing substrate,

wherein the interconnect pattern includes a connection portion that extends from a region where the protective substrate and the sealing substrate are bonded by the adhesive to the opening, and that has a connection region electrically connected to the driving circuit; and

the connection portion has a linear portion provided between the border and the connection region, and a branching portion that branches from the linear portion.

10. A liquid ejecting head comprising:

the MEMS device according to claim 5; and

a flow channel formation substrate in which a pressure generation chamber that communicates with a nozzle opening that ejects a liquid is provided,

wherein the pressure generating unit is provided on one surface of the flow channel formation substrate and generates a change in pressure in the liquid in the pressure generation chamber.

15. The liquid ejecting head according to claim 10,

wherein the protective substrate is provided on the one surface of the flow channel formation substrate, and a space that allows the pressure generating unit to bend is formed in the protective substrate.

20. A liquid ejecting apparatus comprising the liquid ejecting head according to claim 10.