HEAD AND LIQUID EJECTING APPARATUS

• US 20160263889A1
• Filed: 02/03/2016
• Published: 09/15/2016
• Est. Priority Date: 03/10/2015
• Status: Active Grant

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: HAMAGUCHI, Toshiaki, HIRAI, Eiju, NAGANUMA, Yoichi, TAKABE, Motoki
• Granted Patent: US 9,573,371 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: B41J 2/14032 Structure of the pressure chamber
• CPC Class Codes: B41J 2/14201 Structure of print heads with piezoelectric elements
• CPC Class Codes: B41J 2/14233 of film type, deformed by bending and disposed on a diaphragm
• CPC Class Codes: B41J 2/33595 Conductors through the layered structure
• CPC Class Codes: B41J 2002/14241 having a cover around the piezoelectric thin film element
• CPC Class Codes: B41J 2002/14419 Manifold
• CPC Class Codes: B41J 2002/14491 Electrical connection

Abstract

Provided is a head including a channel formation substrate that is provided with a pressure generating chamber which communicates with a nozzle for ejecting a liquid, a piezo element, a driving circuit board that is bonded to the one surface side of the channel formation substrate, and a driving circuit for driving the piezo element. The piezo element and the driving circuit are electrically connected to each other via a bump which is provided on any one of the channel formation substrate and the driving circuit board. A holding portion that holds the piezo element is provided between the driving circuit board and the channel formation substrate. The holding portion is opened to an atmosphere through an atmosphere open passage which is provided to penetrate the driving circuit board in a direction in which the driving circuit board and the channel formation substrate are stacked.

Claims

1. A head comprising:

a channel formation substrate that is provided with a pressure generating chamber which communicates with a nozzle for ejecting a liquid;

a piezo element that is provided on one surface side of the channel formation substrate; and

a driving circuit board that is bonded to the one surface side of the channel formation substrate via an adhesive layer, and is provided with a driving circuit for driving the piezo element,

wherein the piezo element and the driving circuit are electrically connected to each other via a bump which is provided on any one of the channel formation substrate and the driving circuit board,

wherein a holding portion which is surrounded by the adhesive layer and holds the piezo element therein is provided between the driving circuit board and the channel formation substrate, and

wherein the holding portion is opened to an atmosphere through an atmosphere open passage which is provided to penetrate the driving circuit board in a direction in which the driving circuit board and the channel formation substrate are stacked.

2. The head according to claim 1,

wherein a metal wiring is provided over the periphery of the atmosphere open passage in at least a portion in which the driving circuit is provided in the driving circuit board.

3. The head according to claim 1,

wherein the adhesive layer is formed of a photosensitive resin.

4. The head according to claim 1,

wherein the bump includes a core portion having elastic properties, and a metallic film which is provided on a surface of the core portion.

5. A liquid ejecting apparatus comprising the head according to claim 1.

6. A liquid ejecting apparatus comprising the head according to claim 2.

7. A liquid ejecting apparatus comprising the head according to claim 3.

8. A liquid ejecting apparatus comprising the head according to claim 4.