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METHOD FOR IC TESTING BIGDATA ANALYSIS OPTION VALUE ANALYSIS

  • US 20160266198A1
  • Filed: 05/24/2016
  • Published: 09/15/2016
  • Est. Priority Date: 09/15/2014
  • Status: Abandoned Application
First Claim
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1. A method for IC testing bigdata analysis and option value analysis, comprising the steps of:

  • obtaining data;

    dividing a test wafer into a plurality of test chips, each of the test chips being tested for electrical property and captured data under various parameters;

    sorting parameter;

    a specific parameter being sorted from the various parameters according to a requirement of an analysis result;

    defining three-dimensional space coordinates;

    compiling a program, defining a three-dimensional space coordinate in the program, comprising an X-coordinate axis, a Y-coordinate axis, and a Z-coordinate axis, wherein the X-coordinate axis and the Y-coordinate axis represent locations of the plurality of devices under test on the wafer, whereas the Z-coordinate axis represents the specific parameter;

    analyzing the specific parameter;

    in the program, calculating and analyzing all the specific parameters of the plurality of devices under test, so as to generate a plurality of reference values corresponding to the specific parameters;

    drawing a parameter location map;

    loading the program and the plurality of reference values into a drawing software, producing a parameter location map of a three-dimensional cylindrical perspective graphic according to a plurality of coordinate points X, Y, Z;

    wherein physical locations of the plurality of devices under test on the wafer are formed at graduations of the X-coordinate axis and the Y-coordinate axis, and, given the locations of the devices under test with respect to the graduations of the X-coordinate axis and the Y-coordinate axis, a three-dimensional cylindrical perspective graphic corresponding to the specific parameter is formed on the Z-coordinate axis according to the reference values thus obtained;

    wherein, with the parameter location map, it is feasible to dynamically rotate the X-coordinate axis, the Y-coordinate axis and the Z-coordinate axis to achieve different angles of view, and the three-dimensional cylindrical perspective graphic formed on the Z-coordinate axis displays difference in color to discern the specific parameters attributed to the devices under test.

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