COIL ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

• US 20160268038A1
• Filed: 10/30/2015
• Published: 09/15/2016
• Est. Priority Date: 03/09/2015
• Status: Active Grant

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: CHOI, Min Sung
• Granted Patent: US 10,854,383 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 27/255 made from particles H01F27/26 takes precedence
• CPC Class Codes: H01F 27/292 Surface mounted devices
• CPC Class Codes: H01F 41/041 Printed circuit coils apparatus or processes for manufacturing printed circuits in general H05K3/00

Abstract

A coil electrode component includes a body including magnetic metal material, a coil disposed in the body and having first and second lead parts respectively outwardly exposed through first and second surfaces of the body. A first plating electrode is formed on the first surface of the body and a further surface of the body connected to and extended from the first surface of the body, and connected to the first lead part. A second plating electrode is formed on the second surface of the body and a further surface of the body connected to and extended from the second surface of the body, and connected to the second lead part.

Claims

1. A coil electronic component comprising:

a body including a magnetic metal material;

a coil disposed in the body and having first and second lead parts respectively outwardly exposed to first and second surfaces of the body;

a first plating electrode on at least a portion of the first surface of the body and on at least a portion of a further surface of the body connected to and extending from the first surface, and connected to the first lead part; and

a second plating electrode on at least a portion of the second surface of the body and on at least a portion of a further surface of the body connected to and extending from the second surface, and connected to the second lead part.

2. The coil electronic component of claim 1, wherein the first and second surfaces are end surfaces of the body that oppose each other, and

the further surface connected to the first surface is the same surface as the further surface connected to the second surface and is a mounting surface of the coil electronic component.

3. The coil electronic component of claim 2, wherein respective distances in a thickness direction of the first and second plating electrodes on the first and second surfaces are longer than respective vertical distances between the mounting surface and the first and second lead parts.

4. The coil electronic component of claim 3, wherein each of the respective distances in a thickness direction of the first and second plating electrodes on the first and second surfaces is shorter than a thickness of the body.

5. The coil electronic component of claim 1, further comprising an insulating layer on regions of outer surfaces of the body except for regions of the body on which the first and second plating electrodes are formed.

6. The coil electronic component of claim 2, wherein a surface step is at an edge of the body at which a surface opposing the mounting surface and the first or second surface meet.

7. The coil electronic component of claim 2, further comprising a surface electrode layer on the mounting surface of the body.

8. The coil electronic component of claim 2, further comprising:

a marking pattern on the mounting surface of the body or a surface opposing the mounting surface of the body; and

an insulating layer on regions of outer surfaces of the body except for regions of the body on which the first and second plating electrodes and the marking pattern are formed.

9. A method of manufacturing a coil electronic component, the method comprising:

forming a coil having a first lead part and a second lead part;

forming a body by laminating magnetic sheets including a magnetic metal material on an upper portion and a lower portion of the coil; and

forming first and second plating electrodes on outer surfaces of the body,

wherein the first plating electrode is formed on at least a portion of a first surface of the body and on at least a portion of a further surface of the body connected to and extending from the first surface of the body, and connected to the first lead part, and

the second plating electrode is formed on at least a portion of a second surface of the body and on at least a portion of a further surface of the body connected to and extending from the second surface of the body, and connected to the second lead part.

10. The method of claim 9, wherein the first and second surfaces are end surfaces of the body that oppose each, and

the further surface connected to the first surface is the same surface as the further surface connected to the second surface and is a mounting surface of the coil electronic component.

11. The method of claim 10, wherein respective distances in a thickness direction of the first and second plating electrodes on the first and second surfaces are longer than respective vertical distances between the mounting surface and the first and second lead parts.

12. The method of claim 11, wherein each of the respective distances in a thickness direction of the first and second plating electrodes on the first and second surfaces is shorter than a thickness of the body.

13. The method of claim 9, further comprising, before the forming of the first and second plating electrodes on the outer surfaces of the body, forming an insulating layer on regions of surfaces of the body except for regions of the body on which the first and second plating electrodes are to be formed.

14. The method of claim 10, further comprising, before the forming of the first and second plating electrodes on the outer surfaces of the body,

forming a surface step at an edge at which a surface of the body opposing the mounting surface of the body and the first or second surface meet;

and

forming an insulating layer on regions of surfaces of the body except for regions of the body on which the first and second plating electrodes are to be formed.

15. The method of claim 10, further comprising, before the forming of the first and second plating electrodes on the outer surfaces of the body, forming a surface electrode layer on the mounting surface of the body.

16. The method of claim 10, further comprising, before the forming of the first and second plating electrodes on the outer surfaces of the body,

forming a marking pattern on the mounting surface of the body or a surface opposing the mounting surface of the body;

and

forming an insulating layer on regions of surfaces of the body except for regions of the body on which the first and second plating electrodes and the marking pattern are to be formed.