COIL ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

• US 20160268040A1
• Filed: 01/06/2016
• Published: 09/15/2016
• Est. Priority Date: 03/09/2015
• Status: Active Grant

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Kim, You Na, Kim, Min Hee, Park, Moon Soo, Lee, Jong Ho
• Granted Patent: US 10,256,039 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 27/255 made from particles H01F27/26 takes precedence
• CPC Class Codes: H01F 41/041 Printed circuit coils apparatus or processes for manufacturing printed circuits in general H05K3/00

Abstract

A coil electronic component includes: a coil part; an insulating layer covering the coil part; a magnetic body enclosing the coil part covered by the insulating layer; and an adhesive layer disposed between the insulating layer and the magnetic body to prevent chipping of the magnetic body.

Claims

1. A coil electronic component comprising:

a coil part;

an insulating layer covering the coil part;

a magnetic body enclosing the coil part covered by the insulating layer; and

an adhesive layer disposed between the insulating layer and the magnetic body to prevent chipping of the magnetic body.

2. The coil electronic component of claim 1, wherein the adhesive layer has adhesion greater than that of the magnetic body.

3. The coil electronic component of claim 1, wherein the magnetic body includes a magnetic metal powder and a thermosetting resin.

4. The coil electronic component of claim 3, wherein a volume of the magnetic metal powder in the magnetic body is equal to 60% or more.

5. The coil electronic component of claim 1, wherein the coil part includes a first coil conductor disposed on one surface of a substrate and a second coil conductor disposed on the other surface of the substrate.

6. The coil electronic component of claim 5, wherein the first and second coil conductors are formed by plating.

7. A method for manufacturing a coil electronic component, the method comprising:

forming a plurality of coil parts;

forming an insulating layer covering the coil parts;

forming adhesive sheets on upper and lower portions of the coil parts covered by the insulating layer; and

stacking magnetic sheets on the adhesive sheets; and

compressing and curing the magnetic sheets to form a multilayer body.

8. The method of claim 7, further comprising cutting the multilayer body to form individual coil electronic components, each of which includes a coil part.

9. The method of claim 7, wherein the adhesive sheets have adhesion greater than that of the magnetic sheets.

10. The method of claim 7, wherein the magnetic sheets include a magnetic metal powder and a thermosetting resin.

11. The method of claim 7, wherein the forming of the plurality of coil parts includes forming first coil conductors on one surface of a substrate by plating and forming second coil conductors on the other surface of the substrate by plating.

12. The method of claim 8, wherein the adhesive sheets prevent chipping of the magnetic body in the cutting of the multilayer body.