ELECTRONIC DEVICE

• US 20160270205A1
• Filed: 08/28/2015
• Published: 09/15/2016
• Est. Priority Date: 03/10/2015
• Status: Active Grant

• Current Assignee: Toshiba Memory Corporation (Kioxia Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: KAMIMURA, Naoya
• Granted Patent: US 9,609,739 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 1/18 Printed circuits structurally associated with non-printed electric components H05K1/0201, H05K1/023, H05K1/0243, and H05K1/16 take precedence
• CPC Class Codes: H05K 5/0213 Venting apertures; Constructional details thereof
• CPC Class Codes: H05K 7/20445 the coupling element being an additional piece, e.g. thermal standoff

Abstract

According to one embodiment, an electronic device according to an embodiment includes, for example, a board, a first electronic component, and a heat dissipation member. The board includes a first face. The heat dissipation member is disposed at a side opposite to the first face of the first electronic component. The heat dissipation member is thermally connected to the first electronic component. The heat dissipation member includes a first extending portion, a second extending portion, and a plurality of third extending portions. The first extending portion extends along the first face. The second extending portion is positioned away, in a direction that intersects the first face, from the first extending portion by a space. The second extending portion extends along the first face. The plurality of the third extending portions are connected to the first extending portion and the second extending portion. The plurality of the third extending portions are positioned away from each other by a space.

Claims

1. An electronic device comprising:

a board having a first face;

a first electronic component disposed on the first face; and

a heat dissipation member disposed at a side opposite to the first face of the first electronic component, the heat dissipation member being thermally connected to the first electronic component, the heat dissipation member including a first extending portion, a second extending portion, and a plurality of third extending portions, wherein

the first extending portion extends along a first face,

the second extending portion is positioned away, in a direction that intersects the first face, from the first extending portion by a space, the second extending portion extending along the first face, and

the plurality of third extending portions are connected to the first extending portion and the second extending portion, the plurality of third extending portions being positioned away from each other by a space.

2. The electronic device according to claim 1, wherein

the heat dissipation member has a framework structure, and

the framework structure includes the first extending portion, the second extending portion, and the plurality of third extending portions.

3. The electronic device according to claim 2, wherein

the first extending portion includes a plurality of row portions and a plurality of column portions,

the plurality of row portions are disposed away from each other,

the plurality of column portions intersect the row portions, the plurality of column portions being disposed away from each other.

4. The electronic device according to claim 3, wherein

the third extending portion connects a connecting portion, the connecting portion being a portion via which the row portion and the column portion are connected.

5. The electronic device according to claim 4, comprising a housing that houses the board, the first electronic component, and the heat dissipation member.

6. The electronic device according to claim 1, comprising a second electronic component disposed on the board, wherein

the heat dissipation member is thermally connected to the first electronic component and to the second electronic component.

7. The electronic device according to claim 1, wherein the heat dissipation member has a first opening, the first opening being configured to provide clearance between the heat dissipation member and a component, the component being disposed on the first face.

8. The electronic device according to claim 7, wherein the first opening is a through hole that penetrates the heat dissipation member.

9. The electronic device according to claim 1, wherein

the heat dissipation member includes a slope at a side opposite to the first face, and

a distance from the first face to the slope decreases in a direction along the first face.

10. The electronic device according to claim 1, wherein

the first extending portion, the second extending portion, and the plurality of third extending portions are walls, and

a plurality of air passages that are surrounded by the first extending portion, the second extending portion, and two third extending portions among the plurality of third extending portions, the plurality of air passages penetrating the heat dissipation member is provided in the heat dissipation member.

11. The electronic device according to claim 10, wherein the air passage is curved.

12. The electronic device according to claim 10, comprising a housing that houses the board, the first electronic component, and the heat dissipation member, wherein

the housing has a second opening, the second opening penetrating an interior and an exterior of the housing,

the air passage extends in a direction along the first face, and

an opening end of the air passage faces the second opening.

13. The electronic device according to claim 10, comprising a housing that houses the board, the first electronic component, and the heat dissipation member, wherein

the housing includes two walls that are disposed away from each other in a direction along the first face,

a first opening end of a first passage among the plurality of passages and a first opening end of a second passage among the plurality of passages are located at a first end portion of the heat dissipation member in the direction along the first face,

a plurality of second openings that are pr-vided through one wall among the two walls of the housing, the plurality of second openings penetrating an interior and an exterior of the housing, and

the first opening end of the first passage faces one of the plurality of second openings, and the first opening end of the second passage faces another opening among the plurality of second openings.

14. The electronic device according to claim 13, wherein

a second opening end of the first passage and a second opening end of the second passage are located at a second end portion of the heat dissipation member, the second end portion being at a side opposite to the first end portion in a direction along the first face,

a third opening is provided at the other wall among the two walls of the housing, the third opening penetrating an interior and an exterior of the housing, and

both the second opening end of the first passage and the second opening end of the second passage face the third opening.

15. The electronic device according to claim 10, comprising a housing that houses the board, the first electronic component, and the heat dissipation member, wherein

the housing includes two walls that are disposed away from each other in a direction along the first face,

a plurality of second openings that are provided through one wall among the two walls of the housing, the plurality of second openings penetrating an interior and an exterior of the housing,

a first opening end of a third passage among the plurality of passages and a second opening end of the third passage are located at the first end portion of the heat dissipation member in the direction along the first face, and

the first opening end of the third passage faces one of the plurality of second openings, and the second opening end of the third passage faces another opening among the plurality of second openings.

16. The electronic device according to claim 12, wherein

the housing includes two walls disposed away from each other in a direction along the first face, and

one of the opening ends of the air passage faces one of the two walls, and the other of the opening ends of the air passage faces the other wall among the two walls.

17. The electronic device according to claim 16, comprising a third electronic component that is disposed on the board, the third electronic component being disposed away from the heat dissipation member, wherein

the third electronic component is positioned at a first direction side of the first electronic component, and

the air passage extends along a second direction that intersects the first direction.

18. The electronic device according to claim 17, wherein

the third electronic component is a NAND flash memory, and the first electronic component is a controller that controls the NAND flash memory.