RESIN MULTILAYER SUBSTRATE AND COMPONENT MODULE

• US 20160270221A1
• Filed: 05/20/2016
• Published: 09/15/2016
• Est. Priority Date: 02/07/2014
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: OTSUBO, Yoshihito
• Granted Patent: US 9,936,575 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/131 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/16237 the bump connector connecting to a bonding area disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/81 using a bump connector
• CPC Class Codes: H01L 24/13 of an individual bump connector
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/23 Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/35121 Peeling or delaminating
• CPC Class Codes: H05K 1/0271 Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
• CPC Class Codes: H05K 1/028 Bending or folding regions of flexible printed circuits H05K1/0283 takes precedence
• CPC Class Codes: H05K 1/0298 Multilayer circuits
• CPC Class Codes: H05K 1/0313 Organic insulating material
• CPC Class Codes: H05K 1/09 Use of materials for the conductive, e.g. metallic pattern
• CPC Class Codes: H05K 1/115 Via connections; Lands around holes or via connections H05K1/112 takes precedence
• CPC Class Codes: H05K 1/116 Lands, clearance holes or other lay-out details concerning the surrounding of a via
• CPC Class Codes: H05K 2201/0129 Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
• CPC Class Codes: H05K 3/3436 having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: H05K 3/4632 laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets

Abstract

A resin multilayer substrate includes a first resin layer, a conductive pattern that covers a portion of the first resin layer, a conductive via connected to the conductive pattern, and a second resin layer that is overlaid on the first resin layer. The second resin layer includes an opening through which the conductive pattern is partially exposed. As seen in plan view, the opening includes an inner peripheral edge including a first portion that is spaced from the conductive via by a first distance, and a second portion that is spaced from the conductive via by a second distance. The conductive pattern has a length that starts from the inner peripheral edge of the opening to outside and extends under the second resin layer. The length of the conductive pattern at the second portion is greater than the length of the conductive pattern at the first portion.

Claims

1. A resin multilayer substrate comprising:

a first resin layer including a main surface on a first side and made of a thermoplastic resin;

a conductive pattern defined by a metal foil and that covers a portion of the main surface of the first resin layer;

a conductive via that extends through the first resin layer so as to be connected to the conductive pattern; and

a second resin layer that is overlaid on the first side of the first resin layer and made of a thermoplastic resin;

wherein

the first resin layer and the second resin layer are thermo-compression bonded to each other;

the second resin layer including an opening through which the conductive pattern is partially exposed so as to include a projected area of the conductive via that is projected onto the conductive pattern;

as seen in plan view, the opening includes an inner peripheral edge including a first portion that is spaced from the conductive via by a first distance, and a second portion that is spaced from the conductive via by a second distance longer than the first distance;

the conductive pattern has a length that starts from the inner peripheral edge of the opening to outside and extends under the second resin layer; and

the length of the conductive pattern at the second portion is greater than the length of the conductive pattern at the first portion.

2. The resin multilayer substrate according to claim 1, further comprising a bending portion located adjacent to the opening as seen in plan view;

wherein

as seen in plan view, the inner peripheral edge of the opening includes a non-bending portion-side portion located on a side where the bending portion is not located, and a bending portion-side portion located on a side where the bending portion is located; and

the length of the conductive pattern at the bending portion-side part is greater than the length of the conductive pattern at the non-bending portion-side part.

3. The resin multilayer substrate according to claim 2, wherein at the bending portion-side portion, a third resin layer is overlaid on the first side of the second resin layer so as to at least partially cover a region in which the conductive pattern extends under the second resin layer.

4. The resin multilayer substrate according to claim 1, wherein the conductive pattern and the conductive via are electrically and mechanically joined to each other.

5. The resin multilayer substrate according to claim 1, wherein an adhesion strength between the conductive pattern and the conductive via is greater than an adhesion strength between the conductive pattern and the first resin layer.

6. The resin multilayer substrate according to claim 1, wherein the conductive pattern and an upper surface of the second resin layer define an uppermost surface of the resin multilayer substrate.

7. The resin multilayer substrate according to claim 1, wherein the opening is rectangular or substantially rectangular.

8. The resin multilayer substrate according to claim 1, wherein the conductive via is located at a position spaced from a center of the resin multilayer substrate as seen in plan view.

9. The resin multilayer substrate according to claim 1, wherein the conductive via is located at a center of the resin multilayer substrate as seen in plan view.

10. A resin multilayer substrate comprising:

a first resin layer including a main surface on a first side and made of a thermoplastic resin;

a plurality of conductive patterns each defined by a metal foil and located on the main surface of the first resin layer so as to be joined to a product located on the first side of the first resin layer;

a conductive via that extends through the first resin layer so as to be connected to a corresponding one of the plurality of conductive patterns; and

a second resin layer that is overlaid on the first side of the first resin layer and made of a thermoplastic resin;

wherein

the first resin layer and the second resin layer are thermo-compression bonded to each other;

the second resin layer includes a plurality of openings through which the plurality of conductive patterns are partially exposed;

as seen in plan view, the plurality of conductive patterns include;

a first conductive pattern located in a center portion of the product and having a length that starts from an inner peripheral edge of the opening to outside and extends under the second resin layer; and

a second conductive pattern located at an end of the product and having a length that starts from the inner peripheral edge of the opening to outside and extends under the second resin layer; and

a maximum value of the length of the second conductive pattern is greater than a maximum value of the length of the first conductive pattern.

11. A component module comprising:

the resin multilayer substrate according to claim 10; and

a product joined to the plurality of conductive patterns.

12. A resin multilayer substrate comprising:

a first resin layer including a main surface on a first side and made of a thermoplastic resin;

a plurality of conductive patterns each defined by a metal foil and located on the main surface of the first resin layer so as to be joined to a product located on the first side of the first resin layer; and

a second resin layer that is overlaid on the first side of the first resin layer and made of a thermoplastic resin;

wherein

the first resin layer and the second resin layer are thermo-compression bonded to each other;

the second resin layer includes a plurality of openings through which the plurality of conductive patterns are partially exposed;

as seen in plan view, each of the plurality of conductive patterns includes;

a length that starts from an inner peripheral edge of a corresponding one of the plurality of openings in a direction farther away from a closest end of the first resin layer and extends under the second resin layer; and

a length that starts from the inner peripheral edge of a corresponding one of the plurality of openings in a direction closer to the closest end of the first resin layer and extends under the second resin layer;

a maximum value of the length of the conductive pattern extending in the direction closer to the closest end of the first resin layer is greater than a maximum value of the length of the conductive pattern extending in the direction farther away from the closest end of the first resin layer.

13. The resin multilayer substrate according to claim 12, further comprising a bending portion located adjacent to the opening as seen in plan view;

wherein

as seen in plan view, the inner peripheral edge of the opening includes a non-bending portion-side portion located on a side where the bending portion is not located, and a bending portion-side portion located on a side where the bending portion is located; and

the length of the conductive pattern at the bending portion-side part is greater than the length of the conductive pattern at the non-bending portion-side part.

14. The resin multilayer substrate according to claim 13, wherein at the bending portion-side portion, a third resin layer is overlaid on the first side of the second resin layer so as to at least partially cover a region in which the conductive pattern extends under the second resin layer.

15. The resin multilayer substrate according to claim 12, wherein the conductive pattern and the conductive via are electrically and mechanically joined to each other.

16. The resin multilayer substrate according to claim 12, wherein an adhesion strength between the conductive pattern and the conductive via is greater than an adhesion strength between the conductive pattern and the first resin layer.

17. The resin multilayer substrate according to claim 12, wherein the conductive pattern and an upper surface of the second resin layer define an uppermost surface of the resin multilayer substrate.

18. The resin multilayer substrate according to claim 12, wherein the opening is rectangular or substantially rectangular.

19. The resin multilayer substrate according to claim 12, wherein the conductive via is located at a position spaced from a center of the resin multilayer substrate as seen in plan view.

20. The resin multilayer substrate according to claim 12, wherein the conductive via is located at a center of the resin multilayer substrate as seen in plan view.