MINIATURE RFID TAG WITH COIL ON IC PACKAGE

• US 20160275391A1
• Filed: 09/30/2015
• Published: 09/22/2016
• Est. Priority Date: 12/10/2014
• Status: Abandoned Application

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments Deutschland Gesellschaft Mit Beschrã¤Nkter Haftung (Texas Instruments, Inc.)
• Inventors: Sattlegger, Klemens, Gross, Johann
• Application Number:
  US14/870,091
• Publication Number:
  US 20160275391A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G06K 19/07775 the antenna being on-chip
• CPC Class Codes: G06K 19/07783 the coil being planar

Abstract

Disclosed examples include a miniature NFC/RFID tag and a method for making an NFC/RFID tag, in which an antenna is formed as a conductive trace on or in an IC package substrate, and a transponder die is mounted to the substrate with an electrical connection to the antenna by flip chip soldering to the substrate or wire-bonding, and optionally a material layer is formed over the transponder die and over at least a portion of the first side of the substrate.

Claims

1. A near field communications radio frequency ID (NFC/RFID) tag, comprising:

an IC package substrate including a first side, wherein the substrate is a printed circuit board (PCB) material or a laminate;

an antenna formed as a conductive trace on or in the substrate to transmit and receive data; and

a transponder die mounted to the substrate with an electrical connection to the antenna.

2. The NFC/RFID tag of claim 1, further comprising one or more solder balls formed on a second side of the substrate.

3. The NFC/RFID tag of claim 1, comprising a material layer formed over the transponder die and a portion of the first side of the substrate.

4. The NFC/RFID tag of claim 1, wherein the transponder die receives power from the antenna.

5. The NFC/RFID tag of claim 1, wherein the transponder die includes a conductive contact connected to the first side of the substrate to form an electrical connection to the antenna.

6. The NFC/RFID tag of claim 5, wherein the antenna is a conductive trace formed on an outer surface of the first side of the substrate, and wherein the conductive contact of the transponder die is connected to the conductive trace.

7. The NFC/RFID tag of claim 6, wherein the substrate is a printed circuit board (PCB) material.

8. The NFC/RFID tag of claim 5, further comprising one or more solder balls formed on a second side of the substrate.

9. The NFC/RFID tag of claim 1, wherein the transponder die includes a conductive contact, the NFC/RFID tag further including a wire connected to the conductive contact of the transponder die and connected to the antenna.

10. The NFC/RFID tag of claim 9, wherein the antenna is a conductive trace formed on an outer surface of the first side of the substrate, and wherein the wire is soldered to the conductive trace.

11. The NFC/RFID tag of claim 10, wherein the substrate is a printed circuit board (PCB) material.

12. The NFC/RFID tag of claim 9, further comprising one or more solder balls formed on a second side of the substrate.

13. The NFC/RFID tag of claim 1, wherein the antenna is an inductive coupled coil configured to transmit and receive frequencies of 0-30 MHz.

14. The NFC/RFID tag of claim 1, wherein the antenna is configured for near field communication (NFC) RFID communications at 13.56 MHz.

15. The NFC/RFID tag claim 1, wherein the substrate has a length of approximately 10 mm or less, and a width of approximately 10 mm or less.

16. The NFC/RFID tag of claim 1, wherein the substrate is a multilayer structure with multiple layers.

17. The NFC/RFID tag of claim 16, wherein the antenna includes conductive traces formed on or in at least two layers of the substrate.

18. The NFC/RFID tag of claim 17, wherein the transponder die is embedded into or between at least two layers of the substrate.

19. The NFC/RFID tag of claim 16, wherein the transponder die is embedded into or between at least two layers of the substrate.

20. A method of fabricating a miniature NFC/RFID tag, the method comprising:

forming an antenna as a conductive trace on or in an IC package substrate, the antenna designed to transmit and receive frequencies of 0-30 MHz;

mounting a transponder die to the substrate; and

connecting a wire between the transponder die and the antenna.

21. The method of claim 20, further comprising forming solder balls on a side of the substrate.

22. The method of claim 20, comprising forming a material layer over the transponder die and over a portion of the substrate.

23. The method of claim 20, wherein the antenna is formed as a magnetic antenna.

24. A method of fabricating a miniature NFC/RFID tag, the method comprising:

forming an antenna as a conductive trace on or in a first side of an IC package substrate;

connecting an electrical contact of a transponder die to a portion of the antenna on the first side of the substrate; and

forming a material layer over the transponder die and over a portion of the substrate.

25. The method of claim 24, further comprising forming solder balls on a second side of the substrate.

26. The method of claim 24, wherein the antenna is sized to transmit and receive frequencies of 0-30 MHz.

27. The method of claim 24, wherein the antenna is adapted to provide power to the transponder die.