HIGH CURRENT, LOW EQUIVALENT SERIES RESISTANCE PRINTED CIRCUIT BOARD COIL FOR POWER TRANSFER APPLICATION
First Claim
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1. An apparatus for charging, comprising:
- a layered structure of electric conductors on a printed circuit board (PCB), the layered structure positioned around a center core, the electric conductors winding around the center core for inductive coupling, wherein the layered structure comprises;
a first layer of the electric conductors around the center core, the first layer of the electric conductors form an electrically conductive trace comprising a plurality of loops around the center core;
a second layer of the electric conductors around the center core substantially overlaid with the first layer of the electric conductors on the PCB; and
a plurality of vias disposed between the first layer and the second layer, the vias conductively coupling the first layer of the electric conductors and the second layer of the electric conductors, wherein the plurality of the vias include a first via and a second via distributed separately along a length of the trace to electrically connect the trace of the first layer and the second layer of the conductors.
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Abstract
An apparatus for a multilayer printed circuit board (PCB) coil, comprising: a first coil layer of a PCB; a plurality of vias coupled to and distributed to cover substantially the surface of the first coil layer within the PCB; and a second coil layer of the PCB and coupled to the vias to cover substantially the surface of the second coil layer, wherein the vias are positioned between the first coil layer and the second coil layer and enable substantially high current and low equivalent series resistance (ESR) for the multilayer PCB coil.
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Citations
8 Claims
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1. An apparatus for charging, comprising:
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a layered structure of electric conductors on a printed circuit board (PCB), the layered structure positioned around a center core, the electric conductors winding around the center core for inductive coupling, wherein the layered structure comprises; a first layer of the electric conductors around the center core, the first layer of the electric conductors form an electrically conductive trace comprising a plurality of loops around the center core; a second layer of the electric conductors around the center core substantially overlaid with the first layer of the electric conductors on the PCB; and a plurality of vias disposed between the first layer and the second layer, the vias conductively coupling the first layer of the electric conductors and the second layer of the electric conductors, wherein the plurality of the vias include a first via and a second via distributed separately along a length of the trace to electrically connect the trace of the first layer and the second layer of the conductors. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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Specification