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SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING SEMICONDUCTOR DEVICES

  • US 20160276225A1
  • Filed: 05/13/2016
  • Published: 09/22/2016
  • Est. Priority Date: 12/27/2013
  • Status: Active Grant
First Claim
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1. A method of fabricating a semiconductor device, the method comprising:

  • forming a gate insulating layer on first through fourth areas of a substrate;

    providing a first concentration of nitrogen to portions of the gate insulating layer that are formed on the first and second areas of the substrate, and a second concentration of nitrogen to portions of the gate insulating layer that are formed on the third and fourth areas of the substrate, wherein the second concentration of nitrogen comprises a different concentration from the first concentration of nitrogen;

    forming a work function control material layer on the first through fourth areas of the substrate;

    forming a capping layer on the work function control material layer, wherein the capping layer is formed to a first thickness on the first and third areas of the substrate, and to a second thickness that is different from the first thickness, on the second and fourth areas of the substrate; and

    annealing the substrate.

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