MULTI-CHIP SELF ADJUSTING COOLING SOLUTION

• US 20160276243A1
• Filed: 09/27/2014
• Published: 09/22/2016
• Est. Priority Date: 09/27/2014
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: SMITH, Susan F., PRAKASH, Mani, BOSAK, Henry C., ORTIZ, Almanzo T., SMALLEY, Jeffory L., LIU, Tao
• Granted Patent: US 10,141,241 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 23/3675 characterised by the shape of the housing
• CPC Class Codes: H01L 23/3677 Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 23/4093 Snap-on arrangements, e.g. clips
• CPC Class Codes: H01L 23/4338 Pistons, e.g. spring-loaded members
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

An apparatus including a primary device and at least one secondary device coupled in a planar array to a substrate; a first passive heat exchanger disposed on the primary device and having an opening over an area corresponding to the at least one secondary device; a second passive heat exchanger disposed on the at least one secondary device; at least one first spring operable to apply a force to the first heat exchanger in a direction of the primary device; and at least one second spring operable to apply a force to the second heat exchanger in the direction of the secondary device. A method including placing a passive heat exchanger on a multi-chip package, and deflecting a spring to apply a force in a direction of an at least one secondary device on the package.

Claims

1. An apparatus comprising:

a primary device and at least one secondary device coupled in a planar array to a substrate;

a first passive heat exchanger disposed on the primary device and having an opening over an area corresponding to the at least one secondary device;

a second passive heat exchanger disposed on the at least one secondary device;

at least one first spring operable to apply a force to the first heat exchanger in a direction of the primary device; and

at least one second spring operable to apply a force to the second heat exchanger in the direction of the secondary device.

2. The apparatus of claim 1, wherein each of the first heat exchanger and the at least one second heat exchanger comprises a heatsink base and a fin structure.

3. The apparatus of claim 2, wherein the second spring is disposed between the first sink base and the at least one second heatsink base.

4. The apparatus of claim 3, wherein a thickness dimension of the primary device on the substrate is different than a thickness dimension of the at least one secondary device and the second spring is operable to be compressed a distance equivalent to a difference between a thickness difference of the first heatsink base and the at least one second heatsink base.

5. The apparatus of claim 2, wherein the first heatsink base comprises a first thickness in an area corresponding to the first device and in an area adjacent the opening comprises a second thickness that is less than the first thickness.

6. The apparatus of claim 2, wherein the at least one second spring is disposed across a dimension of the fin structure of the at least one second heat exchanger.

7. The apparatus of claim 6, wherein a thickness dimension of the primary device on the substrate is different than a thickness dimension of the at least one secondary device and the second spring is operable to displace the second heatsink toward the at least one secondary device.

8. The apparatus of claim 7, wherein the thickness dimension of the primary device on the substrate is greater than a height dimension of the at least one secondary device.

9. The apparatus of claim 2, wherein the heatsink base of the first heat exchanger has a thickness selected to justify the heatsink base with the primary device.

10. An apparatus comprising:

a passive heat exchanger having dimensions operable for disposition on a multi-chip package, the passive heat exchanger comprising;

a first portion having a first area with an opening therein;

a second portion having dimension operable for disposal in the opening; and

a spring operable to apply a force to the second portion.

11. The apparatus of claim 10, wherein each of the first portion and the second portion of the heat exchanger comprises a heatsink base and a fin structure.

12. The apparatus of claim 11, wherein the spring is disposed between the first sink base and the at least one second heatsink base.

13. The apparatus of claim 12, wherein a thickness dimension of the first heatsink base is different than a thickness dimension of the at least one second heatsink base.

14. The apparatus of claim 13, wherein the thickness dimension of the at least one second heatsink base is less than the thickness dimension of the first heatsink base.

15. The apparatus of claim 11, wherein the at least one spring is disposed across a dimension of the fin structure of the at least one second portion.

16. The apparatus of claim 11, wherein the heatsink base of the first portion has a thickness operable to justify the heatsink base with a device in a multi-chip package comprising the greatest heat generation.

17. A method comprising:

placing a passive heat exchanger on a multi-chip package, the passive heat exchanger comprising;

a first portion having a first area disposed on a primary device, the first portion having at least one opening over an area corresponding to at least one secondary device;

a second portion having dimension operable for disposal in the at least one opening; and

deflecting a spring to apply a force to the second portion of the passive heat exchanger in a direction of the at least one secondary device.

18. The method of claim 17, wherein each of the first portion and the second portion of the heat exchanger comprises a heatsink base and a fin structure and the spring is disposed between the first sink base and the at least one second heatsink base.

19. The method of claim 17, wherein each of the first portion and the second portion of the heat exchanger comprises a heatsink base and a fin structure and the spring is disposed across a dimension of the fin structure of the second portion of the heat exchanger.

20. The method of claim 17, wherein each of the first portion and the second portion of the heat exchanger comprises a heatsink base and a fin structure and the heatsink base of the first portion has a thickness operable to justify the heatsink base with the primary device.

21. A multi-chip package assembly made by the method of claim 17.