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LIGHT EMITTING DIODE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

  • US 20160276543A1
  • Filed: 03/18/2016
  • Published: 09/22/2016
  • Est. Priority Date: 03/18/2015
  • Status: Active Grant
First Claim
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1. A light emitting diode package structure, comprising:

  • a carrier substrate having a first conductive pad and a second conductive pad;

    a protecting component disposed on the carrier substrate and having a first electrode and a second electrode, wherein the first electrode and the second electrode are electrically connected to the first conductive pad and the second conductive pad respectively; and

    a light-emitting diode (LED) disposed above the electrostatic protection component and having a third electrode and a fourth electrode, wherein the third electrode and the fourth electrode are electrically connected to the first conductive pad and the second conductive pad respectively.

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