LIGHT EMITTING DIODE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
First Claim
1. A light emitting diode (LED), comprising:
- a substrate having an upper surface and a lower surface positioned oppositely, and a lateral surface connecting the upper surface and the lower surface;
an electrode pattern at least comprising;
two first conducting portions separately disposed on the upper surface of the substrate;
two second conducting portions separately disposed on the lower surface of the substrate; and
two conducting holes separately penetrating through the substrate, wherein each of the conducting holes connects one of the first conducting portions and one of the second conducting portions, and the conducting holes are exposed on the lateral surface of the substrate;
a chip having a first surface and a second surface positioned oppositely, wherein the second surface of the chip is disposed on the two first conducting portions;
an encapsulation layer covering the upper surface of the substrate, the encapsulation layer encapsulating the chip and exposing the first surface of the chip; and
a fluorescent layer disposed on the first surface of the chip.
3 Assignments
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Accused Products
Abstract
An edge lighting light emitting diode (LED) structure and a method of manufacturing the same are provided. The edge lighting LED structure includes a substrate, an electrode pattern, a chip, an encapsulation layer and a fluorescent layer. The electrode pattern at least includes two first conducting portions separately disposed on an upper surface of the substrate, two second conducting portions separately disposed on a lower surface of the substrate, and two conducting holes separately vertically penetrating through the substrate, each conducting hole connects a first conducting portion and a second conducting portion, and the conducting holes are exposed on a lateral surface of the substrate. A second surface of the chip is disposed on the first conducting portions. A top surface of the encapsulation layer exposes and is aligned with the first surface of the chip. The fluorescent layer covers a first surface of the chip.
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Citations
20 Claims
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1. A light emitting diode (LED), comprising:
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a substrate having an upper surface and a lower surface positioned oppositely, and a lateral surface connecting the upper surface and the lower surface; an electrode pattern at least comprising; two first conducting portions separately disposed on the upper surface of the substrate; two second conducting portions separately disposed on the lower surface of the substrate; and two conducting holes separately penetrating through the substrate, wherein each of the conducting holes connects one of the first conducting portions and one of the second conducting portions, and the conducting holes are exposed on the lateral surface of the substrate; a chip having a first surface and a second surface positioned oppositely, wherein the second surface of the chip is disposed on the two first conducting portions; an encapsulation layer covering the upper surface of the substrate, the encapsulation layer encapsulating the chip and exposing the first surface of the chip; and a fluorescent layer disposed on the first surface of the chip. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method for manufacturing a light emitting diode (LED), comprising:
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providing a substrate, the substrate having an upper surface and a lower surface positioned oppositely, the substrate comprising a plurality of unit regions; forming an electrode pattern at the substrate, wherein, corresponding to each of the unit regions, the electrode pattern at least comprising; two first conducting portions separately disposed on the upper surface of the substrate; two second conducting portions separately disposed on the lower surface of the substrate; and two conducting holes separately penetrating through the substrate, wherein each of the conducting holes connects one of the first conducting portions and one of the second conducting portions; separately disposing a plurality of chips on the upper surface of the substrate, wherein each chip in each of the unit regions has a first surface and a second surface positioned oppositely, and the second surface of the chip is disposed on the two first conducting portions; forming an encapsulating material on the upper surface of the substrate, wherein a top surface of the encapsulation layer exposes the first surfaces of the chips; coating a fluorescent material on the first surface of the chip in each of the unit regions; and dicing the encapsulation layer, the conducting holes and the substrate to form a plurality of LEDs which are separated from each other, wherein the conducting holes of each of the LEDs have junctions extend from the first conducting portions to the second conducting portions, the junctions are exposed on a lateral surface of the substrate which connects the upper surface and the lower surface, and the junctions are aligned with the lateral surface. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification