LIGHT EMITTING COMPONENT

• US 20160276554A1
• Filed: 05/30/2016
• Published: 09/22/2016
• Est. Priority Date: 06/12/2014
• Status: Active Grant

• Current Assignee: Nichia Corporation
• Original Assignee: Genesis Photonics Inc.
• Inventors: Huang, Kuan-Chieh, Ting, Shao-Ying, Huang, Jing-En, Huang, Yi-Ru
• Granted Patent: US 9,831,399 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

A light emitting component includes a light emitting unit, a molding compound and a wavelength converting layer. The light emitting unit has a forward light emitting surface. The molding compound covers the light emitting unit. The wavelength converting layer is disposed above the molding compound. The wavelength converting layer has a first surface and a second surface opposite to the first surface, wherein the first surface is located between the forward light emitting surface and the second surface, and at least one of the first and second surfaces is non-planar.

Claims

1. A light emitting component, comprising:

a light transmissive substrate comprising a wavelength converting layer and a resin layer formed on the wavelength converting layer;

a light emitting unit attached to the light transmissive substrate, wherein the light emitting unit has a forward light emitting surface facing to the light transmissive substrate and has electrodes arranged on one surface opposite to the forward light emitting surface; and

a reflective layer covering the light emitting unit and a portion of the light transmissive substrate, and at least exposing the electrodes of the light emitting unit, wherein an interface between the wavelength converting layer and the resin layer is non-planar.

2. The light emitting component of claim 1, wherein the light emitting component has a flat side surface comprising the reflective layer and the light transmissive substrate.

3. The light emitting component of claim 1, wherein the reflective layer further exposes an area located between the electrodes.

4. The light emitting component of claim 1, wherein a height of the reflective layer is larger than or equal to a height of the light emitting unit.

5. A light emitting component, comprising:

a wavelength converting layer;

a light emitting unit disposed on the wavelength converting layer, wherein the light emitting unit has a forward light emitting surface facing to the wavelength converting layer;

a reflective layer disposed on at least a portion of a side light emitting surface of the light emitting unit around the forward light emitting surface, and at least exposing electrodes of the light emitting unit; and

a molding compound, at least covering the forward light emitting surface, disposed between the wavelength converting layer and the light emitting unit, wherein a surface of the molding compound is non-planar.

6. The light emitting component of claim 5, wherein the light emitting component has a flat side surface comprising the reflective layer and the wavelength converting layer.

7. The light emitting component of claim 5, wherein the reflective layer further exposes an area located between the electrodes.

8. The light emitting component of claim 5, wherein a height of the reflective layer is larger than or equal to a height of the light emitting unit.

9. A light emitting component, comprising:

a light transmissive substrate comprising a wavelength converting layer and a light guiding member;

a light emitting unit disposed on the light transmissive substrate, wherein the light emitting unit has a forward light emitting surface facing to the wavelength converting layer; and

a molding compound disposed on the light transmissive substrate and covering at least a portion of a side light emitting surface of the light emitting unit and at least exposing electrodes of the light emitting unit,

wherein a surface of the wavelength converting layer is non-planar.

10. The light emitting component of claim 9, wherein the light emitting component has a flat side surface comprising the molding compound and the light transmissive substrate.

11. The light emitting component of claim 9, wherein the molding compound further exposes an area located between the electrodes.

12. The light emitting component of claim 9, wherein a height of the molding compound is larger than or equal to a height of the light emitting unit.