ELECTROMAGNETIC-WAVE-ABSORBING HEAT DISSIPATION SHEET

• US 20160279900A1
• Filed: 11/12/2014
• Published: 09/29/2016
• Est. Priority Date: 11/14/2013
• Status: Abandoned Application

• Current Assignee: JNC Corporation (Chisso Corporation), JNC Petrochemical Corporation (Chisso Corporation)
• Original Assignee: JNC Corporation (Chisso Corporation), JNC Petrochemical Corporation (Chisso Corporation)
• Inventors: FUJIWARA, TAKESHI, YADA, YUKITO
• Application Number:
  US15/036,066
• Publication Number:
  US 20160279900A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: B32B 15/08 of synthetic resin
• CPC Class Codes: B32B 15/18 comprising iron or steel B32B15/011, B32B15/012 and B32B15/013 take precedence
• CPC Class Codes: B32B 15/20 comprising aluminium or copper B32B15/016 and B32B15/017 take precedence
• CPC Class Codes: B32B 2307/302 Conductive
• CPC Class Codes: B32B 27/30 comprising vinyl (co)polymers; comprising acrylic (co)polymers
• CPC Class Codes: B32B 7/12 using interposed adhesives or interposed materials with bonding properties
• CPC Class Codes: B32B 9/007 comprising carbon, e.g. graphite, composite carbon
• CPC Class Codes: B32B 9/045 of synthetic resin
• CPC Class Codes: C09J 129/14 Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols
• CPC Class Codes: H01L 23/373 Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
• CPC Class Codes: H01L 23/3735 Laminates or multilayers, e.g. direct bond copper ceramic substrates
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 9/0083 comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers H05K9/0086 takes precedence
• CPC Class Codes: H05K 9/0084 comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
• CPC Class Codes: H05K 9/0088 comprising a plurality of shielding layers; combining different shielding material structure

Abstract

A problem is to provide an electromagnetic wave-absorbing and heat-dissipating sheet having high thermal conductivity and a complex function of absorbing electromagnetic waves, and to provide electronic equipment.

A solution is an electromagnetic wave-absorbing and heat-dissipating sheet, including at least one electromagnetic wave-absorbing layer including an electromagnetic wave absorbing material, at least one graphite layer formed of a graphite sheet, and at least one metal layer, wherein the graphite layer and other layers are adhered using an adhesive layer composed of a composition a containing polyvinyl acetal resin.

Claims

1. An electromagnetic wave-absorbing and heat-dissipating sheet, comprising at least one electromagnetic wave-absorbing layer including an electromagnetic wave-absorbing material, at least one graphite layer formed of a graphite sheet, and at least one metal layer, wherein the graphite layer and other layers are adhered using an adhesive layer composed of a composition containing a polyvinyl acetal resin.

2. The electromagnetic wave-absorbing and heat-dissipating sheet according to claim 1, wherein the electromagnetic wave-absorbing layer is a mixture of the electromagnetic wave-absorbing material and the resin.

3. The electromagnetic wave-absorbing and heat-dissipating sheet according to claim 1, wherein the electromagnetic wave-absorbing material is a soft magnetic material or ferrite.

4. The electromagnetic wave-absorbing and heat-dissipating sheet according to claim 1, wherein the electromagnetic wave absorbing material is any one of kind selected from the group of Permalloy, Sendust, silicon steel, alloy Alperm, Permendur and electromagnetic stainless steel, or a mixture of two or more kinds thereof.

5. The electromagnetic wave-absorbing and heat-dissipating sheet according to claim 1, wherein the metal layer includes copper, aluminum, magnesium or titanium.

6. The electromagnetic wave-absorbing and heat-dissipating sheet according to claim 1, wherein the polyvinyl acetal resin forming the adhesive layer includes the following constitutional units A, B and C:

7. The electromagnetic wave-absorbing and heat-dissipating sheet according to claim 6, wherein the polyvinyl acetal resin further includes the following constitutional unit D:

8. The electromagnetic wave-absorbing and heat-dissipating sheet according to claim 1, wherein thermal conductivity of the graphite layer in a plane direction is 300 to 2,000 W/m·

K.

9. The electromagnetic wave-absorbing and heat-dissipating sheet according to claim 1, wherein a thickness of the adhesive layer is 5 micrometers or less.

10. An electronic equipment, wherein the electromagnetic wave-absorbing and heat-dissipating sheet according to claim 1 is thermally brought into contact with a heating unit.