LASER WELDING METHOD

• US 20160288259A1
• Filed: 06/14/2016
• Published: 10/06/2016
• Est. Priority Date: 12/19/2013
• Status: Active Grant

• Current Assignee: Fuji Electric Company Limited (Fuji Electric Systems Company Limited)
• Original Assignee: Fuji Electric Company Limited (Fuji Electric Systems Company Limited)
• Inventors: TAMAI, Yuta
• Granted Patent: US 10,442,035 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: B23K 2101/34 Coated articles , e.g. plated or painted; Surface treated articles
• CPC Class Codes: B23K 2101/35 Surface treated articles
• CPC Class Codes: B23K 2101/42 Printed circuits
• CPC Class Codes: B23K 2103/08 Non-ferrous metals or alloys
• CPC Class Codes: B23K 2103/10 Aluminium or alloys thereof
• CPC Class Codes: B23K 2103/12 Copper or alloys thereof
• CPC Class Codes: B23K 2103/16 Composite materials , e.g. fibre reinforced
• CPC Class Codes: B23K 2103/172 wherein at least one of the layers is non-metallic
• CPC Class Codes: B23K 2103/50 Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
• CPC Class Codes: B23K 26/0006 taking account of the properties of the material involved B23K26/32, B23K26/40 take precedence
• CPC Class Codes: B23K 26/037 by pressing on the workpiece, e.g. pressing roller foot
• CPC Class Codes: B23K 26/0622 by shaping pulses
• CPC Class Codes: B23K 26/206 Laser sealing
• CPC Class Codes: B23K 26/211 with interposition of special material to facilitate connection of the parts
• CPC Class Codes: B23K 26/22 Spot welding
• CPC Class Codes: B23K 26/32 taking account of the properties of the material involved
• CPC Class Codes: H01L 21/4846 Leads on or in insulating or insulated substrates, e.g. metallisation H01L21/4821 takes precedence; metallisation of ceramics in general C04B41/51; printed circuits H05K3/00
• CPC Class Codes: H01L 2224/291 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/29101 the principal constituent melting at a temperature of less than 400°C
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 : the item being metallic
• CPC Class Codes: H01L 2224/33181 : On opposite sides of the body
• CPC Class Codes: H01L 2224/37124 : Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/37138 : the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
• CPC Class Codes: H01L 2224/37147 : Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/3718 : Molybdenum [Mo] as principal constituent
• CPC Class Codes: H01L 2224/37184 : Tungsten [W] as principal constituent
• CPC Class Codes: H01L 2224/37187 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2224/3754 : Coating
• CPC Class Codes: H01L 2224/37638 : the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
• CPC Class Codes: H01L 2224/37655 : Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/37663 : the principal constituent melting at a temperature of greater than 1550°C
• CPC Class Codes: H01L 2224/40137 : the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/40499 : Material of the auxiliary connecting means
• CPC Class Codes: H01L 2224/48227 : connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 : Layer and wire connectors
• CPC Class Codes: H01L 2224/75261 : Laser
• CPC Class Codes: H01L 2224/7555 : Mechanical means, e.g. for planarising, pressing, stamping
• CPC Class Codes: H01L 2224/83224 : using a laser
• CPC Class Codes: H01L 2224/834 : with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/83801 : Soldering or alloying
• CPC Class Codes: H01L 2224/83895 : between electrically conductive surfaces, e.g. copper-copper direct bonding, surface activated bonding
• CPC Class Codes: H01L 23/049 : the other leads being perpendicular to the base
• CPC Class Codes: H01L 23/3735 : Laminates or multilayers, e.g. direct bond copper ceramic substrates
• CPC Class Codes: H01L 24/00 : Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
• CPC Class Codes: H01L 24/29 : of an individual layer connector
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/33 : of a plurality of layer connectors
• CPC Class Codes: H01L 24/37 : of an individual strap connector
• CPC Class Codes: H01L 24/40 : of an individual strap connector
• CPC Class Codes: H01L 24/75 : Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 24/84 : using a strap connector
• CPC Class Codes: H01L 24/92 : Specific sequence of method steps
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01042 : Molybdenum [Mo]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/013 : Alloys
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/04642 : SiC
• CPC Class Codes: H01L 2924/1203 : Rectifying Diode
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/13055 : Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19107 : off-chip wires
• CPC Class Codes: H01L 2924/40102 : being pulsed

Abstract

A laser welding method using a laser welding jig having a plurality of pressing parts, includes a step of placing a second member on a first member; a step of pressing the second member with the plurality of pressing parts in a direction toward the first member to thereby form a gap between the first member and the second member at most 300 μm; and a first welding step of laser-welding the first member and the second member by irradiating on a surface of the second member at a location between the pressing parts with laser light while conducting the step of pressing.

Claims

1. A laser welding method using a laser welding jig having a plurality of pressing parts, comprising:

a step of placing a second member on a first member;

a step of pressing the second member with the plurality of pressing parts in a direction toward the first member to thereby form a gap between the first member and the second member at most 300 μ

m; and

a first welding step of laser-welding the first member and the second member by irradiating on a surface of the second member at a location between the pressing parts with laser light while conducting the step of pressing.

2. The laser welding method according to claim 1 further comprising a second welding step of laser-welding the first member and the second member at a region with a gap between the first member and the second member of at most 300 μ

m after the first welding step.

3. The laser welding method according to claim 2, wherein a distance between centers of welding portions at the first and second welding steps is at most 4 mm.

4. The laser welding method according to claim 2, further comprising a step of forming engaging parts on the first member and the second member, for positioning the first member and the second member,

wherein a portion of laser welding is different from the engaging parts.

5. The laser welding method according to claim 1, further comprising:

a step of preparing a semiconductor device that comprises a ceramic insulated substrate, a front surface conductor pattern fixed on a front surface of the ceramic insulated substrate, a semiconductor chip electrically connected to the front surface conductor pattern, the first member electrically connected to the semiconductor chip, and the second member laser-welded to the first member at at least one portion to electrically connect thereto, and

a step of sealing the ceramic insulated substrate, the front surface conductor pattern, the semiconductor chip, and a part of the first member with a sealing material before the step of placing the second member on the first member.