ELECTROMECHANICAL DEVICE AND METHOD OF FABRICATING THE SAME
First Claim
1. A method of fabricating an electromechanical device, the method comprising:
- providing a first wafer;
forming a circuit arrangement on a first surface of the first wafer;
forming a first electrode on a second surface of the first wafer;
forming a first via structure from the first surface of the first wafer to the second surface of the first wafer, the first via structure electrically connecting the first electrode with the circuit arrangement;
forming a second via structure from the first surface of the first wafer to the second surface of the first wafer, the second via structure electrically connecting the circuit arrangement;
providing a second wafer;
forming a suspended structure on a first surface of the second wafer with a spacing formed between the suspended structure and a second surface of the second wafer;
forming a second electrode on the suspended structure;
forming an interconnect structure on the first surface of the second wafer, the interconnect structure electrically connecting the second electrode;
bonding the first wafer to the second wafer with the second surface of the first wafer facing the first surface of the second wafer, the second via structure electrically connecting the interconnect structure, and the first electrode and the second electrode forming a capacitive structure.
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Accused Products
Abstract
An electromechanical device and method of fabrication thereof comprising: providing a first wafer with a circuit arrangement on a first surface thereof and a first electrode on a second surface thereof; forming first and second via structures from the first surface to the second surface of the first wafer, said first via electrically connecting the first electrode with the circuit arrangement; providing a second wafer with a suspended structure on a first surface thereof; forming a second electrode on the suspended structure; forming an interconnect structure on the first surface of the second wafer that electrically connects with the second electrode; bonding the first wafer to the second wafer with the second surface of the first wafer facing the first surface of the second wafer, with the second via structure electrically connecting the circuit arrangement to the interconnect structure, and the first and second electrodes forming a capacitive structure.
33 Citations
20 Claims
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1. A method of fabricating an electromechanical device, the method comprising:
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providing a first wafer; forming a circuit arrangement on a first surface of the first wafer; forming a first electrode on a second surface of the first wafer; forming a first via structure from the first surface of the first wafer to the second surface of the first wafer, the first via structure electrically connecting the first electrode with the circuit arrangement; forming a second via structure from the first surface of the first wafer to the second surface of the first wafer, the second via structure electrically connecting the circuit arrangement; providing a second wafer; forming a suspended structure on a first surface of the second wafer with a spacing formed between the suspended structure and a second surface of the second wafer; forming a second electrode on the suspended structure; forming an interconnect structure on the first surface of the second wafer, the interconnect structure electrically connecting the second electrode; bonding the first wafer to the second wafer with the second surface of the first wafer facing the first surface of the second wafer, the second via structure electrically connecting the interconnect structure, and the first electrode and the second electrode forming a capacitive structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. An electromechanical device comprising:
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a first wafer having a first surface and a second surface opposite the first surface; a circuit arrangement on the first surface of the first wafer; a first electrode on the second surface of the first wafer; a first via structure extending from the first surface of the first wafer to the second surface of the first wafer, the first via structure electrically connecting the first electrode with the circuit arrangement; a second via structure extending from the first surface of the first wafer to the second surface of the first wafer, the second via structure electrically connecting with the circuit arrangement; a second wafer bonded to the first wafer, the second wafer having a first surface and a second surface opposite the first surface; a suspended structure on the first surface of the second wafer with a spacing between the suspended structure and the second surface of the second wafer; a second electrode on the suspended structure; an interconnect structure on the first surface of the second wafer, the interconnect structure electrically connecting the second electrode; wherein the first wafer is bonded to the second wafer with the second surface of the first wafer facing the first surface of the second wafer, the second via structure electrically connecting the interconnect structure and the first electrode and the second electrode forming a capacitive structure. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification