SILICONE ADHESIVE COMPOSITION AND SOLID-STATE IMAGING DEVICE

• US 20160289519A1
• Filed: 11/10/2014
• Published: 10/06/2016
• Est. Priority Date: 11/12/2013
• Status: Active Grant

• Current Assignee: Shin-Etsu Chemical Company Limited
• Original Assignee: Shin-Etsu Chemical Company Limited
• Inventors: YASUDA, Hiroyuki, SOGA, Kyoko, SUGO, Michihiro
• Granted Patent: US 9,796,892 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: C08G 77/04 Polysiloxanes
• CPC Class Codes: C08G 77/08 characterised by the catalysts used
• CPC Class Codes: C08G 77/12 containing silicon bound to hydrogen C08G77/045 takes precedence
• CPC Class Codes: C08G 77/20 containing silicon bound to unsaturated aliphatic groups C08G77/045 takes precedence
• CPC Class Codes: C08K 5/56 Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
• CPC Class Codes: C08L 83/00 Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
• CPC Class Codes: C09J 183/04 Polysiloxanes
• CPC Class Codes: H01L 2224/0519 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 23/14 characterised by the material or its electrical properties printed circuit boards H05K1/00
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/1462 Coatings

Abstract

The purpose of the present invention is to provide an adhesive composition using a silicone polymer compound, which does not require exposure, baking and development processes for the production, thereby making the production cost low and making the productivity high, which has good characteristics such as good adhesiveness, good hermetic sealing properties after thermal curing and low moisture absorption that are required for adhesives, which provides a cured film having high reliabilities such as high heat resistance and high light resistance, and which is capable of suppressing warping of a bonded substrate after back grinding that is necessary in the three-dimensional mounting production. A silicone adhesive composition which contains: (A) an organopolysiloxane containing a non-aromatic saturated monovalent hydrocarbon group and an alkenyl group; (B) an organohydrogenpolysiloxane containing two or more SiH groups in each molecule in such an amount that the molar ratio of the SiH groups in the component (B) is 0.5-10 relative to the alkenyl groups in the component (A); and (C) an effective amount of a platinum-based catalyst.

Claims

1. A silicone adhesive composition comprising

(A) an organopolysiloxane containing a non-aromatic saturated monovalent hydrocarbon group and an alkenyl group,

(B) an organohydrogenpolysiloxane containing at least two SiH groups per molecule in such an amount that a molar ratio of SiH groups in component (B) to alkenyl groups in component (A) may be in a range of 0.5/1 to 10/1, and

(C) an effective amount of a platinum-based catalyst,

said organopolysiloxane (A) containing a non-aromatic saturated monovalent hydrocarbon group is (A-1) an organopolysiloxane comprising the following units (I) to (III) and having a weight average molecular weight of 2,000 to 60,000, or (A-2) an organopolysiloxane having a weight average molecular weight of 20,000 to 400,000, obtained from hydrosilylation reaction of the organopolysiloxane (A-1) with at least one organohydrogenpolysiloxane having the general formula (1) in such amounts that a molar ratio of total SiH groups in the organohydrogenpolysiloxane to total alkenyl groups in the organopolysiloxane (A-1) may be in a range of 0.4/1 to 0.8/1, to achieve a molecular weight buildup,

(I) 50 to 99 mol % of siloxane units (T units) of the formula:

R¹SiO_3/2,

(II) 0 to 49 mol % of siloxane units (D units) of the formula;

R²R³SiO_2/2, and

(III) 1 to 15 mol % of siloxane units (M units) of the formula;

R⁴₃SiO_1/2,

wherein R¹ to R³ each are a monovalent organic group, 2 to 10 mol % of the overall organic groups represented by R¹ to R³ are alkenyl groups of 2 to 7 carbon atoms, at least 40 mol % of the overall organic groups represented by R¹ to R³, which may be the same or different, are non-aromatic saturated monovalent hydrocarbon groups of 5 to 10 carbon atoms containing any one of the following cyclic structures;

2. The adhesive composition of claim 1, further comprising (D) a reaction inhibitor.

3. The adhesive composition of claim 1 or 2, further comprising (E) an antioxidant.

4. The adhesive composition of claim 1, further comprising (F) an organic solvent.

5. The adhesive composition of claim 4 wherein the organic solvent (F) is a hydrocarbon solvent having a boiling point of 120 to 240°

C.

6. The adhesive composition of claim 1, which is sandwiched between a protective glass substrate and a substrate which is selected from the group consisting of a silicon wafer, solid-state imaging device silicon wafer, plastic substrate, ceramic substrate, and metallic circuit substrate.

7. A solid-state imaging device comprising a laminate including a substrate which is selected from the group consisting of a silicon wafer, solid-state imaging device silicon wafer, plastic substrate, ceramic substrate, and metallic circuit substrate, on which a cured layer of the adhesive composition of claim 1, and a protective glass substrate are stacked in order.