MULTILAYER STRUCTURE FOR CAPACITIVE PRESSURE SENSING

• US 20160290878A1
• Filed: 04/02/2015
• Published: 10/06/2016
• Est. Priority Date: 04/02/2015
• Status: Active Grant

• Current Assignee: TactoTek Oy
• Original Assignee: TactoTek Oy
• Inventors: SEVERINKANGAS, Kari, HEIKKINEN, Mikko, SAASKI, Jarmo
• Granted Patent: US 10,234,340 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: A61B 5/1038 Measuring plantar pressure during gait
• CPC Class Codes: A61B 5/112 Gait analysis
• CPC Class Codes: A61B 5/6807 Footwear
• CPC Class Codes: G01L 1/146 for measuring force distributions, e.g. using force arrays G01L1/148 takes precedence
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/10037 Printed or non-printed battery
• CPC Class Codes: H05K 2201/10098 Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
• CPC Class Codes: H05K 2201/10151 Sensor
• CPC Class Codes: H05K 2203/1305 Moulding and encapsulation
• CPC Class Codes: H05K 3/10 in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence

Abstract

A multilayer structure for a garment, optionally footwear, includes a flexible substrate film for accommodating electronics, a number of flexible sensor pads provided on the film utilizing printed electronics technology, optionally screen printing or ink jetting, at least one electronic circuit, preferably integrated circuit, further provided on the film for controlling capacitive measurements via the number of sensor pads for obtaining an indication of pressure subjected to the multilayer structure, a number of conductor traces further printed on the film for electrically connecting the at least one electronic circuit and the number of capacitive sensor pads, a power supply element for powering electricity-driven components including the at least one electronic circuit, and at least one plastic layer molded upon the film substantially embedding the number of sensor pads, conductor traces and the at least one electronic circuit therewithin. A related method of manufacture is presented.

Claims

1. A multilayer structure for a garment, comprising

a flexible substrate film for accommodating electronics,

a number of flexible sensor pads provided on the film utilizing printed electronics technology, optionally screen printing or ink jetting,

at least one electronic circuit, preferably integrated circuit, further provided on the film for controlling capacitive measurements via the number of sensor pads for obtaining an indication of pressure subjected to the multilayer structure,

a number of conductor traces further printed on the film for electrically connecting the at least one electronic circuit and the number of capacitive sensor pads,

a power supply element for powering electricity-driven components including the at least one electronic circuit, and

at least one plastic layer molded upon the film substantially embedding the number of sensor pads, conductor traces and the at least one electronic circuit therewithin.

2. The structure of claim 1, configured to monitor the capacitance between at least one of the pads and external conductive element, optionally the sole of the user, placed upon the structure and functionally forming a capacitor with said at least one of the pads.

3. The structure of claim 1, wherein said number of flexible sensor pads comprises a plurality of sensor pads defining at least a substantially two-dimensional configuration, optionally substantially planar configuration of pads over the substrate film, so as to enable positioning the pressure indication.

4. The structure of claim 1, wherein a pad of said number of pads is provided with a plurality of electrodes so as to enable positioning the pressure indication within a sensor area defined by the pad.

5. The structure of claim 1, wherein the at least one electronic circuit comprises an integrated circuit, optionally incorporating a microcontroller, a microprocessor, a programmable logic chip or a signal processor.

6. The structure of claim 1, wherein the at least one electronic circuit comprises memory for storing measured data or data derived therefrom.

7. The structure of claim 1, wherein the at least one electronic circuit comprises a data interface for communication with an external electronic element.

8. The structure of claim 1, wherein the power supply element comprises at least one element selected from the group consisting of:

a battery, disposable battery, replaceable battery, connector for a battery, connector for coupling with external power supply, energy harvesting element, and piezoelectric transducer.

9. The structure of claim 1, wherein at least part of the electronics of said at least one electronic circuit defines and has been provided as a sub-assembly with an initially separate substrate.

10. The structure of claim 1, further comprising an initial plastic layer molded upon at least part of the electronics of said at least one electronic circuit to protect said at least part of the electronics embedded therewithin during the molding of said at least one plastic layer.

11. A garment comprising the structure of claim 1.

12. The garment of claim 11, being a compression garment.

13. The garment of claim 11, being footwear.

14. A method for manufacturing a multilayer structure for a garment, optionally footwear or compression garment, comprising

obtaining a flexible substrate film for accommodating electronics,

printing a number of flexible sensor pads on the film utilizing printed electronics technology, optionally screen printing or ink jetting,

printing a number of conductor traces on the film for electrically connecting at least said sensor pads with an electronic circuit,

providing the electronic circuit, preferably integrated circuit, on the film for controlling capacitive measurements via the number of sensor pads for obtaining an indication of pressure subjected to the multilayer structure,

providing a power supply element for supplying electricity-driven components including the electronic circuit with electricity, and

molding at least one plastic layer upon the film substantially embedding the number of sensor pads, conductor traces and the at least one electronic circuit therewithin.